40results about "Printed circuit coating" patented technology

The invention provides a charge control electric field driven jet micro-nano 3D printing curved surface conformal multilayer circuit method and system. A high-precision conformal thin film dielectric layer is formed by utilizing charge injection electrowetting and contact electric field driving jet micro-nano 3D printing; and the high-resolution curved surface conformal circuit is manufactured by combining active residual charge elimination and non-contact electric field driving spray deposition micro-nano 3D printing. Through organic combination of active charge regulation and control and electric field driven jet micro-nano 3D printing, a high-precision conformal film dielectric layer and conductive layer conformal circuit and an interlayer interconnection circuit thereof are integrally printed. According to the curved surface conformal multilayer circuit manufacturing method, efficient, low-cost, high-precision and uniform manufacturing of the curved surface conformal multilayer circuit is achieved.

A coating apparatus 10 for applying a film-forming liquid to a peripheral edge of a board while moving a board and a coating unit 20 relative to each other, wherein the coating unit 20 includes a coating mechanism 21 and an extension mechanism 30, and wherein the coating mechanism 21 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board, and wherein the extension mechanism 30 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board. The extension mechanism 30 has an extension part 31 that extends the film-forming liquid applied by the application part 22 to the peripheral edge face and the peripheral upper and lower faces of the board in the form of a thin film, and a force mechanism 34 that forces the extension part 31 toward the peripheral edge face and the peripheral upper and lower faces of the board, and the extension part 31 is configured to be removable without removing the force mechanism 34 from the extension mechanism 30.

The invention belongs to the technical field of flexible copper-clad plate production, and particularly relates to a pressing machine for flexible copper-clad plate processing. The gluing system is arranged in the shell and is used for coating glue on the surface of the base film; the glue scraping mechanism is connected with the glue coating system and is used for scraping the glue solution coated on the surface of the base film; and the glue solution recovery system is symmetrically and adjustably arranged at the discharging end of the pressing roller set and used for scraping and recovering the glue solution overflowing from the two sides of the flexible copper-clad plate due to pressing connection and conveying the glue solution to the gluing system for secondary use. Through the arrangement of the glue solution recovery system, the glue solution overflowing due to press fit of the flexible copper-clad plate can be automatically scraped into and collected into the glue collection box through the glue guide scraping block, and the glue solution is recycled and reused through the connection of the glue conveying pump and the glue inlet nozzle in the gluing system, so that the production efficiency is improved, and meanwhile, the waste of production materials is reduced.

To provide a light irradiation device capable of performing uniform and efficient light irradiation on an edge surface and a peripheral edge part of each side of a substrate.SOLUTION: A light irradiation device (ultraviolet irradiation device 90) for emitting light on a peripheral edge part of a substrate to which a film forming liquid is applied by a coating device and curing the film forming liquid, comprises: a lifting stage (UV irradiation stage 91) that can be lifted while the substrate is placed thereon; a light irradiation unit 95 that is disposed around a lifting space of the lifting stage and emits light on the peripheral edge part of the substrate; and a rotation mechanism 96 for rotating the light irradiation unit 95 such that a light irradiation surface of the light irradiation unit 95 adjacently faces at least upper and lower surfaces of the peripheral edge part of the substrate.SELECTED DRAWING: Figure 15

To provide a system and method for applying a coating to a substrate.SOLUTION: A coating system includes: a coating station 24 for applying a coating material to the substrate, where the coating station has a bottom portion; an oven 34 for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion; and a first lift 28 for transporting the substrate from the coating station to the oven. The system can also include an inspection station 54 for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.SELECTED DRAWING: Figure 4

The present invention discloses an inkjet printing system and an inkjet printing method using the same. According to one embodiment of the present invention, the inkjet printing system may include: a platform for mounting a printing medium and for moving the printing medium in a first direction; an inkjet head capable of moving in a second direction orthogonal to the first direction and having a plurality of nozzles capable of ejecting ink onto the printing medium; a measuring instrument capable of moving in the second direction independently of the inkjet head and capable of measuring the height of each section of a coating layer landed on the printing medium; and a processor capable of controlling the opening and closing of the nozzles based on the coating layer height information.

The invention relates to a method for applying a protective coating (5) to a printed circuit board (1) populated with electrical / electronic components (3), wherein a liquid protective agent is sprayed onto the printed circuit board (1) by means of a nozzle (11) and cured to obtain the protective coating (5). It is provided that the protective agent (5) comprises a polymer and a solvent as a carrier substance for the polymer, and that the solvent is reduced on its way from the nozzle (11) to the printed circuit board (1) in order to obtain an at least substantially solvent-free protective coating (5).

