28results about "Lithography/patterning" patented technology

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The invention discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent visual module, and the method comprises the steps: taking a copper layer, pasting a first dry film and a protection film respectively, making a window on the first dry film corresponding to a hollowed-out circuit pattern, and electroplating a tin layer to form a tin plate; a single-face copper-clad plate is taken, a circuit pattern is manufactured in the area corresponding to a tin layer, a copper-clad plate copper pattern is formed, and a first pattern plate is formed; correspondingly laminating the tin-plated plate and the first pattern plate to form a laminated plate; removing the protective film in the laminated plate, manufacturing a circuit pattern, forming a copper layer windowing pattern and a hollow circuit pattern, and forming a second pattern plate; removing an area, corresponding to the copper pattern of the copper-clad plate, of the insulating dielectric layer in the second pattern plate, then performing tin stripping processing, and performing post-process processing to hollowed out the circuit pattern to form a hollowed-out circuit so as to form the flexible circuit board; and the tin layer provides protection for etching, creates a release condition for a copper pattern of the copper-clad plate, lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention relates to the technical field of manufacturing of adhesives, new materials and printed circuit boards, in particular to an electromagnetic shielding function type electronic circuit board and a manufacturing method. An electronic circuit board with an electromagnetic shielding function comprises a core board with an inner layer circuit; the functional composite layer covers at least one surface of the core plate and comprises a dielectric layer and a metal material layer with the thickness of 0.1 nanometer to 5 micrometers; wherein the metal material layer is patterned, and is reserved in a preset shielding area to form an electromagnetic shielding layer; and the non-shielding region is removed, so that the dielectric layer exposed out of the region forms an insulating protection layer. According to the scheme, the flexible composite material with a thinner metal layer, a more simplified process and more diversified functions can be prepared.

The invention discloses a method for realizing selective electroplating of a ceramic copper-clad substrate. The method comprises the following steps of: masking and electroplating for the first time: coating a photosensitive film, aligning and exposing through a positioning hole, developing to form an electroplating window, electroplating nickel and gold, and removing the film by using an alkaline solution; secondary masking and etching a secondary coating photosensitive film; reusing a positioning hole for alignment exposure; developing and covering a gold plating area and exposing a to-be-etched copper layer; etching the copper layer; by adopting the double-mask collaborative mechanism, the first mask focuses on electroplating pattern transfer and the second mask side re-etching protection, so that batch production can be realized, the production speed is high, and a complicated process of ink printing is not needed.

According to the low-insertion-loss resistance welding manufacturing process of the high-speed circuit board and the high-speed circuit board, the insertion loss of a manufactured high-speed circuit board product is reduced by optimizing the resistance welding manufacturing process of the high-speed circuit board. Specifically, the whole surface of the high-speed circuit board is printed by adopting a two-time silk-screen process, and in the one-time silk-screen process, after ink is printed on the whole high-speed circuit board, a standing and air-drying process is adopted, and the thickness of the ink on the surface of the outer layer of the high-speed circuit board and between line gaps is reduced; and the problems that the printing ink is cured too early and the line-to-line accumulation is too thick due to high-temperature pre-baking are avoided. Afterwards, the thickness of the ink covering the surface of the circuit is precisely reinforced through secondary silk-screen, the distribution condition of solder resist ink with the thick line surface and the thin line space is formed, the electrical performance of the high-speed circuit board is improved, the insertion loss of the high-speed circuit board product is reduced, meanwhile, the solder resist manufacturing technological process of the high-speed circuit board is simplified, and the manufacturing efficiency is improved.

A direct imaging system includes an ultraviolet radiation source configured to irradiate a first region having a first width of a layer of photoreactive material on a substrate with patterned ultraviolet radiation. A thermal energy source is configured to heat a second region of the photoreactive material layer when the ultraviolet radiation source irradiates the first region. The second region contains a portion of the first region and has a second width less than the first width.

