46results about "Lithography/patterning" patented technology

The invention discloses a high-stretching FPC (Flexible Printed Circuit) and a preparation method thereof, and the method comprises the steps: coating conductive silver paste on a flexible substrate film in a printing, dispensing or coating mode on the back of the flexible substrate film, and forming a metal circuit layer through low-temperature curing; the printing thickness of the conductive silver paste is controlled to be 8-20 [mu] m; pasting a protective layer on the metal circuit layer, and pressing; after the supporting film is torn off, shape punching is conducted, and the product is obtained. The initial paste of the conductive silver paste comprises the following components: 50 wt%-70 wt% of mixed silver powder, 10 wt%-15 wt% of acrylic resin, 10 wt%-15 wt% of dimethyl glutarate, 5 wt%-10 wt% of dimethyl adipate and 5 wt%-10 wt% of dimethyl succinate. The high-stretching FPC and the preparation process thereof have the characteristics of high efficiency and low cost, and large-scale production can be realized. And on the other hand, the operability is high, and the operability problems that flexible base materials such as TPU are prone to displacement in the silk-screen printing process, and printing is poor are solved.

The invention belongs to the field of micro-nano manufacturing technology and microelectronic manufacturing, and particularly relates to a method for manufacturing a complex curved surface conformal high-resolution embedded circuit, which comprises the following steps of: firstly, processing a nano groove structure with a specific pattern on a hard curved surface substrate according to a preset path; a metal seed layer is deposited in the groove, then the groove is filled with a conductive material by adopting filling technologies such as precise electroplating / chemical plating, fusion strengthening is generated among various metals by adopting a laser heating mode, and the adhesive force with the hard curved surface substrate groove structure can be further enhanced after the metals are cooled. And the requirements of extremely severe service environments are met. A new solution is provided for low-cost manufacturing of the embedded curved surface circuit which is high in resolution, adjustable in height-width ratio, high in electrical performance, high in adhesive force and capable of combining multiple materials.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The invention discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent visual module, and the method comprises the steps: taking a copper layer, pasting a first dry film and a protection film respectively, making a window on the first dry film corresponding to a hollowed-out circuit pattern, and electroplating a tin layer to form a tin plate; a single-face copper-clad plate is taken, a circuit pattern is manufactured in the area corresponding to a tin layer, a copper-clad plate copper pattern is formed, and a first pattern plate is formed; correspondingly laminating the tin-plated plate and the first pattern plate to form a laminated plate; removing the protective film in the laminated plate, manufacturing a circuit pattern, forming a copper layer windowing pattern and a hollow circuit pattern, and forming a second pattern plate; removing an area, corresponding to the copper pattern of the copper-clad plate, of the insulating dielectric layer in the second pattern plate, then performing tin stripping processing, and performing post-process processing to hollowed out the circuit pattern to form a hollowed-out circuit so as to form the flexible circuit board; and the tin layer provides protection for etching, creates a release condition for a copper pattern of the copper-clad plate, lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention relates to the technical field of manufacturing of adhesives, new materials and printed circuit boards, in particular to an electromagnetic shielding function type electronic circuit board and a manufacturing method. An electronic circuit board with an electromagnetic shielding function comprises a core board with an inner layer circuit; the functional composite layer covers at least one surface of the core plate and comprises a dielectric layer and a metal material layer with the thickness of 0.1 nanometer to 5 micrometers; wherein the metal material layer is patterned, and is reserved in a preset shielding area to form an electromagnetic shielding layer; and the non-shielding region is removed, so that the dielectric layer exposed out of the region forms an insulating protection layer. According to the scheme, the flexible composite material with a thinner metal layer, a more simplified process and more diversified functions can be prepared.

The invention discloses a method for realizing selective electroplating of a ceramic copper-clad substrate. The method comprises the following steps of: masking and electroplating for the first time: coating a photosensitive film, aligning and exposing through a positioning hole, developing to form an electroplating window, electroplating nickel and gold, and removing the film by using an alkaline solution; secondary masking and etching a secondary coating photosensitive film; reusing a positioning hole for alignment exposure; developing and covering a gold plating area and exposing a to-be-etched copper layer; etching the copper layer; by adopting the double-mask collaborative mechanism, the first mask focuses on electroplating pattern transfer and the second mask side re-etching protection, so that batch production can be realized, the production speed is high, and a complicated process of ink printing is not needed.

