PCB manufacturing method capable of preventing green oil hole plugging

A manufacturing method and PCB board technology, applied in printed circuit manufacturing, lithography/pattern, pattern and lithography, etc., can solve problems such as lack of gold plating in SMT, open circuit of electric via hole, plugged hole of solder resist ink, etc., to improve production The pass rate, improve the product pass rate, the effect of circuit graphics intact

Active Publication Date: 2016-08-31
DONGGUAN MEADVILLE CIRCUITS
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AI Technical Summary

Problems solved by technology

[0003] Due to the continuous development of circuit board manufacturing technology towards high-density interconnection, the hole diameter of the electric hole is getting smaller and smaller, and the minimum hole diameter has been developed from 0.25mm in the past to 0.20mm, and the hol

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  • PCB manufacturing method capable of preventing green oil hole plugging

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Embodiment Construction

[0011] In order to make the technical solution of the present invention more clearly expressed, the present invention will be further described below in conjunction with the accompanying drawings.

[0012] Such as figure 1 As shown, the present invention provides a PCB manufacturing method for preventing green oil plug holes, which effectively solves the problem of green oil plug holes in micro-holes, HDI blind holes or back-drilled holes. The copper layer on the upper and lower surfaces of the inner core board is provided with a number of functional holes on the PCB. The functional holes can be micro-holes, HDI blind holes, back-drilled holes or through holes. The PCB manufacturing method for preventing green oil plug holes includes the following step:

[0013] (1) Pre-treatment of solder mask, cleaning and roughening the copper surface of the PCB board before solder mask screen printing, which includes the following processes: A. Washing and pickling to remove oxides on the...

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Abstract

Provided is a PCB (Printed Circuit Board) manufacturing method capable of preventing green oil hole plugging, comprising the steps of: (1) pre-welding treatment; (2) screen printing: forming a layer of solder resist ink on a copper layer; (3) preliminary baking: performing preheating; (4) counterpoint exposure: performing selective ultraviolet exposure on the solder resist ink covering the area needing solder resist to form a solder resist layer; (5) developing; (6) secondary counterpoint exposure: performing secondary ultraviolet exposure on the area except the function hole of a PCB; (7) secondary developing: employing chemical liquid medicine to perform secondary developing on solder resist ink in the function hole so as to thoroughly remove solder resist ink left in the function hole; (8) board checking; (9) postbaking; and (10) performing pre-welding treatment, screen printing, preliminary baking, counterpoint exposure, developing, secondary counterpoint exposure, secondary developing, board checking and postbaking again on the PCB. The method introduces secondary counterpoint exposure and secondary developing, and effectively solves the problem of hole plugging.

Description

technical field [0001] The invention relates to a PCB board processing technology, in particular to a PCB manufacturing method for preventing green oil from plugging holes. Background technique [0002] In the past ten years, the printed circuit board (Printed Circuit Board, referred to as PCB) manufacturing industry has developed rapidly. Density and high reliability direction. Continuous reduction in size, cost reduction, and performance improvement enable printed circuit boards to maintain strong vitality in the development of future electronic products. The future development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliability, multi-layer, high-speed transmission, light weight, and thin profile in terms of performance. [0003] Due to the continuous development of circuit board manufacturing technology towards high-density interconnection, the ho...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/00H05K2203/0502
Inventor 黎艺海蔡伟贤
Owner DONGGUAN MEADVILLE CIRCUITS
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