Multilayer carrier foil

A multi-layer carrier and carrier foil technology, which is applied in the direction of multi-layer circuit manufacturing, layered products, metal layered products, etc., can solve problems such as consumption, more energy, and affecting the consistency of peel strength

Active Publication Date: 2018-06-05
CHANG CHUN PETROCHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, a stronger laser is required, but consumes more energy
In addition, the temperature of this ultra-thin copper foil can reach as high as 300 °C during the high-temperature lamination process, and the metal bond formed by the redox reaction between metal oxide and copper metal may affect the consistency of peel strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0109] Preparation of copper carrier layer

[0110] Copper wire was dissolved with 50% by weight of sulfuric acid aqueous solution to prepare copper sulfate pentahydrate (CuSO4) containing 320 g / L. 4 ·5H 2 O) Copper sulfate electrolyte with 110 g / L sulfuric acid. Add 5.5 mg of low molecular weight gum (DV, manufactured by Nippi Co., Ltd.), 3 mg of sodium 3-mercaptopropanesulfonate (MPS, manufactured by Polymer International Co., Ltd.) and 25 mg of per liter of copper sulfate electrolyte. Hydrochloric acid (manufactured by RCI Labscan Co., Ltd.), at a liquid temperature of 50°C and a temperature of 50 amperes / square decimeters (A / dm 2 ) Electrolytic copper foil with a thickness of 18 microns was prepared under the current density.

[0111] A typical apparatus for making copper foil includes a metal cathode roll, which is rotatable and has a mirror-polished surface, and an insoluble metal anode. The insoluble metal anode is mounted on about the lower half of the metal cathod...

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Abstract

The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, wherein the laminate side of carrier layer optionally has nodules; (b) a chromium release layer applied to the copper carrier layer (a); (c) an intermediate copper layer applied to the chromium release layer (b); (d) an anti-migration layer applied to the intermediate copper layer (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.

Description

technical field [0001] The invention relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, a printed circuit board, and an electronic device comprising the printed circuit board. The invention also relates to methods for producing the multilayer carrier foil, the core structure and the printed circuit board. Background technique [0002] As the electronics industry moves towards lighter, thinner and smaller electronic components, the demand for precision circuits and thin copper foils increases, and consumer electronics require more integrated circuits in integrated circuit packages, while contradictory To provide less physical space to accommodate increased integrated circuit packaging, electrolytic copper foil including carrier foil can be used in the electronics industry to manufacture high-precision and dense circuits in printed circuit board assemblies. [0003] Electrolytic copper foil including carrier foil is roughly divide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0298H05K3/4602H05K3/4652H05K2203/0502H05K3/007H05K3/421H05K2203/0152H05K2203/1536H01L21/4857H01L23/49822H05K2201/0338H05K2201/0355B32B15/043B32B15/20H05K1/09B32B2311/22B32B2311/12B32B2457/08H05K3/022H05K3/22H05K3/303H05K3/4644H05K2201/0141H05K2201/015H05K2203/107
Inventor 赖耀生郑桂森周瑞昌
Owner CHANG CHUN PETROCHEMICAL CO LTD
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