The present invention provides a method for manufacturing a six-layer high-frequency hybrid circuit board, comprising the following steps: inner layer → lamination → ceramic grinding → primary dry film → primary micro-etching and copper reduction → primary resin grinding → primary drilling → primary electroplating → resin plugging → secondary resin grinding → secondary micro-etching and copper reduction → tertiary resin grinding → secondary electroplating → outer layer dry film → outer layer etching → AOI → solder mask → secondary drilling → profiling → testing → AVI → nickel-palladium-gold (NPG) → packaging. During the primary dry film step, the L6 surface is fully covered with dry film and exposed without removing the protective film. Both the primary and secondary micro-etching and copper reduction steps utilize an etching machine for copper reduction. This improves the manufacturing process, enhances copper reduction uniformity, prevents resin exposure at the surface plugging and capping, and enhances the quality of the hybrid circuit board.

Disclosed is a manufacturing method of a circuit board including the following steps: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.

A method for manufacturing a multi-layer circuit board including an extreme fine that may include: providing a board having one surface on at least a part of which an upper conductive layer is formed and the other surface on at least a part of which a lower conductive layer is formed; forming a lower metal layer on the other surface of the board; forming a first resist layer on the one surface of the board through a photolithography process, and forming a first opening on the first resist layer; forming a metal pillar by plating the first opening by using an electrolytic plating method; removing the first resist layer; forming an insulating layer on a location from which the first resist layer is removed; and evenly polishing the metal pillar and the insulating layer.

A method for forming conductive and stretchable traces on a substrate is disclosed. A photocurable ink is prepared by dispersing surface-modified liquid-metal particles in a solvent together with monomers, crosslinkers, dispersant, and photoinitiator. The ink is deposited onto a substrate and selectively exposed to patterned light to initiate photopolymerization and crosslinking of the functionalized particle surfaces, forming a patterned liquid-metal-polymer composite anchored to the substrate. Subsequent mechanical activation ruptures oxide shells surrounding the particles and allows the liquid-metal cores to merge into a continuous conductive layer that conforms to the projected pattern. The process operates under ambient conditions with low energy input and short exposure time, providing high-resolution, durable, and deformable conductive features suitable for wearable electronics, biointegrated sensors, and soft-robotic devices.

A release layer is on s substrate, and a circuit structure on the release layer. Providing the circuit structure includes a first conductive layer on the release layer, a first insulating layer on the first conductive layer and the release layer, a second conductive layer on the first insulating layer to electrically connect the first conductive layer through the via of the insulating layer, and a second insulating layer on the second conductive layer. A first patterning step is performed on the second insulating layer to form a first opening exposing the first insulating layer. A second patterning step is performed on the first insulation layer to form a second opening. In a cross-section of the electronic device, the second opening overlaps the first opening, the first opening width is smaller than the second opening width, the first opening exposes the surface of the first insulating layer.

A circuit board and a method of fabricating the same are provided. The circuit board has a flexible insulation film and a circuit substrate with a bending part. The circuit substrate is a rigid board and includes a plurality of grooves which are distributed in the bending part. Each of the grooves extends to two opposite ends of the circuit substrate in a direction of long axis, and an opening of one of the grooves is exposed to the surface of the circuit substrate. The flexible insulation layer is disposed on the surface of the circuit substrate and covers the opening of the groove, while the groove is not filled with the flexible insulation layer.

The invention belongs to the field of PCB (printed circuit board) processing, and particularly relates to a method for producing and manufacturing a counterbore of a PCB. The method comprises the following steps: S1, drilling: drilling a counterbore in the PCB by using a counterbore drill; s2, burr polishing is carried out, specifically, burr polishing is carried out on a countersunk hole of the PCB, and countersunk burrs are removed; s3, drying the film, and forming a temporary protection image on the PCB through a film pasting-exposure-development process; s4, electroplating is conducted, specifically, the counterbore of the PCB is electroplated, and the electroplating process comprises PTH copper deposition, primary copper electroplating and secondary copper electroplating; s5, etching: etching the PCB, and removing the excess copper layer of the counterbore through chemical etching; s6, removing the film, removing the dry film remained after etching, and exposing the copper circuit; by adopting the process method, the production process, the production control and the quality control of the counterbore of the PCB can have a unified operation mode method and a control method, the production and quality problems can be effectively controlled, and the production quality of the counterbore is improved.

