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75results about "Printed circuit coating" patented technology
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Glass substrate pressure-stabilizing spraying disc device
The invention provides a glass substrate pressure-stabilizing spraying disc device, and relates to the field of pressure-stabilizing spraying discs, the glass substrate pressure-stabilizing spraying disc device comprises symmetrically arranged frames and filtering assemblies arranged at the bottoms of the frames, connecting steel plates are symmetrically mounted at the tops of the frames, and four groups of spraying discs are uniformly arranged on the inner sides of the frames from top to bottom; three groups of water tanks are vertically distributed on the side walls of the four groups of spraying discs at intervals, the two ends and the middle parts of the four groups of water tanks are communicated, liquid outlet holes are uniformly formed in the water tanks, the liquid outlet holes penetrate through the spraying discs, sealing covers are arranged on the outer sides of the spraying discs, and the sealing covers are matched with the water tanks. The frame is fixedly connected with the external eccentric wheel, the linear sliding rail is arranged to be matched with the external electric push rod and the fiber steel plate, the gap between the frame and the plate is adjusted, liquid medicine pressure distribution in different areas is adjusted in the mode that the spraying disc is adjusted in different areas, and then liquid medicine distribution is more uniform.
Owner:SHENZHEN TECHSTAR PRECISION IND CO LTD
Micro-nano 3D printing curved surface conformal multilayer circuit manufacturing method and system based on charge control
The invention provides a charge control electric field driven jet micro-nano 3D printing curved surface conformal multilayer circuit method and system. A high-precision conformal thin film dielectric layer is formed by utilizing charge injection electrowetting and contact electric field driving jet micro-nano 3D printing; and the high-resolution curved surface conformal circuit is manufactured by combining active residual charge elimination and non-contact electric field driving spray deposition micro-nano 3D printing. Through organic combination of active charge regulation and control and electric field driven jet micro-nano 3D printing, a high-precision conformal film dielectric layer and conductive layer conformal circuit and an interlayer interconnection circuit thereof are integrally printed. According to the curved surface conformal multilayer circuit manufacturing method, efficient, low-cost, high-precision and uniform manufacturing of the curved surface conformal multilayer circuit is achieved.
Owner:QINGDAO UNIV OF TECH +2
Packaging method and packaging device for PCBA board
PendingUS20240431033A1Final product manufactureTreatment using electric/magnetic/electromagnetic fieldsElectronic componentPrinted circuit board
The disclosure discloses a packaging method and a packaging device for a PCBA board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board; the maximum height of the electronic element relative to surface of the printed circuit board is less than 1 cm. The packaging method comprising: during glue spraying process, controlling a glue spraying assembly to spray UV glue liquid to a target spraying area of the PCBA board by moving back and forth in a straight line in a horizontal direction. The packaging method for a PCBA board provided by the present disclosure realizes packaging and protection of electronic components by spraying UV glue liquid to an area of the PCBA board that needs protection by the glue spraying assembly.
Owner:SUZHOU KONIG ELECTRONICS TECH CO LTD
Coating apparatus, dryer, light irradiation device and coating system
PendingUS20260077375A1Liquid surface applicatorsDrying solid materials with heatLight irradiationCoating system
A coating apparatus 10 for applying a film-forming liquid to a peripheral edge of a board while moving a board and a coating unit 20 relative to each other, wherein the coating unit 20 includes a coating mechanism 21 and an extension mechanism 30, and wherein the coating mechanism 21 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board, and wherein the extension mechanism 30 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board. The extension mechanism 30 has an extension part 31 that extends the film-forming liquid applied by the application part 22 to the peripheral edge face and the peripheral upper and lower faces of the board in the form of a thin film, and a force mechanism 34 that forces the extension part 31 toward the peripheral edge face and the peripheral upper and lower faces of the board, and the extension part 31 is configured to be removable without removing the force mechanism 34 from the extension mechanism 30.
Owner:ENATECH CORP
Pressing machine for processing flexible copper-clad plate
The invention belongs to the technical field of flexible copper-clad plate production, and particularly relates to a pressing machine for flexible copper-clad plate processing. The gluing system is arranged in the shell and is used for coating glue on the surface of the base film; the glue scraping mechanism is connected with the glue coating system and is used for scraping the glue solution coated on the surface of the base film; and the glue solution recovery system is symmetrically and adjustably arranged at the discharging end of the pressing roller set and used for scraping and recovering the glue solution overflowing from the two sides of the flexible copper-clad plate due to pressing connection and conveying the glue solution to the gluing system for secondary use. Through the arrangement of the glue solution recovery system, the glue solution overflowing due to press fit of the flexible copper-clad plate can be automatically scraped into and collected into the glue collection box through the glue guide scraping block, and the glue solution is recycled and reused through the connection of the glue conveying pump and the glue inlet nozzle in the gluing system, so that the production efficiency is improved, and meanwhile, the waste of production materials is reduced.
Owner:JINAN GUOJI TECH (ANHUI) CO LTD
Light irradiation device, dryer, and coating system
PendingJP2025142264ALiquid surface applicatorsDrying solid materials with heatPhoto irradiationCoating system
To provide a light irradiation device capable of performing uniform and efficient light irradiation on an edge surface and a peripheral edge part of each side of a substrate.SOLUTION: A light irradiation device (ultraviolet irradiation device 90) for emitting light on a peripheral edge part of a substrate to which a film forming liquid is applied by a coating device and curing the film forming liquid, comprises: a lifting stage (UV irradiation stage 91) that can be lifted while the substrate is placed thereon; a light irradiation unit 95 that is disposed around a lifting space of the lifting stage and emits light on the peripheral edge part of the substrate; and a rotation mechanism 96 for rotating the light irradiation unit 95 such that a light irradiation surface of the light irradiation unit 95 adjacently faces at least upper and lower surfaces of the peripheral edge part of the substrate.SELECTED DRAWING: Figure 15
Owner:ENATECH CORP
Dispense volume adjustment based on gap width of located features
A method of depositing material on an electronic substrate with a dispensing system includes acquiring an image of a first feature of a first component and an adjacent second feature of a second component, performing a measure command to measure an actual distance of a gap between the first feature of the first component and the second feature of the second component, dividing the length of the gap into segments to determine a gap width for each segment, based on the gap width, determining a number of dots to be dispensed by the dispensing unit for each segment, and performing the dispense operation for each segment.
