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Flexible-rigid combined plate

A technology of flexible and rigid boards and substrates, which is applied in the direction of anti-corrosion parts, patterns and photolithography, printed circuit parts, etc., can solve the problems of line disconnection and bubble generation, and achieve the effect of avoiding bubbles

Inactive Publication Date: 2017-02-22
苏州市华扬电子有限公司
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  • Abstract
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Problems solved by technology

[0002] At present, the existing production method of soft and rigid board is to use the traditional dry film as the dielectric layer for exposure and circuit production; however, bubbles will be generated in the position where there is a difference in height when the dry film is pressed, and the circuit will be disconnected after etching.

Method used

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  • Flexible-rigid combined plate

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Embodiment Construction

[0008] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0009] see figure 1 , the embodiment of the present invention includes:

[0010] A kind of rigid-flex board, comprising: a substrate, a pure rubber layer, a copper foil layer and an ink layer; the pure rubber layer is arranged on the substrate, the copper foil layer is arranged on the pure rubber layer, and the ink layer Set on the copper foil layer, the ink layer is completely attached to the copper foil layer without air bubbles. The thickness of the ink layer is not less than 6 μm, which can achieve a good anti-etching effect, and the ink layer has very good flow leveling and drying properties. Dip coating ink is easy to use and operate, and...

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Abstract

The invention discloses a flexible-rigid combined plate, comprising a base plate, a pure rubber layer, a copper foil layer and an ink layer; the pure rubber layer is disposed on the base plate, the copper foil layer is arranged on the pure rubber layer, and the ink layer is arranged on the copper foil layer. In this way, high and low parts of the flexible-rigid combined plate can be avoided generating bubbles, such that circuit breaking is after etching avoided.

Description

technical field [0001] The invention relates to the field of rigid-flex boards, in particular to a rigid-flex board. Background technique [0002] At present, the existing production method of soft and rigid board is to use the traditional dry film as the dielectric layer for exposure and circuit production; however, bubbles will be generated in the position where there is a difference in height when the dry film is pressed, and the circuit will be disconnected after etching. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a rigid-flex board, which can effectively avoid air bubbles at the high and low positions of the rigid-flex board to prevent circuit disconnection after etching; it has a simple structure and is easy to process. [0004] In order to solve the above technical problems, a technical solution adopted by the present invention is to provide a rigid-flex board, comprising: a substrate, a pure rubber ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/02H05K2203/0562H05K2203/1377
Inventor 叶玉均
Owner 苏州市华扬电子有限公司
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