The invention belongs to the technical field of environmental area control, and particularly relates to an intelligent environmental area controller and a control method thereof.The intelligent environmental area controller comprises a suspension assembly which is installed at the top of a workbench and can drive a rotating and guiding device to rotate, and the center of the top of the rotating and guiding device is connected with the output end of the suspension assembly; according to the invention, the air around the lower end workbench can be driven to rotate in a vortex manner, the air at the lower end can be detected, static electricity can be eliminated, and meanwhile, the air can be wetted and replaced.

A direct imaging system includes an ultraviolet radiation source, which is configured to irradiate a first area, having a first width, of a layer of a photoreactive material on a substrate with patterned ultraviolet radiation. A thermal energy source is configured to heat a second area of the layer of the photoreactive material while the ultraviolet radiation source irradiates the first area. The second area contains a part of the first area and having a second width less than the first width.

The application discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent vision module, takes a copper layer and respectively pastes a first dry film and a protective film, a window is made on the first dry film corresponding to a hollow circuit pattern, a tin plating layer is formed, a tin plating plate is formed; a single-sided copper-clad plate is taken, a circuit pattern is made corresponding to the tin layer area, a copper pattern of the copper-clad plate is formed, a first pattern plate is formed; the tin plating plate is correspondingly pressed with the first pattern plate to form a pressed plate; the protective film in the pressed plate is removed, a circuit pattern is made, a copper layer window pattern and a hollow circuit pattern are formed, and a second pattern plate is formed; the area corresponding to the copper pattern of the copper-clad plate of the insulating medium layer in the second pattern plate is removed, then tin removal processing is performed, after processing, the hollow circuit pattern forms a hollow circuit, and a flexible circuit board is formed; the tin layer provides protection for etching, creates a release condition for the copper pattern of the copper-clad plate, and lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

A circuit board with embedded elements and a method for fabricating the same are provided. The circuit board with embedded elements includes a circuit substrate, a conductive structure, an electronic component and a thermoplastic insulation layer. The conductive structure is embedded in and electrically connected to the circuit substrate, while the conductive structure has a trench. The electronic component is disposed inside this trench and electrically connected to the conductive structure. The thermoplastic insulation layer covers the electronic component and the inner wall of the trench, and the surface of the thermoplastic insulation layer is flush with the surface of the circuit substrate. The heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.

The present application relates to a kind of interface alloy intermetallic compound etching solution, etching method and sample preparation method.Interface alloy intermetallic compound etching solution includes the following volume fraction of raw materials: ammonia 45%~55% and hydrogen peroxide 45%~55%;Wherein, the mass fraction of the ammonia is 25%~28%, and the mass fraction of the hydrogen peroxide is 30%~50%.The etching solution can etch tin, copper, silver, lead, gold, nickel and other multiple metals in interface alloy intermetallic compound at the same time by etching only once, and make each metal interface expose clear internal texture, which is beneficial to subsequent reliability analysis of circuit board.The raw materials of the interface alloy intermetallic compound etching solution are simple, low in cost, easy to prepare, short in etching time, and suitable for large-scale rapid experiment of interface alloy intermetallic compound.

The invention relates to a method for processing a bevel edge of a golden finger area of a printed circuit board, which sequentially comprises the following steps of: A, resistance welding and windowing: windowing a golden finger body and an adjacent lead area in a resistance welding process, and exposing a copper surface of the area; b, conducting wire area etching: completely removing the copper layer of the adjacent conducting wire area on the outer side of the golden finger body through a graphical etching process; and C, bevel edge forming: performing bevel edge cutting along the copper-free isolation strip formed by etching in the lead area, wherein the cutting boundary ends at the copper-free isolation strip and is far away from the golden finger body. The metal exposure risk during bevel edge cutting is thoroughly eliminated through the copper-free isolation strip, and an electrochemical migration path is blocked; no metal contact exists in the whole cutting process, conductive chippings are completely eradicated, and the hidden danger of short circuit in a high-frequency plugging scene is solved; the isolation belt design is compatible with conventional equipment precision, and the process error-tolerant rate and reliability are improved.

