15results about "Lithography/patterning" patented technology

The invention discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent visual module, and the method comprises the steps: taking a copper layer, pasting a first dry film and a protection film respectively, making a window on the first dry film corresponding to a hollowed-out circuit pattern, and electroplating a tin layer to form a tin plate; a single-face copper-clad plate is taken, a circuit pattern is manufactured in the area corresponding to a tin layer, a copper-clad plate copper pattern is formed, and a first pattern plate is formed; correspondingly laminating the tin-plated plate and the first pattern plate to form a laminated plate; removing the protective film in the laminated plate, manufacturing a circuit pattern, forming a copper layer windowing pattern and a hollow circuit pattern, and forming a second pattern plate; removing an area, corresponding to the copper pattern of the copper-clad plate, of the insulating dielectric layer in the second pattern plate, then performing tin stripping processing, and performing post-process processing to hollowed out the circuit pattern to form a hollowed-out circuit so as to form the flexible circuit board; and the tin layer provides protection for etching, creates a release condition for a copper pattern of the copper-clad plate, lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention relates to the technical field of manufacturing of adhesives, new materials and printed circuit boards, in particular to an electromagnetic shielding function type electronic circuit board and a manufacturing method. An electronic circuit board with an electromagnetic shielding function comprises a core board with an inner layer circuit; the functional composite layer covers at least one surface of the core plate and comprises a dielectric layer and a metal material layer with the thickness of 0.1 nanometer to 5 micrometers; wherein the metal material layer is patterned, and is reserved in a preset shielding area to form an electromagnetic shielding layer; and the non-shielding region is removed, so that the dielectric layer exposed out of the region forms an insulating protection layer. According to the scheme, the flexible composite material with a thinner metal layer, a more simplified process and more diversified functions can be prepared.

Disclosed is a manufacturing method of a circuit board including the following steps: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.

A method for manufacturing a multi-layer circuit board including an extreme fine that may include: providing a board having one surface on at least a part of which an upper conductive layer is formed and the other surface on at least a part of which a lower conductive layer is formed; forming a lower metal layer on the other surface of the board; forming a first resist layer on the one surface of the board through a photolithography process, and forming a first opening on the first resist layer; forming a metal pillar by plating the first opening by using an electrolytic plating method; removing the first resist layer; forming an insulating layer on a location from which the first resist layer is removed; and evenly polishing the metal pillar and the insulating layer.

A method for forming conductive and stretchable traces on a substrate is disclosed. A photocurable ink is prepared by dispersing surface-modified liquid-metal particles in a solvent together with monomers, crosslinkers, dispersant, and photoinitiator. The ink is deposited onto a substrate and selectively exposed to patterned light to initiate photopolymerization and crosslinking of the functionalized particle surfaces, forming a patterned liquid-metal-polymer composite anchored to the substrate. Subsequent mechanical activation ruptures oxide shells surrounding the particles and allows the liquid-metal cores to merge into a continuous conductive layer that conforms to the projected pattern. The process operates under ambient conditions with low energy input and short exposure time, providing high-resolution, durable, and deformable conductive features suitable for wearable electronics, biointegrated sensors, and soft-robotic devices.

A circuit board and a method of fabricating the same are provided. The circuit board has a flexible insulation film and a circuit substrate with a bending part. The circuit substrate is a rigid board and includes a plurality of grooves which are distributed in the bending part. Each of the grooves extends to two opposite ends of the circuit substrate in a direction of long axis, and an opening of one of the grooves is exposed to the surface of the circuit substrate. The flexible insulation layer is disposed on the surface of the circuit substrate and covers the opening of the groove, while the groove is not filled with the flexible insulation layer.

The invention belongs to the field of PCB (printed circuit board) processing, and particularly relates to a method for producing and manufacturing a counterbore of a PCB. The method comprises the following steps: S1, drilling: drilling a counterbore in the PCB by using a counterbore drill; s2, burr polishing is carried out, specifically, burr polishing is carried out on a countersunk hole of the PCB, and countersunk burrs are removed; s3, drying the film, and forming a temporary protection image on the PCB through a film pasting-exposure-development process; s4, electroplating is conducted, specifically, the counterbore of the PCB is electroplated, and the electroplating process comprises PTH copper deposition, primary copper electroplating and secondary copper electroplating; s5, etching: etching the PCB, and removing the excess copper layer of the counterbore through chemical etching; s6, removing the film, removing the dry film remained after etching, and exposing the copper circuit; by adopting the process method, the production process, the production control and the quality control of the counterbore of the PCB can have a unified operation mode method and a control method, the production and quality problems can be effectively controlled, and the production quality of the counterbore is improved.