The present invention relates to a printed circuit board for a battery pack capable of measuring temperature and a method for manufacturing same. The printed circuit board for a battery pack according to the present invention, capable of measuring temperature and provided in a battery pack including a plurality of secondary batteries, includes: a film; a conductive pattern provided on a first portion of the film; and a temperature element provided on a second portion of the film and measuring the temperature inside the battery pack.

The present application provides a pattern forming method and an inkjet printing device, which are high in precision, free from streaks or mottling, uniform in insulating and conductive properties, and good in adhesion of a coating film. The pattern forming method is characterized in that, in a manner in which a plurality of times of movement in a direction perpendicular to and parallel with a nozzle row direction of an ink ejection device in which a plurality of nozzle holes are arranged in the nozzle row direction are performed to eject droplets of ink from nozzles against a substrate as a printing medium to form a pattern, an ink having a ratio η2 / η1 of a viscosity η1 at a temperature at the time of ejection and a viscosity η2 at a temperature at the time of landing of 100 or more is used as the ink, and control is performed in such a manner that, in correspondence with a gray scale or a density of each pixel of the image data constituting the pattern, a liquid amount of the ink used in formation of a coating film of a dot constituting the pattern formed on the substrate and an adjacent dot do not have a constant periodicity, and the coating film as a whole of the pattern is non-uniform.

The present invention relates to a method of coating or surface treatment, in which a substrate holder (2) and a slot die head (3) are provided. The slot die head has a slit nozzle (4). A substrate (5) is placed on the substrate holder. The substrate is moved relative to the slit nozzle such that liquid is deposited on the substrate by supplying a conductive liquid onto the substrate through the slit nozzle. A potential difference is applied between the slit nozzle and the substrate by a power source (6) while supplying the conductive liquid to the substrate through the slit nozzle. The power source applies a first potential to the slit nozzle and a second, different potential to the substrate.

An object of the present invention is to provide a method for forming a pattern by inkjet printing, which is highly precise and free of streaks and mottled unevenness, has uniform insulating and conductive properties, and provides good adhesion of the coating film. [Solution] The pattern formation method of the present invention is a method of forming a pattern by ejecting ink droplets from the nozzles onto a substrate as a printing medium by moving multiple times perpendicularly and parallel to the nozzle row direction of an ink ejection device in which multiple nozzle holes are arranged in a row, wherein the ink used has a ratio η2 / η1 of viscosity η1 at the temperature at the time of ejection to viscosity η2 at the temperature at the time of impact of 100 or more, and is characterized in that the amount of ink used to form a coating of dots that constitute the pattern formed on the substrate is controlled so that it does not have a fixed periodicity with adjacent dots and is not uniform as a whole, in accordance with the gradation or density of each pixel that constitutes the image data of the pattern.

The invention discloses a packaging method and packaging equipment of a PCBA (Printed Circuit Board Assembly) board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board, the maximum height of the electronic component relative to the surface of the printed circuit board is smaller than 1 cm, and the packaging method comprises the steps that in the glue spraying process, a glue spraying assembly is controlled to spray UV glue liquid to a target glue spraying area of the PCBA board in a linear back-and-forth movement mode in the horizontal direction. According to the packaging method of the PCBA board, the UV glue solution is sprayed to the area, needing to be protected, of the PCBA board through the glue spraying assembly, and packaging protection of electronic components is achieved.

A method for depositing material onto an electronic substrate using a supply system includes: acquiring images of a first feature portion of a first component and a second feature portion of an adjacent second component; executing a measurement command to measure the actual distance of the gap between the first feature portion of the first component and the second feature portion of the second component; dividing the length of the gap into segments and determining the gap width for each segment; determining the number of dots to be supplied by the supply unit for each segment based on the gap width; and performing a supply operation for each segment.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

The present disclosure provides a dispenser for discharging a material onto a substrate. The dispenser includes a pair of rails, a heating device, and a pair of lifting devices. One of the pair of rails is movable in the Y-axis direction toward or away from the other to adjust the distance between the pair of rails. Each rail has a support surface and a blocking portion above the support surface for supporting the substrate in the transfer position. The blocking portion is used to maintain the substrate in the discharge position. The heating device is disposed below the pair of rails in the Z-axis direction and is movable in the Z-axis direction. The pair of lifting devices are respectively attached to the pair of rails and each include a lifting member movably connected to the rail and a return member between the rail and the lifting member. The lifting member can be pushed by the heating device to rise and lift the substrate from the transfer position to the discharge position, and can be lowered from the discharge position to the transfer position by the action of the return member when the heating device descends.

