The invention provides an FPC circuit pattern making method, and the method comprises the steps: employing UV light curing ink for replacing a conventional dry film and other photoresists, carrying out the UV light curing of an FPC sheet material after ink printing, enabling a UV light curing ink to be hardened but not completely solidified, and forming a protection film layer with a pattern; enabling the protection film layer to be hardened but not transferred (not to be solidified on an FPC), forming a temporary anti-corrosion protection film layer, thereby enabling the protection film layerto be easily peeled off after etching, reducing the steps of dry film pasting, silent standing and hardening and development, enabling the efficiency to be high, enabling the flow to be simple, saving the manufacturing cost of equipment and development auxiliary materials, and reducing the cost. The FPC can be directly transferred out of a yellow region for operation after the UV light curing, sothe time is short and the impact on employees is small.