According to the low-insertion-loss resistance welding manufacturing process of the high-speed circuit board and the high-speed circuit board, the insertion loss of a manufactured high-speed circuit board product is reduced by optimizing the resistance welding manufacturing process of the high-speed circuit board. Specifically, the whole surface of the high-speed circuit board is printed by adopting a two-time silk-screen process, and in the one-time silk-screen process, after ink is printed on the whole high-speed circuit board, a standing and air-drying process is adopted, and the thickness of the ink on the surface of the outer layer of the high-speed circuit board and between line gaps is reduced; and the problems that the printing ink is cured too early and the line-to-line accumulation is too thick due to high-temperature pre-baking are avoided. Afterwards, the thickness of the ink covering the surface of the circuit is precisely reinforced through secondary silk-screen, the distribution condition of solder resist ink with the thick line surface and the thin line space is formed, the electrical performance of the high-speed circuit board is improved, the insertion loss of the high-speed circuit board product is reduced, meanwhile, the solder resist manufacturing technological process of the high-speed circuit board is simplified, and the manufacturing efficiency is improved.

A direct imaging system includes an ultraviolet radiation source configured to irradiate a first region having a first width of a layer of photoreactive material on a substrate with patterned ultraviolet radiation. A thermal energy source is configured to heat a second region of the photoreactive material layer when the ultraviolet radiation source irradiates the first region. The second region contains a portion of the first region and has a second width less than the first width.

The present invention provides a method for manufacturing a six-layer high-frequency hybrid circuit board, comprising the following steps: inner layer → lamination → ceramic grinding → primary dry film → primary micro-etching and copper reduction → primary resin grinding → primary drilling → primary electroplating → resin plugging → secondary resin grinding → secondary micro-etching and copper reduction → tertiary resin grinding → secondary electroplating → outer layer dry film → outer layer etching → AOI → solder mask → secondary drilling → profiling → testing → AVI → nickel-palladium-gold (NPG) → packaging. During the primary dry film step, the L6 surface is fully covered with dry film and exposed without removing the protective film. Both the primary and secondary micro-etching and copper reduction steps utilize an etching machine for copper reduction. This improves the manufacturing process, enhances copper reduction uniformity, prevents resin exposure at the surface plugging and capping, and enhances the quality of the hybrid circuit board.

Disclosed is a manufacturing method of a circuit board including the following steps: providing a substrate with a conductive layer; using a jig to imprint-etch the conductive layer of the substrate to form an intermediate with a concave and convex pattern; and etching the intermediate to form a circuit board with a circuit pattern, wherein the circuit pattern corresponds to a convex portion of the concave and convex pattern.

Disclosed in the present invention is an electroplating method for a stepped thick copper circuit board, comprising the following steps: performing full-board electroplating on an outer-layer copper surface of a circuit board, so that the copper thickness meets the copper thickness requirements of a thin copper area; developing a stepped circuit pattern by means of roller film lamination, exposure, and development, using a protective film to cover a circuit area that does not need to be thickened, and exposing a thick copper circuit and a hole; electroplating the exposed thick copper circuit and hole, so that the copper thickness meets the copper thickness requirements of a thick copper area, thus obtaining a stepped circuit board; removing the protective film, obtaining a stepped circuit after etching treatment, and then removing tin; and successively carrying out processes of solder mask preparation, surface treatment, and forming on the stepped circuit board to obtain a stepped thick copper circuit board. According to the electroplating method for the stepped thick copper circuit board in the present invention, by first forming the thin copper area and then forming the thick copper area, the precision requirements of the thin copper area can be met, higher copper thickness uniformity and copper thickness precision can be achieved, cost is low, and high economic benefits are achieved.

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less and a valley portion void volume Vvv of 0.010 μm3 / μm2 or more and 0.028 μm3 / μm2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

A method for manufacturing a multi-layer circuit board including an extreme fine that may include: providing a board having one surface on at least a part of which an upper conductive layer is formed and the other surface on at least a part of which a lower conductive layer is formed; forming a lower metal layer on the other surface of the board; forming a first resist layer on the one surface of the board through a photolithography process, and forming a first opening on the first resist layer; forming a metal pillar by plating the first opening by using an electrolytic plating method; removing the first resist layer; forming an insulating layer on a location from which the first resist layer is removed; and evenly polishing the metal pillar and the insulating layer.

A method for forming conductive and stretchable traces on a substrate is disclosed. A photocurable ink is prepared by dispersing surface-modified liquid-metal particles in a solvent together with monomers, crosslinkers, dispersant, and photoinitiator. The ink is deposited onto a substrate and selectively exposed to patterned light to initiate photopolymerization and crosslinking of the functionalized particle surfaces, forming a patterned liquid-metal-polymer composite anchored to the substrate. Subsequent mechanical activation ruptures oxide shells surrounding the particles and allows the liquid-metal cores to merge into a continuous conductive layer that conforms to the projected pattern. The process operates under ambient conditions with low energy input and short exposure time, providing high-resolution, durable, and deformable conductive features suitable for wearable electronics, biointegrated sensors, and soft-robotic devices.

