Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom

Abstract

The invention provides thermal management circuit materials, a method of manufacture thereof, and articles formed therefrom. According to one embodiment, the thermal management circuit material comprises a thermally conductive metallic core substrate, metal oxide dielectric layers on both sides of the metallic core substrate, electrically conductive metal layers on the metal oxide metal oxide dielectric layers, and at least one through-hole via filled with an electrically conductive metal-containing core element connecting at least a portion of each of the electrically conductive metal layers, wherein the containing walls of the through-hole via are covered by a metal oxide dielectric layer connecting at least a portion of the metal oxide dielectric layers on opposite sides of the metallic core substrate. Also disclosed are methods of making such circuit materials, comprising forming metal oxide dielectric layers by oxidative conversion of a surface portion of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.

Description

Background technique [0001] The present invention relates to thermal management circuit materials including one or more conductive pathways. Such circuit materials may be used to support optoelectronic devices, microwave devices, radio frequency devices, power semiconductor devices, or other electronic devices. [0002] While there are a variety of circuit materials available today, there is a particular need for circuit materials for high power applications (ie, applications that generate high specific energies or involve high operating temperatures). In particular, semiconductors designed to carry higher current loads may have an upper operating temperature limit above which they may fail, jeopardizing the operational reliability of the entire circuit. Circuit materials designed for thermal management have been used where heat dissipation is required to keep operating temperatures within desired ranges. Such heat-dissipating thermal management circuit materials can be appl...

AI Technical Summary

Problems solved by technology

This can be a disadvantage for applications that increasingly require smaller components and higher thermal conductivity

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