12results about "Circuit masks composition" patented technology

A curable inkjet composition for a printed circuit board, comprising (a) one or more thermal cross-linking agent selected from the group consisting of an unblocked isocyanate, a blocked isocyanate and a triazine compound; and (b) at least two photopolymerizable compounds, characterized in that at least one polymerizable compound has a chemical structure according to General Formula (I) wherein R1, R2, R3, and R4 independently from each other represent hydrogen or a substituted or unsubstituted C1 to C10 alkyl group.

A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a dye, and a solvent, in which the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.

A method of forming an electronic device on a flexible substrate without using acetone dissolvent, including the steps of: printing a hydrophobic mask on a porous membrane to form a pattern thereon which is complementary to a desired pattern; filtering an aqueous suspension of an electronic material through the non-printed region of the porous membrane, whereby some electronic material is deposited on said non-printed region following the desired pattern; pressing the flexible substrate against the printed face of the membrane in order to transfer the patterned electronic material deposited on the porous membrane to the flexible substrate to form the electronic device thereon.

A method of manufacturing a printed circuit board having a metallic conductor structure is described. The method comprises: providing a base substrate (101) in the form of a film or sheet, the base substrate having a first substrate side (101a) and a second substrate side, the base substrate being at least partially composed of a non-conductive organic polymer material, the first substrate side (101a) being covered with a covering metal layer (102); and removing the cover metal layer (102) in some regions of the first substrate side (101a). In order to remove the cover metal layer (102), a mask layer (103) is applied to the cover metal layer (102). The mask layer (103) is removed in some regions such that the first substrate side (101a) is divided into at least one first sub-region (104), in which the first substrate side (101a) is covered only by the cover metal layer (102), and at least one second sub-region (105), in which the first substrate side (101a) is covered by the cover metal layer (102) and the mask layer (103). The covering metal layer (102) is then removed in the at least one first sub-region (104). According to the invention, the mask layer (103) is removed by an etching process using an etching solution, and a phase change or a chemical conversion is carried out in the mask layer (103) in the first sub-region (104) prior to the etching process.

Method for manufacturing a printed circuit board with a metallic conductor structure (109, 119) comprising the steps a. Provision of a base substrate (101) formed as a film or plate with a first substrate side (101a) and a second substrate side, which consists at least partially of an electrically non-conductive organic polymer material and in which the first substrate side (101a) is covered with a cover metal layer (102), and b. partial removal of the top metal layer (102), where the top metal layer is removed in sections (102) c. a mask layer (103) is applied to the top metal layer (102), d. the mask layer (103) is removed in sections, so that the first substrate side (101a) is divided into at least one first sub-area (104) in which the first substrate side (101a) is covered only with the cover metal layer (102), and into at least one second sub-area (105) in which the first substrate side (101a) is covered with the cover metal layer (102) and by the mask layer (103), and e. the cover metal layer (102) in which at least one first sub-area (104) is removed, characterized by the fact that f. the mask layer (103) in the first sub-area (104) is removed by an etching treatment using an etching solution and prior to the etching treatment to remove the mask layer (103) in the first sub-area (104) a phase transformation or a chemical transformation is effected in the mask layer (103), wherein the mask layer (103) consists of an inorganic semiconductor or a compound of an inorganic semiconductor or of a polymer material which can assume at least a partially crystalline state and an amorphous state.

A curable inkjet composition for a printed circuit board, comprising more than one polymerizable compound and one or more a thermal cross-linking agent; characterized in that at least one polymerizable compound is a methacrylate.

A method for producing a wiring board, including: a step of pretreating the surface of a metal layer exposed into an opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and a step of forming a copper plating layer on the metal layer by electrolytic plating. The resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is−2.0% by mass or more. The mass change rate is a value calculated by Expression: Mass change rate (% by mass)={(W1−W0) / W0}×100. W1 is the mass of the resist layer after a laminated body including a resist layer 3 and a copper foil is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes.

The present invention provides: a photosensitive element which exhibits rinse aid properties for a developer solution after a development device is stopped; and a method for forming a resist pattern. The present invention provides a photosensitive element which is provided with a supporting film and a photosensitive resin composition laver that is formed on the supporting film and contains a photosensitive resin composition, wherein: the photosensitive resin composition contains (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) a sensitizing agent and (D) a polymerization inhibitor; the alkali-soluble polymer (A) contains an alkali-soluble polymer, a monomer component of which contains an aromatic hydrocarbon group, and which has a weight average molecular weight Mw of 20,000 or less; and the compound (B) having an ethylenically unsaturated double bond is a compound which has a structure represented by general formula (B1).

An acrylate based photopolymer with high yellowing resistance, excellent photo sensitivity, high toughness, and high glass transition temperature, methods of preparation and used thereof, and solders comprising the same.

To provide a photosensitive resin composition containing a carboxyl group-containing resin, which facilitates achieving a low dielectric loss tangent in a cured product, allows the flexibility of the cured product to be easily maintained, and is resistant to excessive corrosion even when the cured product is treated with an oxidizing agent.SOLUTION: A photosensitive resin composition contains a carboxyl group-containing resin (A), a photopolymerization initiator (B), a photopolymerizable compound (C), an epoxy compound (D), silica (E) whose percentage relative to the carboxyl group-containing resin (A) is 50 mass% or more and 300 mass% or less, the silica (E) being surface-treated with a silane coupling agent, and a blocked isocyanate compound (F) whose percentage relative to the carboxyl group-containing resin (A) is 21 mass% or more and 100 mass% or less. The silane coupling agent has a phenyl skeleton.SELECTED DRAWING: Figure 1

A curable inkjet composition for a printed circuit board, comprising more than one polymerizable compound and one or more a thermal cross-linking agent; characterized in that at least one polymerizable compound is a methacrylate.

The invention describes a method for producing a printed circuit board having a metallic conductor structure. The method comprises providing a base substrate (101) which is formed as a film or plate, has a first substrate side (101a) and a second substrate side and at least partially consists of an electrically non-conductive organic polymer material and in which the first substrate side (101a) is covered with a covering metal layer (102), and removing the covering metal layer (102) in regions. In order remove the covering metal layer (102) in regions, a mask layer (103) is applied to the covering metal layer (102). This mask layer is then removed in regions. In the process, the first substrate side (101a) is divided into at least one first subregion (104), in which the first substrate side (101a) is covered only with the covering metal layer (102), and into at least one second subregion (105), in which the first substrate side (101a) is covered with the covering metal layer (102) and by the mask layer (103). The covering metal layer (102) in the at least one first subregion (104) is then removed. The invention proposes removing the mask layer (103) in the first subregion (104) by an etching treatment using an etching solution and implementing a phase transition or a chemical transformation in the mask layer (103) before the etching treatment.