Novel de-cap method of rigid-flex board
A new type of technology for flexible and rigid boards, applied in chemical/electrolytic methods to remove conductive materials, multi-layer circuit manufacturing, anti-corrosion parts, etc. Cleaning and other issues, to achieve the effect of protecting product quality, convenient operation, simple process
Inactive Publication Date: 2017-03-22
江苏弘信华印电路科技有限公司
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[0004] The disadvantages of the original technology are: printing and peelable adhesive curing - during the lamination pressure transmission process, the product will be deformed with the curing process of the peelable adhesive, and the...
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[0024] In order to make the technical solution of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings. Any solution obtained by equivalent replacement and conventional reasoning of the technical features of the technical solution of the present invention falls within the protection scope of the present invention.
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Abstract
The invention relates to a novel de-cap method of a rigid-flex board. The method includes the following steps that: (1) after the inner layer covering film of the rigid-flex board is bonded, and the inner layer covering film is covered with a layer of PP prepregs, a layer of cleanable printing ink is printed through screen printing at interdigital windows or grounding points , and a cleanable printing ink protection film is formed; (2) a copper-clad film is laminated and pressed, the copper-clad film is pressed for 3 hours under 180 DEC C; (3) drilling, electroplating, dry film attachment, exposure and development are carried out after pressing and molding; (4) etching processing is carried out by means of an acid etching solution after the development; and (5) an alkaline solution is adopted to carry out film removal after etching is completed, and the cleanable printing ink protection film is dissolved. The novel de-cap method of the invention has the advantages of simple process, convenient operation and cost-saving performance.
Description
technical field [0001] The invention relates to a method of uncovering, in particular to a method for uncovering a novel rigid-flex board. Background technique [0002] Now the types of soft-rigid combination boards are showing a trend of diversity. There are more and more types of openings for plugging or grounding at the inner layer of flexible boards of soft-rigid combination boards. Technology has also become a hot topic. [0003] The original technical process is: cutting of the inner soft board - drilling - pretreatment - dry film - exposure - development - etching circuit - cover film - printing peelable glue (a liquid ink, which acts as a protection after curing) or strip Paste high temperature resistant tape - pressure transmission of the outer laminated board. [0004] The disadvantages of the original technology are: printing and peelable adhesive curing - during the lamination pressure transmission process, the product will be deformed with the curing process o...
Claims
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Login to view more IPC IPC(8): H05K3/46H05K3/06
CPCH05K3/4691H05K3/06H05K2203/0562
Inventor 王俊涛
Owner 江苏弘信华印电路科技有限公司
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