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Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of reduced resolution and easy collapse of resist patterns, etc., and achieve the effects of excellent resolution, excellent adhesion, and excellent flexibility

Active Publication Date: 2015-07-15
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the flexibility is increased, the resist pattern tends to collapse, and as a result, the resolution tends to decrease.

Method used

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  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7 and comparative example 1～5

[0175] (Preparation of photosensitive resin composition solution)

[0176] Components (A) to (E) and dyes shown in Table 2 and Table 3 were mixed with 9 g of acetone, 5 g of toluene, and 5 g of methanol at the compounding amounts (unit g) shown in Table 2 and Table 3 to prepare and implement them respectively. The solution of the photosensitive resin composition of Examples 1-7 and Comparative Examples 1-5. The compounding quantity of (A) component shown in Table 2 and Table 3 is the mass (amount of solid content) of a non-volatile matter. The details of each component shown in Table 2 and Table 3 are as follows. In addition, "-" in Table 2 and Table 3 means not compounding.

[0177] (A) Binder polymer

[0178] [Synthesis of Binder Polymer (A-1)]

[0179] 90g of methacrylic acid, 6g of methyl methacrylate, 150g of styrene and 54g of benzyl methacrylate (mass ratio 30 / 2 / 50 / 18) and azobisisobutyronitrile as polymerizable monomers 1.5 g of the solution obtained by mixing was...

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Abstract

The present invention provides a photosensitive resin composition which contains: a binder polymer that has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or α-methyl styrene, and a structural unit derived from benzyl (meth)acrylate; a photopolymerizable compound containing a first bisphenol di(meth)acrylate which has an ethyleneoxy group and a propyleneoxy group, and wherein the number of structural units of the ethyleneoxy group is 1-20 and the number of structural units of the propyleneoxy group is 2-7, with the total number of structural units of the ethyleneoxy group and the propyleneoxy group being more than 10; and a photopolymerization initiator.

Description

technical field [0001] The present invention relates to a method for forming a photosensitive resin composition, a photosensitive element, and a resist pattern, and a printed wiring board. Background technique [0002] In the field of manufacturing a printed wiring board, a photosensitive resin composition is widely used as a resist material used for an etching process or a plating process. The photosensitive resin composition is often used as a photosensitive element (laminated body) having a support film and a layer (hereinafter also referred to as "photosensitive resin composition layer") formed using the photosensitive resin composition on the support film. [0003] A printed wiring board is manufactured, for example as follows. First, a photosensitive resin composition layer of a photosensitive element is formed (laminated) on a circuit-forming substrate (photosensitive layer forming step). Next, after the support film is peeled and removed, a predetermined portion of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027C08F20/30C08L25/02C08L33/14G03F7/004G03F7/031G03F7/033G03F7/40H05K3/06H05K3/18
CPCH05K3/108G03F7/031H05K3/184H05K3/0076G03F7/033H05K3/064G03F7/027C09D4/06C08F212/08C08F220/1807C08F220/06C08F220/14C08F20/30G03F7/028H05K3/06H05K3/18G03F7/004G03F7/2002G03F7/40H05K3/0017H05K3/188
Inventor 冈出翔太宫坂昌宏村松有纪子
Owner RESONAC CORPORATION
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