Method for manufacturing outer-layer line by using hard board with large drop

A technology of outer layer circuit and production method, which is applied in the fields of printed circuit manufacturing, printed circuit, photolithography/patterning, etc., can solve the problems of poor quality of the outer layer circuit of hard board, reduce bonding instability and increase yield Effect
CN106304643AInactive Publication Date: 2017-01-04SHENZHEN SUNTAK MULTILAYER PCB
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHENZHEN SUNTAK MULTILAYER PCB
Publication Date
2017-01-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a method for manufacturing outer-layer line by using a hard board with large drop. The method comprises the following steps: preparing a ladder-like hard board and a dry film and a wet film to be bonded, wherein the hard board is provided with hole sites, and a line pattern is printed on the wet film; coating the dry film on the hard board so that the dry film seals orifices at the hole sites at one side of the hard board; coating the wet film on one surface coated with the dry film of the hard board so that the wet film covers the dry film; exposing and developing the wet film to transfer the line pattern on the wet film to the hard plate; sequentially carrying out line pattern electroplating and outer-layer etching treatment on the hard board transferred with the line pattern to form the outer-layer line on the hard board. The technical scheme provided by the invention can improve the yield of the hard board outer-layer line.
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Description

technical field

[0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing an outer layer circuit of a hard board with a large drop. Background technique

[0002] In the printed circuit board industry, the surface of the rigid board usually needs to be attached with a layer of dry film or wet film to make the outer circuit. In the prior art, when the dry film is used to make the outer circuit, due to the weak adhesion of the dry film, it is only suitable for flat bonding with the hard board, and it is not suitable for processing the hard board with a large drop. For example, when making the outer layer circuit for the cardboard with a drop of >0.15mm, the stability of the dry film lamination at the junction of the hard board’s height difference is weak, and film bubbles will appear. After exposure and development, the dry film and the hard board will Weak adhesion can cause dry film peeling problems. When t...

Claims

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