The invention provides a method for metallizing and electroplating only a hole wall. The method comprises the following steps of coating a material of a sparse-hole metallization active substance on a copper-clad plate to mask the plate surface, drilling a hole, only activating the hole wall, and only directly electroplating or firstly carrying out chemical plating and then electroplating the hole wall to the required thickness. The material adopted by the invention has the performance of the sparse-hole metallization active substance, the plate surface is masked, metal is only deposited on the hole wall, the thickness of a plating layer is easy to control, the quality of the metallization hole is better, the circuit board can better meet the electrical requirements, finer conductive patterns can be manufactured, the cost is reduced, and the method is environment-friendly. The method is suitable for mass production of various circuit boards, and is further suitable for small-batch and multi-variety production of circuit board samples.