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Method for manufacturing outer-layer line by using hard board with large drop

A technology of outer layer circuit and production method, which is applied in the fields of printed circuit manufacturing, printed circuit, photolithography/patterning, etc., can solve the problems of poor quality of the outer layer circuit of hard board, reduce bonding instability and increase yield Effect

Inactive Publication Date: 2017-01-04
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a method for making the outer circuit of a hard board with a large drop, which can solve the problem of poor quality of the outer circuit of the hard board when the dry film or wet film is used alone to laminate the hard board

Method used

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  • Method for manufacturing outer-layer line by using hard board with large drop
  • Method for manufacturing outer-layer line by using hard board with large drop

Examples

Experimental program
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Embodiment 1

[0026] Please refer to figure 1 , the invention provides a method for manufacturing an outer layer circuit of a hard board with a large drop, comprising the following steps:

[0027] Step S11 , preparing a hard board distributed in a step shape and a dry film and a wet film to be bonded, the hard board is provided with holes, and the wet film is printed with a circuit pattern. Specifically, the hard plate can be a thick copper plate. The drop at the step of the thick copper plate is greater than 0.15mm, and the strength on the dry film is better, which is used for sealing holes and has strong anti-plating ability, while the wet film has better flow It can be used to fill the drop on the hard board. Of course, the hard board in this embodiment has undergone pre-treatment of the outer layer, such as drilling, cleaning, and surface polishing, so as to facilitate the sticking of the dry film and the wet film. It should be pointed out that, in this embodiment, when the surface of...

Embodiment 2

[0040] Please refer to figure 2 , the invention provides a method for manufacturing an outer layer circuit of a hard board with a large drop, comprising the following steps:

[0041] Step S21 , preparing a hard board distributed in a step shape and a dry film and a wet film to be laminated, the hard board is provided with holes, and circuit patterns are printed on the dry film and the wet film respectively. Specifically, the hard plate can be a thick copper plate. The drop at the step of the thick copper plate is greater than 0.15mm, and the strength on the dry film is better, which is used for sealing holes and has strong anti-plating ability, while the wet film has better flow It can be used to fill the drop on the hard board. Of course, the hard board in this embodiment has undergone pre-treatment of the outer layer, such as drilling, cleaning, and surface polishing, so as to facilitate the sticking of the dry film and the wet film. It should be pointed out that, in this...

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Abstract

The invention discloses a method for manufacturing outer-layer line by using a hard board with large drop. The method comprises the following steps: preparing a ladder-like hard board and a dry film and a wet film to be bonded, wherein the hard board is provided with hole sites, and a line pattern is printed on the wet film; coating the dry film on the hard board so that the dry film seals orifices at the hole sites at one side of the hard board; coating the wet film on one surface coated with the dry film of the hard board so that the wet film covers the dry film; exposing and developing the wet film to transfer the line pattern on the wet film to the hard plate; sequentially carrying out line pattern electroplating and outer-layer etching treatment on the hard board transferred with the line pattern to form the outer-layer line on the hard board. The technical scheme provided by the invention can improve the yield of the hard board outer-layer line.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing an outer layer circuit of a hard board with a large drop. Background technique [0002] In the printed circuit board industry, the surface of the rigid board usually needs to be attached with a layer of dry film or wet film to make the outer circuit. In the prior art, when the dry film is used to make the outer circuit, due to the weak adhesion of the dry film, it is only suitable for flat bonding with the hard board, and it is not suitable for processing the hard board with a large drop. For example, when making the outer layer circuit for the cardboard with a drop of >0.15mm, the stability of the dry film lamination at the junction of the hard board’s height difference is weak, and film bubbles will appear. After exposure and development, the dry film and the hard board will Weak adhesion can cause dry film peeling problems. When t...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/18
CPCH05K3/00H05K3/18H05K2203/0502
Inventor 宋建远彭卫红王淑怡张盼盼
Owner SHENZHEN SUNTAK MULTILAYER PCB
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