A release layer is on s substrate, and a circuit structure on the release layer. Providing the circuit structure includes a first conductive layer on the release layer, a first insulating layer on the first conductive layer and the release layer, a second conductive layer on the first insulating layer to electrically connect the first conductive layer through the via of the insulating layer, and a second insulating layer on the second conductive layer. A first patterning step is performed on the second insulating layer to form a first opening exposing the first insulating layer. A second patterning step is performed on the first insulation layer to form a second opening. In a cross-section of the electronic device, the second opening overlaps the first opening, the first opening width is smaller than the second opening width, the first opening exposes the surface of the first insulating layer.

A method may include providing a fluid material, solidifying the fluid material, providing a substrate, and depositing the solidified fluid material on the substrate. Providing the fluid material may include providing a mold, and filling the mold with the fluid material. Solidifying the fluid material may include solidifying the fluid material in a mold, and removing the solidified fluid material from the mold. Providing the substrate may include preparing the substrate for deposition of the solidified fluid material, and adjusting the temperature of the substrate. Depositing the solidified fluid material on the substrate may include fixturing the substrate, and loading the solidified fluid material in a deposition tool. The fluid material may include a liquid phase component, and a solid phase component. The solid phase component may include particles suspended in the liquid phase component. The liquid phase component may include a gallium alloy.

A circuit board and a method of fabricating the same are provided. The circuit board has a flexible insulation film and a circuit substrate with a bending part. The circuit substrate is a rigid board and includes a plurality of grooves which are distributed in the bending part. Each of the grooves extends to two opposite ends of the circuit substrate in a direction of long axis, and an opening of one of the grooves is exposed to the surface of the circuit substrate. The flexible insulation layer is disposed on the surface of the circuit substrate and covers the opening of the groove, while the groove is not filled with the flexible insulation layer.

The invention belongs to the field of PCB (printed circuit board) processing, and particularly relates to a method for producing and manufacturing a counterbore of a PCB. The method comprises the following steps: S1, drilling: drilling a counterbore in the PCB by using a counterbore drill; s2, burr polishing is carried out, specifically, burr polishing is carried out on a countersunk hole of the PCB, and countersunk burrs are removed; s3, drying the film, and forming a temporary protection image on the PCB through a film pasting-exposure-development process; s4, electroplating is conducted, specifically, the counterbore of the PCB is electroplated, and the electroplating process comprises PTH copper deposition, primary copper electroplating and secondary copper electroplating; s5, etching: etching the PCB, and removing the excess copper layer of the counterbore through chemical etching; s6, removing the film, removing the dry film remained after etching, and exposing the copper circuit; by adopting the process method, the production process, the production control and the quality control of the counterbore of the PCB can have a unified operation mode method and a control method, the production and quality problems can be effectively controlled, and the production quality of the counterbore is improved.

The invention belongs to the technical field of environmental area control, and particularly relates to an intelligent environmental area controller and a control method thereof.The intelligent environmental area controller comprises a suspension assembly which is installed at the top of a workbench and can drive a rotating and guiding device to rotate, and the center of the top of the rotating and guiding device is connected with the output end of the suspension assembly; according to the invention, the air around the lower end workbench can be driven to rotate in a vortex manner, the air at the lower end can be detected, static electricity can be eliminated, and meanwhile, the air can be wetted and replaced.

A direct imaging system includes an ultraviolet radiation source, which is configured to irradiate a first area, having a first width, of a layer of a photoreactive material on a substrate with patterned ultraviolet radiation. A thermal energy source is configured to heat a second area of the layer of the photoreactive material while the ultraviolet radiation source irradiates the first area. The second area contains a part of the first area and having a second width less than the first width.

The embodiment of the invention provides a manufacturing method of a printed circuit board, the printed circuit board and electronic equipment, and relates to the technical field of electronics, and the method comprises the steps: obtaining a substrate, enabling the surface of the substrate to be provided with a specific metal layer, and enabling the thickness of the specific metal layer to be smaller than 15 microns; based on the set circuit diagram of the substrate, performing exposure and development treatment on the substrate film layer laid on the specific metal layer to expose the specific metal layer corresponding to the set circuit diagram; electroplating the exposed metal on the substrate, and thickening the exposed metal by a set metal thickness to obtain a middle panel; and performing film stripping and etching treatment on the middle panel to obtain the printed circuit board. The method and the device are used for solving the problem of poor short circuit caused by incomplete copper film etching when the circuit distance is small, the etching depth is large and the etching copper thickness is large.

