Photosensitive resin composition, cured product thereof, and printed wiring board

Inactive Publication Date: 2013-02-28
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0015]The photosensitive resin composition of the present invention having high tinting strength and excellent resolution property has enabled provision of a solder resist layer that simultaneously satisfies high

Problems solved by technology

Namely, when a solder resist has insufficient tinting strength, contamination and discoloring of a copper circuit formed on a printed wiring board become prominent, which decreases the appearance of the printed wiring board significantly.
Furthermore, a step of mounting, which is a post step in the production of printed wiring boards, has been automated recently, and parts are attached by machines; however, a defect that a solder resist and a copper circuit cannot be recognized well during image recognition occurs.
This phenomenon is also problematic in AOI (Automatic Optical Inspection) that is a final inspection of printed wiring boards.
However, although conventional black solder resists are preferable in view of tinting strength (concealing pro

Method used

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  • Photosensitive resin composition, cured product thereof, and printed wiring board

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examples

[0096]Hereinafter the present embodiment will be explained with referring to Examples and Comparative Examples, but it is needless to say that the present invention is not limited by the following Examples. In addition, unless otherwise indicated, the “part(s)” represents “part(s) by mass” in all of the following cases.

[0097]220 parts of a cresol novolak type epoxy resin (“EPICLON N-695” manufactured by DIC, epoxy equivalent amount: 220) was put into a four-necked flask equipped with a stirrer and a reflux condenser, and 214 parts of carbitol acetate was added thereto and dissolved by heating. Next, 0.46 part of hydroquinone as a polymerization inhibitor and 1.38 parts of triphenylphosphine as a reaction catalyst were added. This mixture was heated to from 95 to 105° C., 72 parts of acrylic acid was gradually added dropwise, and the mixture was reacted for 16 hours. This reaction product was cooled to from 80 to 90° C., 106 parts of tetrahydrophthalic acid anhydride was added, the m...

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Abstract

Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.

Description

TECHNICAL FIELD[0001]The present invention relates to a photosensitive resin composition and a cured product thereof, and a printed wiring board having a solder resist layer composed of the cured product.BACKGROUND ART[0002]Alkali-developing type photosensitive resin compositions are widely used as solder resists for printed wiring boards. The solder resists aim at protecting circuits of printed wiring boards, and the tinting strength thereof is an important property that significantly affects the appearance of printed wiring boards and the concealing property of circuits.[0003]Namely, when a solder resist has insufficient tinting strength, contamination and discoloring of a copper circuit formed on a printed wiring board become prominent, which decreases the appearance of the printed wiring board significantly. Furthermore, a step of mounting, which is a post step in the production of printed wiring boards, has been automated recently, and parts are attached by machines; however, a...

Claims

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Application Information

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IPC IPC(8): C08L35/02H05K3/00H05K1/02
CPCH05K3/287H05K2203/161G03F7/0007G03F7/032H05K3/0076H05K1/0296H05K1/0373H05K3/0055G03F7/105Y10T428/31938G03F7/0045G03F7/027G03F7/20G03F7/2002
Inventor UETA, CHIHOKAMATA, SEIRYO
Owner TAIYO INK MFG
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