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Preparation process of micro-nano texture seamless splicing texture mold

A technology of seamless splicing and preparation process, applied in the exposure methods of radiation-sensitive masks, printed circuit manufacturing, circuit covers, etc., can solve the problems of edge chipping texture, missing, glue accumulation and air bubbles in the edge area. Achieve the effect of avoiding edge collapse and dirt and discoloration

Pending Publication Date: 2020-11-13
伯恩创盛技术研发(惠州)有限公司
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Problems solved by technology

[0003] 1. The single-mode texture milled by CNC technology has a large tolerance
[0004] 2. When milling single-mode texture, it is easy to cause damage (such as abnormal color, dirt, scratches, etc.)
[0005] 3. When CNC milling single-mode texture, the edge area is prone to chipping and the texture is missing
[0006] 4. After the single-mode texture and frame produced by CNC milling are assembled, it is difficult to separate the film at the seam, and problems such as glue accumulation and air bubbles are prone to occur

Method used

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  • Preparation process of micro-nano texture seamless splicing texture mold
  • Preparation process of micro-nano texture seamless splicing texture mold
  • Preparation process of micro-nano texture seamless splicing texture mold

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention, but this does not limit the protection scope of the present invention.

[0038] The invention provides a preparation process for texture templates that realize the seamless splicing of micro-nano textures. The micro-nano seamless splicing is realized by means of film shielding and UV local exposure, and the target positioning of the upper and lower platforms is captured by the CCD, and different textures are set. Row and column spacing realize multi-mode typesetting, which can make a single film spliced ​​into multiple films, thus solving the long development cycle and high development cost of the texture master mold, and the preparation process of the present invention can quickly Realize multi-mode production, improve production efficiency and reduce development costs.

[0039...

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Abstract

The invention discloses a preparation process of a micro-nano texture seamless splicing texture template. Micro-nano seamless splicing is realized by adopting film shielding and UV local exposure modes. An upper platform target and a lower platform target are grabbed and positioned through a CCD. Different row distances and column distances are set to realize multi-mode typesetting, and single films can be spliced into multiple films, so that the problems of long development period and high development cost of a texture female die are solved, and the preparation process disclosed by the invention can be used for quickly realizing multi-mode production, improving the production efficiency and reducing the development cost in a mode of splicing the single films into multiple modes.

Description

technical field [0001] The invention relates to the technical field of film mold preparation, in particular to a preparation process of a texture mold with seamless splicing of micro-nano textures. Background technique [0002] The existing technology mainly uses the single-mode texture to be transferred to the PC board first, and then uses CNC technology to mill out the texture or multiple textures in some areas separately, and then assembles according to the texture splicing layout, and then the assembled texture The mold is completely transferred to the PC board. Prior art has following defective: [0003] 1. The single-mode texture milled by CNC technology has a large tolerance. [0004] 2. When milling single-mode texture, it is easy to cause damage (such as different colors, dirt, scratches, etc.). [0005] 3. When CNC milling single-mode texture, the edge area is prone to chipping and the texture is missing. [0006] 4. After the single-mode texture and frame prod...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0082H05K2203/0502
Inventor 余雅黄宇正陈德全王钰钟均胜
Owner 伯恩创盛技术研发(惠州)有限公司
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