Circuit forming method of circuit board

Abstract

The invention discloses a circuit forming method of a circuit board, and belongs to the technical field of photolithography technique. The method comprises steps: A) combining a base material and copper foil to serve as a substrate; B) punching a required hole; C) arranging a film on the surface of the copper foil; D, developing the film; E, performing graphical surface treatment on the surface ofthe copper foil to form a surface treatment layer on the surface of the copper foil; F, stripping the film; G, performing differential etching on the surface of the copper foil; and H, performing inkprinting at the corresponding position. The surface-treated non-copper substance thinner than the wet film or the dry film is adopted for differential etching, so that the updating speed of the etching solution on the surface of the to-be-etched part is higher during etching, the difference of contact between the etching solution and a copper surface is reduced, and finer circuit etching is realized. Compared with the traditional process, the surface treatment process in the method avoids long-time contact between the base material at the bottom edge of the circuit and the surface treatment liquid medicine before etching, and improves the binding force between the copper surface circuit and the base material.

Description

technical field [0001] The invention relates to the technical field of photolithography technology, in particular to a circuit forming method of a circuit board. Background technique [0002] As people's requirements for the size reduction and cost reduction of electronic equipment are getting higher and higher, in response to this requirement, the wiring of circuit boards is becoming more and more dense, that is, the line spacing and line width are gradually reduced, and The strength of this delicate line that tends to become thinner and thinner is also getting weaker. In the manufacture of circuit boards, the traditional circuit forming method is to form a window on the copper surface through a wet film or a dry film for circuit etching. This method is directly affected by the thickness of the wet film or dry film, and the contact time between the etching solution and the copper surface Become the core of production management. [0003] The traditional line forming metho...

AI Technical Summary

Problems solved by technology

[0006] 1. The traditional circuit forming method forms a window on the copper surface through a wet film or a dry film for circuit etching. In this method, the quality of the circuit forming is directly affected by the thickness of the wet film or dry film, and at the same time, the contact between the etching solution and the copper surface Time becomes the core of production management, and management difficulty increases;

[0007] 2. Affected by the wet film or dry film thickness, the linearity of the line is poor, and burrs are prone to appear;

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