The invention discloses a preparation method of a PTFE (polytetrafluoroethylene) copper-clad plate with high peeling strength, which comprises the following steps: grafting itaconic acid to the surface of a PTFE prepreg, then covering copper foils on the two surfaces of the PTFE prepreg, and then carrying out high-temperature laminated sintering treatment to obtain the PTFE copper-clad plate. The invention also claims to protect the PTFE copper-clad plate prepared by the method. According to the preparation method of the high-peeling-strength PTFE copper-clad plate, PTFE molecules in the PTFE prepreg are subjected to grafting modification treatment through itaconic acid, so that the characteristic of low surface energy of PTFE is effectively improved, the binding force between the PTFE and the copper foil is greatly enhanced, and the dielectric property of the PTFE copper-clad plate is not damaged; meanwhile, the production process is green, environment-friendly and pollution-free, and the preparation method is short in time consumption, simple to operate and convenient for industrial large-scale production and application.

The present application provides a hard-flex board and a method for making the same, wherein the method for making the hard-flex board includes: providing a flexible substrate; laminating a layer of flexible resin-coated copper foil on the two opposite sides of the flexible substrate to obtain a soft board layer; wherein the flexible resin-coated copper foil includes a resin layer, an insulating layer and a copper foil layer in sequence, and the copper foil layer is arranged on the side away from the flexible substrate; pasting a peelable adhesive on the surface of the flexible resin-coated copper foil at the position to be opened; laminating a semi-cured sheet and a resin copper foil layer on the surface of the flexible resin-coated copper foil and the peelable adhesive in sequence to obtain a hard board layer; wherein the resin copper foil layer includes at least one insulating layer and two copper foil layers located on the opposite sides of the insulating layer; removing the hard board layer at the position to be opened by using the peelable adhesive to obtain a hard-flex board. By means of the above method, the production process is reduced and the cost is reduced.

The present disclosure provides a hydrophobic low-dielectric-constant film and a preparation method therefor. The low-dielectric-constant film is formed from one or more fluorine-containing compounds A by means of a plasma enhanced chemical vapor deposition method, and the one or more fluorine-containing compounds comprise a compound having the general formula CxSiyOmHnF2x+2y−n+2 or CxSiyOmHnF2x+2y−n, x being an integer from 1 to 20, y being an integer from 0 to 8, m being an integer from 0 to 6, and n being 0, 3, 6, 7, 9, 10, 12, 13, 15, 16, 17 and 19. Thus, a nano-film having a low dielectric constant and good hydrophobicity is formed on the surface of a substrate.

A method of depositing material on an electronic substrate with a dispensing system includes acquiring an image of a first feature of a first component and an adjacent second feature of a second component, performing a measure command to measure an actual distance of a gap between the first feature of the first component and the second feature of the second component, dividing the length of the gap into segments to determine a gap width for each segment, based on the gap width, determining a number of dots to be dispensed by the dispensing unit for each segment, and performing the dispense operation for each segment.

The application provides a printed circuit board, a preparation method thereof and a display device. The printed circuit board comprises a hard board area and a soft board area. The soft board area is located at the periphery of a first edge of the hard board area. The printed circuit board of the hard board area comprises a substrate, an adhesive film, a cover film and a first metal layer which are stacked on one side of the substrate. The adhesive film is arranged close to the substrate. The cover film is provided with a flow guide groove on the surface close to the adhesive film. The flow guide groove extends to a second edge of the hard board area. By arranging the flow guide groove on the surface of the cover film close to the adhesive film and extending the flow guide groove to the second edge of the hard board area, the overflow of the adhesive film can be effectively guided to the periphery of the second edge through the flow guide groove. Since the soft board area is located at the periphery of the first edge, the overflow of the adhesive film to the soft board area can be effectively reduced, the reserved overflow space of the printed circuit board is reduced, and the size of the printed circuit board is reduced.

A method for forming an electrical circuit according to the present disclosure includes: a wiring forming step of forming a metal wiring on a resin layer; a first application step of applying a conductive fluid to a predetermined mounting position of an electrode of the electronic component on the metal wiring; a first curing step for curing the conductive fluid applied in the first application step; a second application step for applying a conductive fluid onto the conductive fluid cured in the first curing step; a mounting step for mounting an electronic component such that an electrode is in contact with the conductive fluid coated in the second coating step; and a second curing step for curing the conductive fluid coated in the second coating step after mounting the electronic component in the mounting step.

The present disclosure provides a dispenser for discharging a material onto a substrate. The dispenser includes a pair of rails, a heating device, and a pair of lifting devices. One of the pair of rails is movable in the Y-axis direction toward or away from the other to adjust the distance between the pair of rails. Each rail has a support surface and a blocking portion above the support surface for supporting the substrate in the transfer position. The blocking portion is used to maintain the substrate in the discharge position. The heating device is disposed below the pair of rails in the Z-axis direction and is movable in the Z-axis direction. The pair of lifting devices are respectively attached to the pair of rails and each include a lifting member movably connected to the rail and a return member between the rail and the lifting member. The lifting member can be pushed by the heating device to rise and lift the substrate from the transfer position to the discharge position, and can be lowered from the discharge position to the transfer position by the action of the return member when the heating device descends.