The invention discloses a preparation process of a high-reflectivity Mini LED PCB. The preparation process comprises the following steps of solder mask pretreatment, solder mask screen printing, pre-baking, exposure, development and post-baking. White solder resist ink is adopted for solder resist printing, and a preparation method of the white solder resist ink comprises the steps that photosensitive resin is divided into a first part of photosensitive resin and a second part of photosensitive resin, the first part of photosensitive resin, a photoinitiator A and a monomer with the functionality of 1-2 are evenly stirred and evenly sprayed to the surface of titanium dioxide, then baking and pre-exposure are conducted, and coated titanium dioxide is obtained; and uniformly mixing the coated titanium dioxide with a second part of photosensitive resin, a photoinitiator B, a monomer with the functionality of 3-6 and an auxiliary agent. According to the invention, the titanium dioxide is coated by the photosensitive resin to prepare the coated titanium dioxide, and the dispersity of the titanium dioxide in the ink can be improved without adding a dispersing agent; and moreover, the influence of the doping of the titanium dioxide pigment on the mechanical anchoring capability of the printing ink is reduced, and the adhesive force of the printing ink and the PCB substrate is improved.

A circuit board with embedded elements and a method for fabricating the same are provided. The circuit board with embedded elements includes a circuit substrate, a conductive structure, an electronic component and a thermoplastic insulation layer. The conductive structure is embedded in and electrically connected to the circuit substrate, while the conductive structure has a trench. The electronic component is disposed inside this trench and electrically connected to the conductive structure. The thermoplastic insulation layer covers the electronic component and the inner wall of the trench, and the surface of the thermoplastic insulation layer is flush with the surface of the circuit substrate. The heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.

The present application relates to the field of PCB production and discloses a method for manufacturing a thick yin-yang copper PCB. The method comprises: simultaneously performing a first etching on a first surface and a second surface of a seventh PCB; after completing the first etching on the second surface, retaining the tin layer on the circuit pattern on the second surface to obtain an eighth PCB; producing a second outer layer pattern on the eighth PCB, without applying a dry film to the first surface, applying a dry film to the second surface, and not performing an exposure treatment on the dry film on the second surface, retaining the dry film on the second surface as a protective film; applying glue to the edges of the eighth PCB to obtain a ninth PCB; performing a second etching on the ninth PCB, after completing the second etching on the first surface, removing the dry film on the second surface, and then removing the tin layer on the second surface. The present application enables quality inspection of fine circuits on thick yin-yang copper PCBs, thereby improving the production quality of thick yin-yang copper PCBs.

The present application relates to the technical field of PCB, and particularly relates to a PCB production automatic exposure system and method. Through real-time acquisition and analysis of the alignment offset information of the PCB substrate, the substrate position tilt information and the pattern alignment precision, the present application can more accurately monitor the possible error sources in the exposure process, dynamically adjust the initial parameters of the exposure system through the overall exposure deviation, alignment error and tilt error, effectively balance the exposure intensity of the whole exposure area, compensate for different areas according to the real-time light intensity of each area, dynamically adjust the exposure time according to the real-time light intensity of each area, ensure that each line is formed under appropriate exposure intensity through real-time acquisition of the exposure image and adjustment of the light intensity, and analyze the exposure quality of each area through real-time acquisition of the edge information of the image.

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

A method for manufacturing an HDI printed circuit board with selectively recessed and metallized sidewalls comprises the following steps: step 1: opening the board; step 2: reducing copper; step 3: blind groove processing; step 4: blind groove electroplating; step 5: plugging holes; step 6: sealing grooves; step 7: circuit production; step 8: pressing; step 9: cutting; step 10: dissolving glue; step 11: blind hole processing; step 12: film exposure; step 13: sealing holes; step 14: film stripping; step 15: flash etching. The present invention first completes the product's arbitrary interconnection and fills the area that needs metallization with special glue, then uses a mechanical gong plate to expose and dissolve the special glue from the side, and finally produces a shaped metal sidewall. This method can easily meet the needs of selective sidewall metallization and make the circuit design of the processed high-density arbitrary interconnection circuit board more flexible. The present invention is highly practical and has strong promotional significance.