The invention belongs to the technical field of environmental area control, and particularly relates to an intelligent environmental area controller and a control method thereof.The intelligent environmental area controller comprises a suspension assembly which is installed at the top of a workbench and can drive a rotating and guiding device to rotate, and the center of the top of the rotating and guiding device is connected with the output end of the suspension assembly; according to the invention, the air around the lower end workbench can be driven to rotate in a vortex manner, the air at the lower end can be detected, static electricity can be eliminated, and meanwhile, the air can be wetted and replaced.

A direct imaging system includes an ultraviolet radiation source, which is configured to irradiate a first area, having a first width, of a layer of a photoreactive material on a substrate with patterned ultraviolet radiation. A thermal energy source is configured to heat a second area of the layer of the photoreactive material while the ultraviolet radiation source irradiates the first area. The second area contains a part of the first area and having a second width less than the first width.

The application discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent vision module, takes a copper layer and respectively pastes a first dry film and a protective film, a window is made on the first dry film corresponding to a hollow circuit pattern, a tin plating layer is formed, a tin plating plate is formed; a single-sided copper-clad plate is taken, a circuit pattern is made corresponding to the tin layer area, a copper pattern of the copper-clad plate is formed, a first pattern plate is formed; the tin plating plate is correspondingly pressed with the first pattern plate to form a pressed plate; the protective film in the pressed plate is removed, a circuit pattern is made, a copper layer window pattern and a hollow circuit pattern are formed, and a second pattern plate is formed; the area corresponding to the copper pattern of the copper-clad plate of the insulating medium layer in the second pattern plate is removed, then tin removal processing is performed, after processing, the hollow circuit pattern forms a hollow circuit, and a flexible circuit board is formed; the tin layer provides protection for etching, creates a release condition for the copper pattern of the copper-clad plate, and lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

A circuit board with embedded elements and a method for fabricating the same are provided. The circuit board with embedded elements includes a circuit substrate, a conductive structure, an electronic component and a thermoplastic insulation layer. The conductive structure is embedded in and electrically connected to the circuit substrate, while the conductive structure has a trench. The electronic component is disposed inside this trench and electrically connected to the conductive structure. The thermoplastic insulation layer covers the electronic component and the inner wall of the trench, and the surface of the thermoplastic insulation layer is flush with the surface of the circuit substrate. The heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.

The present application relates to a kind of interface alloy intermetallic compound etching solution, etching method and sample preparation method.Interface alloy intermetallic compound etching solution includes the following volume fraction of raw materials: ammonia 45%~55% and hydrogen peroxide 45%~55%;Wherein, the mass fraction of the ammonia is 25%~28%, and the mass fraction of the hydrogen peroxide is 30%~50%.The etching solution can etch tin, copper, silver, lead, gold, nickel and other multiple metals in interface alloy intermetallic compound at the same time by etching only once, and make each metal interface expose clear internal texture, which is beneficial to subsequent reliability analysis of circuit board.The raw materials of the interface alloy intermetallic compound etching solution are simple, low in cost, easy to prepare, short in etching time, and suitable for large-scale rapid experiment of interface alloy intermetallic compound.

The invention relates to a method for processing a bevel edge of a golden finger area of a printed circuit board, which sequentially comprises the following steps of: A, resistance welding and windowing: windowing a golden finger body and an adjacent lead area in a resistance welding process, and exposing a copper surface of the area; b, conducting wire area etching: completely removing the copper layer of the adjacent conducting wire area on the outer side of the golden finger body through a graphical etching process; and C, bevel edge forming: performing bevel edge cutting along the copper-free isolation strip formed by etching in the lead area, wherein the cutting boundary ends at the copper-free isolation strip and is far away from the golden finger body. The metal exposure risk during bevel edge cutting is thoroughly eliminated through the copper-free isolation strip, and an electrochemical migration path is blocked; no metal contact exists in the whole cutting process, conductive chippings are completely eradicated, and the hidden danger of short circuit in a high-frequency plugging scene is solved; the isolation belt design is compatible with conventional equipment precision, and the process error-tolerant rate and reliability are improved.

A circuit board with embedded elements and a method for fabricating the same are provided. The circuit board with embedded elements includes a circuit substrate, a conductive structure, an electronic component and a thermoplastic insulation layer. The conductive structure is embedded in and electrically connected to the circuit substrate, while the conductive structure has a trench. The electronic component is disposed inside this trench and electrically connected to the conductive structure. The thermoplastic insulation layer covers the electronic component and the inner wall of the trench, and the surface of the thermoplastic insulation layer is flush with the surface of the circuit substrate. The heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.