A method of manufacturing circuits of a substrate of a display device is provided. The method includes aligning and attaching a mask with multiple slots to a circuit area of the substrate; printing a printing material in the slots of the mask using an inkjet printing technology, so that the printing material is attached to the circuit area; removing the mask from the substrate; and curing the printing material on the circuit area to form a plurality of the circuits.

The application discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent vision module, takes a copper layer and respectively pastes a first dry film and a protective film, a window is made on the first dry film corresponding to a hollow circuit pattern, a tin plating layer is formed, a tin plating plate is formed; a single-sided copper-clad plate is taken, a circuit pattern is made corresponding to the tin layer area, a copper pattern of the copper-clad plate is formed, a first pattern plate is formed; the tin plating plate is correspondingly pressed with the first pattern plate to form a pressed plate; the protective film in the pressed plate is removed, a circuit pattern is made, a copper layer window pattern and a hollow circuit pattern are formed, and a second pattern plate is formed; the area corresponding to the copper pattern of the copper-clad plate of the insulating medium layer in the second pattern plate is removed, then tin removal processing is performed, after processing, the hollow circuit pattern forms a hollow circuit, and a flexible circuit board is formed; the tin layer provides protection for etching, creates a release condition for the copper pattern of the copper-clad plate, and lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention discloses an automatic character resistance welding method, and belongs to the technical field of printed circuit board manufacturing. The automatic character resistance welding method comprises the following steps: step 1, entering a WI P storage location; step 2, AGV transfer; step 3, cleaning and coarsening the PCB; step 4, printing a solder mask layer; step 5, exposing; 6, removing the printing ink; step 7, carrying out AVI inspection; 8, spraying characters; step 9, automatically collecting the plates; and 10, AGV transfer is carried out. Through a series of automatic steps of automatic scanning, cleaning and roughening treatment, solder mask printing, exposure, ink treatment, AVI inspection, character spraying and the like, automation and standardization of the production process are achieved, the production efficiency, the product quality and the consistency are improved, the labor cost and the material loss are reduced, meanwhile, real-time monitoring and data recording are achieved, and the production efficiency is improved. The safety of a production site is enhanced, the processing flow of the PCB is comprehensively optimized, and the production efficiency and the quality are promoted to be remarkably improved.

A circuit board with embedded elements and a method for fabricating the same are provided. The circuit board with embedded elements includes a circuit substrate, a conductive structure, an electronic component and a thermoplastic insulation layer. The conductive structure is embedded in and electrically connected to the circuit substrate, while the conductive structure has a trench. The electronic component is disposed inside this trench and electrically connected to the conductive structure. The thermoplastic insulation layer covers the electronic component and the inner wall of the trench, and the surface of the thermoplastic insulation layer is flush with the surface of the circuit substrate. The heat deflection temperature of the thermoplastic insulation layer is between 376° C. and 410° C.

The present application relates to a kind of interface alloy intermetallic compound etching solution, etching method and sample preparation method.Interface alloy intermetallic compound etching solution includes the following volume fraction of raw materials: ammonia 45%~55% and hydrogen peroxide 45%~55%;Wherein, the mass fraction of the ammonia is 25%~28%, and the mass fraction of the hydrogen peroxide is 30%~50%.The etching solution can etch tin, copper, silver, lead, gold, nickel and other multiple metals in interface alloy intermetallic compound at the same time by etching only once, and make each metal interface expose clear internal texture, which is beneficial to subsequent reliability analysis of circuit board.The raw materials of the interface alloy intermetallic compound etching solution are simple, low in cost, easy to prepare, short in etching time, and suitable for large-scale rapid experiment of interface alloy intermetallic compound.

The present invention discloses an etching method for a printed circuit board, wherein the etching method for a printed circuit board comprises: pre-etching a plurality of boards respectively, obtaining the etching line speeds of the plurality of boards during the pre-etching process and corresponding multiple influencing parameters; analyzing and processing the etching line speeds during the pre-etching process and the corresponding multiple influencing parameters, obtaining the corresponding relationship between the etching line speeds and the multiple influencing parameters; predicting the predicted etching line speed of the board to be etched based on the corresponding relationship and the multiple influencing parameters of the board to be etched; etching the board to be etched based on the predicted etching line speed. Through the above-mentioned etching method for a printed circuit board, the present invention can achieve precise etching of each board to be etched by directly obtaining the etching line speed of the board to be etched through the establishment of a corresponding relationship through the multiple influencing parameters of the board to be etched, thereby reducing the demand for manual etching process skills.