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Photosensitive Resin Composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition and dry film resist, and can solve the problems of deterioration of storage stability of photosensitive resin composition, instability of adhesion aid, and no disclosure, etc. , to achieve the effects of excellent storage stability, good adhesion, and excellent pattern formation

Active Publication Date: 2012-04-25
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the adhesion aid itself is unstable, there is a tendency to deteriorate the storage stability of the photosensitive resin composition, and this point cannot be said to be sufficiently resolved.
[0009] In addition, the following Patent Document 2 describes a photosensitive resin composition containing 0.001 to 5 parts by mass of a polyfunctional thiol compound having two or more mercapto groups in one molecule. The effects of adhesion aids for substrates, but the effects of improving adhesion to ITO films and storage stability are not disclosed

Method used

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  • Photosensitive Resin Composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10、 comparative example 1～3

[0131] First, the preparation method of the sample for evaluation of an Example and a comparative example is demonstrated, Next, the evaluation method of the obtained sample and its evaluation result are shown.

[0132] 1. Preparation of evaluation samples

[0133] Samples for evaluation in Examples and Comparative Examples were prepared as follows.

[0134]

[0135] The photosensitive resin composition and the solvent with the composition shown in the following Table 1 (wherein, the numbers of each component represent the compounding amount (parts by mass) in terms of solid content.) were sufficiently stirred and mixed to prepare a photosensitive resin composition The prepared solution is uniformly coated on the surface of a 16 μm thick polyethylene terephthalate film as a support using a bar coater, and dried in a dryer at 95°C for 2.5 minutes to form a photosensitive resin layer . The thickness of the photosensitive resin layer was 25 μm.

[0136] Next, on the surface ...

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PUM

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Abstract

Disclosed are: a photosensitive resin composition having excellent chemical resistance, excellent adhesion to ITO films, and excellent storage stability; and a photosensitive resin laminate comprising the photosensitive resin composition. The photosensitive resin composition comprises (A) 40 to 90% by mass of an alkali-soluble resin, (B) 5 to 50% by mass of a compound having an ethylenically unsaturated double bond, (C) 1 to 20% by mass of a photopolymerization initiator, (D) 0.001 to 2.5% by mass of an epoxysilane compound, and (E) 0.005 to 1.0% by mass of a thiol compound.

Description

technical field [0001] The present invention relates to a photosensitive resin composition capable of being developed with an alkaline aqueous solution, and a dry film resist using the composition. More specifically, the present invention relates to a photosensitive resin composition suitable for forming an ITO electrode and etching (chemical etching) of an iron-based alloy in the manufacture of display materials for flat panel displays, and a dry film resist using the composition. etchant. Background technique [0002] Conventionally, printed circuit boards, precision machining of metals, and the like have been manufactured by photolithography. The photolithography method refers to the following method: apply a photosensitive resin composition on a substrate, perform pattern exposure to polymerize and cure the exposed part of the photosensitive resin composition, and remove the unexposed part with a developing solution to form a resist on the substrate. After performing e...

Claims

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Application Information

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IPC IPC(8): G03F7/004C08F2/46H05K3/06
CPCH05K3/0076C08F2/38G03F7/038H05K3/389G03F7/0275G03F7/0755C08F2/48
Inventor 国松真一小谷雄三
Owner ASAHI KASEI KK
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