Large-makeup high-ounce copper solder resist one-time printing ink process

A technology of solder mask ink and ink, applied in printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of ink bubbles, ink falling off, not suitable for large-scale imposition, etc., and achieve high production efficiency and good finished products. High rate, the effect of solving the problem of line ink bubbles and ink shedding

Pending Publication Date: 2020-10-13
KUNSHAN DAYANG PRINTED CIRCUIT BOARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this silk screen printing process does not adjust the fluidity and air bubbles of the ink, and there will still be problems such as ink bubbles and ink drop-off between lines during the silk screen printing process, which is not suitable for large imposition high-ounce copper solder mask printing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Embodiment 1 provides a large imposition high-ounce copper solder mask one-time printing ink process, which is characterized in that it includes the following steps:

[0043] Step S1. Preparation of solder mask ink: After mixing the components of solder mask ink evenly, use a high-speed disperser to stir at 900RPM / min at 55℃ for 1h, then stop stirring, grind to a fineness of less than 5μm, and filter with 300 mesh Screen filtering to prepare solder mask ink;

[0044] Step S2, one-time printing of solder mask: use 60 degree squeegee and 80 mesh screen printing with the solder mask indicated in step S1, adjust the horizontal angle of the squeegee and the screen, and grind the squeegee to ensure the ink thickness after printing Reach above 40μm;

[0045] Step S3, pre-baking, one-time exposure: First, dry the ink printed in step S2 to non-stick objects, and then use LED semi-automatic exposure machine to perform one-time exposure of the printed solder mask ink to ensure UV light ...

Embodiment 2

[0051] Embodiment 2 provides a large imposition high-ounce copper solder mask one-time printing ink process, which is basically the same as embodiment 1, except that the hyperbranched polyurethane acrylate, 2-vinyl-3H-4-quinolinazole The mass ratio of ketone, zeatin, [2-(triethoxysilyl)ethyl] vinyl ether, trifluoromethyl trifluorovinyl ether, photoinitiator, filler, defoamer, and diluent is 40 ∶3∶4∶5∶3∶0.9∶7∶1.5∶12; in step S2, the air pressure of the one-time printing of the solder mask is 6.5kg / cm 2 , The screen printing speed is 2.5m / min; the pre-bake temperature in step S3 is 67° C., and the time is 25 minutes; the exposure energy of one exposure in step S3 is 10.5 level.

Embodiment 3

[0053] Embodiment 3 provides a one-time printing ink process for large imposition high ounce copper solder mask, which is basically the same as embodiment 1, except that the hyperbranched polyurethane acrylate, 2-vinyl-3H-4-quinolinazole The mass ratio of ketone, zeatin, [2-(triethoxysilyl)ethyl] vinyl ether, trifluoromethyl trifluorovinyl ether, photoinitiator, filler, defoamer, and diluent is 42 :3.5∶4∶6∶3∶1∶8∶2∶15; in step S2, the air pressure of the one-time printing of the solder mask is 6.3~6.8kg / cm 2 , The screen printing speed is 2.4-2.8m / min; the pre-bake temperature in step S3 is 70° C., and the time is 30 minutes; the exposure energy of one exposure in step S3 is 11 levels.

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Abstract

The invention discloses a large-makeup high-ounce copper solder resist one-time printing ink process. The process comprises the following steps: S1, preparing solder resist ink; S2, performing soldermask primary printing; S3, performing pre-drying and carrying out primary exposure; and S4, performing developing and polishing. The large-makeup high-ounce copper solder resist one-time printing inkprocess is simple and easy to implement, short in process, high in production efficiency and low in production cost, the yield of produced finished products is high, the problems of circuit ink bubbles and ink falling can be effectively solved, and the quality and the grade of a PCB are improved.

Description

Technical field [0001] The invention belongs to the technical field of PCB production and processing, and in particular relates to a one-time printing ink process for large-sized high-ounce copper solder resist. Background technique [0002] PCB (Printed Circuit Board) is a commonly used component in electrical equipment. Generally, various components need to be mounted or plugged on the PCB to form electrical functional modules to realize various functions of electrical equipment. After the circuit on the PCB is completed, the solder mask ink needs to be screen printed on the surface to protect the circuit on the PCB and avoid short circuits between the pads when mounting components. [0003] With the rapid development of high-end manufacturing and the addition of new technologies and equipment such as CNC machinery, Al digital technology, and intelligent robots, electronic products are developing in the direction of "light, thin, short, and small", and the density of PCBs is also...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282H05K2203/0562
Inventor 计向东
Owner KUNSHAN DAYANG PRINTED CIRCUIT BOARD
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