Method of forming conductive lines and similar features

A conductive wire, electrical contact technology, applied in electroforming, circuits, circuit covers, etc., can solve the problems of increasing the risk of damage, expensive photoresist, reducing the overall efficiency of the device, etc., to reduce process steps and cause damage. the effect of reducing the likelihood of
CN101452973AInactive Publication Date: 2009-06-10PALO ALTO RES CENT INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
PALO ALTO RES CENT INC
Publication Date
2009-06-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a method of forming conductive lines and similar features. A print-patterned structure may be used as a self-aligned etch and deposition mask. A method of forming conductive lines and other similar features over a plurality of layers comprises forming a print-patterned structure over a first layer. The print-patterned structure is used as an etch mask to expose a portion of a second layer. A seed layer is formed over the exposed portion of the second layer, using the print-patterned structure as a deposition mask. Conductive lines or other features may be formed, for example, by electroplating using the seed layer as a contact pad and the print-patterned structure as deposition mask. The present invention is particularly useful in the formation of features for solar cells and the like where the print-patterned structure may be used to form high aspect ratio features.
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Description

technical field

[0001] The present invention relates generally to digital lithography, and more particularly to printed masks and methods of using a single said mask for etching and plating, for example in the manufacture of solar cell devices. Background technique

[0002] Digital inkjet lithography is a well-established technology designed to reduce the costs associated with photolithography processes, which are commonly used in the fabrication of microelectronic devices, integrated circuits, and related structures. Digital lithography deposits material directly on a substrate in a desired pattern, replacing the delicate and time-consuming photolithography process used in conventional device fabrication. One application of digital lithography is the formation of masks (referred to herein as "print-patterned masks") for subsequent processing (eg, plating, etching, implantation, etc.).

[0003] Typically, digital lithography involves depositing printed material by moving a ...

Claims

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