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Etching method

An etching and resist film technology, applied in lithography masks, patterns, lithography, resist parts and other directions, can solve problems such as poor yield, and achieve the effect of improving yield

Active Publication Date: 2015-06-24
MIMAKI ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

That is, the existing etching method has the problem of poor yield

Method used

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Embodiment Construction

[0024] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[0025] First, the structure of the processed product manufactured by the etching method of this embodiment is demonstrated.

[0026] figure 1 It is a side sectional view of the processed product 10 manufactured by the etching method of this embodiment.

[0027] Such as figure 1 As shown, the processed product 10 is an article produced by denting the surface 11 a of the object 11 . For example, the processed product 10 is a printed wiring board in which a conductor layer 11c which is a conductor layer such as copper is coated on an insulator base material 11b.

[0028] Next, the configuration of the inkjet printer used to manufacture the processed product 10 will be described.

[0029] figure 2 It is a perspective view of the inkjet printer 20 for manufacturing the processed product 10 .

[0030] Such as figure 2 As shown, the inkjet printer 20 includes a p...

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Abstract

In this etching method, the surface (11a) of a target object (11) is processed by using a corrosive agent to corrode said surface (11a) as a means of solving the problem addressed by the present invention. The etching method comprises: a resist formation step in which resist liquid is inkjet-printed on the surface (11a) so that the resist liquid forms a resist (12); a surface corrosion step in which the side (11a) of the target object (11) on which the resist (12) was formed by the resist formation step is brought into contact with a corrosive agent so that the part of the surface (11a) not having the resist (12) formed thereon is corroded; and a resist peeling step in which the resist (12) is peeled from the surface (11a) after the surface corrosion step. The etching method is characterized by the resist formation step being a step in which the resist (12) is formed using a resist liquid containing a monofunctional monomer or a monofunctional oligomer and a polyfunctional monomer or a polyfunctional oligomer.

Description

technical field [0001] The present invention relates to an etching method for processing the surface of an object by etching the surface of the object with an etchant. Background technique [0002] Conventionally, as an etching method for processing the surface of an object by corroding the surface of the object with an etchant, a method including the following steps is known: a step of forming a resist film: inkjet printing of an oil-based resin solution, ultraviolet rays, etc. on the surface of an object; Resist liquid such as solidified resin liquid, forms resist film with resist liquid on the surface of object; Partial etching in which the resist film is not formed on the surface of the object; and resist film stripping step: peeling the resist film from the surface of the object after the surface etching step (see Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Application Laid-Open No. 6-228774 ...

Claims

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Application Information

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IPC IPC(8): C23F1/00B05D3/10H01L21/027H05K3/06
CPCH05K3/064G03F7/0002H05K3/0076H05K2203/013H05K2203/0551H05K2203/0562
Inventor 中村纪和
Owner MIMAKI ENG
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