The purpose of the present invention is to provide an application device of which an extending portion can be easily replaced and cleaned, for example, and that has excellent maintainability and improved stability of an extending operation by the extending portion. An application device 10 applies a film-forming liquid onto a peripheral portion of a substrate while the substrate and an application unit 20 are moved relative to each other. The application unit 20 includes an application mechanism 21 and an extension mechanism 30. The application mechanism 21 comprises an applying portion 22 that applies the film-forming liquid onto at least a peripheral-portion end surface of the substrate. The extension mechanism 30 comprises: an extending portion 31 that extends the film-forming liquid applied by the applying portion 22 into a thin film on the peripheral-portion end surface of the substrate and the upper and lower surfaces of the peripheral portion; and a biasing mechanism 34 that biases the extending portion 31 toward the peripheral-portion end surface of the substrate and the upper and lower surfaces of the peripheral portion. The application device 10 is configured such that the extending portion 31 can be removed without removing the biasing mechanism 34 from the extension mechanism 30.

The invention relates to a system and a method for coating a substrate. A system and method for applying a coating to a substrate is disclosed. The system comprises: a coating station for applying a coating material to a substrate, where the coating station has a bottom portion; an oven for curing the coating material on the substrate, where the oven is vertically positioned below the bottom portion; and a first lift table for transferring the substrate from the coating table to the oven. The system may also include an inspection station for inspecting the substrate. Each individual element of the coating system, including the coating console, the first lift table, the oven, and the inspection console, may define an individual kit of modules.

The invention relates to the technical field of PCB manufacturing, and discloses a manufacturing method of a 30 oz ultra-thick copper double-sided PCB. According to the invention, through the manufacturing process of preferentially completing the manufacturing of the outer-layer circuit and then completing the manufacturing of the inner-layer circuit, and carrying out pre-pressing glue filling, the problem of single-time large-scale glue filling caused by 30 oz range in the traditional method is decomposed into two controllable 15 oz glue filling processes, so that the quality risks of lack of glue in pressing, deviation and the like are eliminated from the source, and the production efficiency is improved. The mechanical strength of the circuit and the stability of an inner layer etching pattern are enhanced; the laser cutting bonding sheet is adopted to precisely join the circuit and is matched with the pressing pad to enhance glue filling, so that the board warping problem caused by traditional manual glue filling is avoided, meanwhile, the range of the solder mask surface is reduced to the conventional level through the pre-leveling process, the solder mask frequency is reduced, the process time is greatly shortened, and the production efficiency is improved. And the defects of blistering, cracking and the like caused by multiple times of baking can be overcome, so that the production efficiency and the product consistency of the PCB are improved.

The present invention provides an injection molded product, the purpose of which is to form a sealing material on a through-hole, thereby suppressing the sealing material from flowing through the conductive material filled in the through-hole by heat and resin pressure during resin injection, thereby preventing the conductive layers formed on both sides of the base sheet from being broken. The injection molded product (10) is in the shape of a flat rectangular parallelepiped, and comprises a flat molded resin body (11) composed of injection molding resin and a base sheet (40) fixed to the surface of the molded resin body (11). The base sheet (40) has a first conductive layer (44) and a through-hole (43) extending from the first side (41) to the second side (42) formed on the first side (41). The through-hole (43) is filled with conductive material, and a second conductive layer (45) is formed in a manner electrically connected to the first conductive layer (44) via the filled conductive material. In addition, a sealing material (46) is formed on the first conductive layer (44) in a manner covering the through-hole (43). The molded resin body (11) is fixed to the first surface (41) side of the base sheet (40) in a manner covering the sealing material (46).

The invention relates to the technical field of power substrates, in particular to a power substrate based on an aluminum silicon carbide material and a preparation method thereof, and the preparation method comprises the following steps: firstly printing an insulating film on the surface of an aluminum silicon carbide substrate, then printing and sintering a conductor welding spot, then welding a component, and welding a power device by a reflow soldering process for welding the component. Aluminum silicon carbide is adopted as a base material, an insulating film is firstly printed on the base material through a thick film technology, welding spots and the like for welding are printed on the insulating film, then components can be welded, and finally paint or glue is coated for protection. The insulating layer adopts a silicon resin system which is better matched with the thermal expansion coefficient of aluminum silicon carbide.