Owner:ILLINOIS TOOL WORKS INC
Reel-to-reel circuit board manufacturing apparatus
ActiveCN115915610BLiquid surface applicatorsConductive pattern formationManufactured apparatusMechanical engineering
Owner:HAESUNG CO LTD
Systems and methods for coating substrates
To provide a system and method for applying a coating to a substrate.SOLUTION: A coating system includes: a coating station 24 for applying a coating material to the substrate, where the coating station has a bottom portion; an oven 34 for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion; and a first lift 28 for transporting the substrate from the coating station to the oven. The system can also include an inspection station 54 for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.SELECTED DRAWING: Figure 4
Owner:NORDSON CORP
Inkjet printing system and inkjet printing method using the same
The present invention discloses an inkjet printing system and an inkjet printing method using the same. According to one embodiment of the present invention, the inkjet printing system may include: a platform for mounting a printing medium and for moving the printing medium in a first direction; an inkjet head capable of moving in a second direction orthogonal to the first direction and having a plurality of nozzles capable of ejecting ink onto the printing medium; a measuring instrument capable of moving in the second direction independently of the inkjet head and capable of measuring the height of each section of a coating layer landed on the printing medium; and a processor capable of controlling the opening and closing of the nozzles based on the coating layer height information.
Owner:SYST BRANCH CORP
A solder resist developing system
The invention discloses a solder mask developing system, which relates to printed circuit board developing, and comprises: a developing machine, which is used for spraying developing liquid on the printed circuit board; and a hole washing device, which is used for flushing water into the conductive holes of the printed circuit board; wherein, there are at least two developing machines, and the hole washing device is arranged between the two developing machines, which helps to clean the ink in the conductive holes.
Owner:TIANHUA MACHINE EQUIP CO LTD
Method for applying a protective coating, protective coating system
The invention relates to a method for applying a protective coating (5) to a printed circuit board (1) populated with electrical / electronic components (3), wherein a liquid protective agent is sprayed onto the printed circuit board (1) by means of a nozzle (11) and cured to obtain the protective coating (5). It is provided that the protective agent (5) comprises a polymer and a solvent as a carrier substance for the polymer, and that the solvent is reduced on its way from the nozzle (11) to the printed circuit board (1) in order to obtain an at least substantially solvent-free protective coating (5).
Owner:ROBERT BOSCH GMBH
Battery pack printed circuit board capable of measuring temperature, and manufacturing method therefor
The present invention relates to a printed circuit board for a battery pack capable of measuring temperature and a method for manufacturing same. The printed circuit board for a battery pack according to the present invention, capable of measuring temperature and provided in a battery pack including a plurality of secondary batteries, includes: a film; a conductive pattern provided on a first portion of the film; and a temperature element provided on a second portion of the film and measuring the temperature inside the battery pack.
Owner:LG ENERGY SOLUTION LTD
Pattern forming method and inkjet printing apparatus
The present application provides a pattern forming method and an inkjet printing device, which are high in precision, free from streaks or mottling, uniform in insulating and conductive properties, and good in adhesion of a coating film. The pattern forming method is characterized in that, in a manner in which a plurality of times of movement in a direction perpendicular to and parallel with a nozzle row direction of an ink ejection device in which a plurality of nozzle holes are arranged in the nozzle row direction are performed to eject droplets of ink from nozzles against a substrate as a printing medium to form a pattern, an ink having a ratio η2 / η1 of a viscosity η1 at a temperature at the time of ejection and a viscosity η2 at a temperature at the time of landing of 100 or more is used as the ink, and control is performed in such a manner that, in correspondence with a gray scale or a density of each pixel of the image data constituting the pattern, a liquid amount of the ink used in formation of a coating film of a dot constituting the pattern formed on the substrate and an adjacent dot do not have a constant periodicity, and the coating film as a whole of the pattern is non-uniform.
Owner:KONICA MINOLTA INC
Coating or surface treatment method and apparatus
The present invention relates to a method of coating or surface treatment, in which a substrate holder (2) and a slot die head (3) are provided. The slot die head has a slit nozzle (4). A substrate (5) is placed on the substrate holder. The substrate is moved relative to the slit nozzle such that liquid is deposited on the substrate by supplying a conductive liquid onto the substrate through the slit nozzle. A potential difference is applied between the slit nozzle and the substrate by a power source (6) while supplying the conductive liquid to the substrate through the slit nozzle. The power source applies a first potential to the slit nozzle and a second, different potential to the substrate.
Owner:FEPOD OY LTD
Pattern forming method and inkjet printing device
An object of the present invention is to provide a method for forming a pattern by inkjet printing, which is highly precise and free of streaks and mottled unevenness, has uniform insulating and conductive properties, and provides good adhesion of the coating film. [Solution] The pattern formation method of the present invention is a method of forming a pattern by ejecting ink droplets from the nozzles onto a substrate as a printing medium by moving multiple times perpendicularly and parallel to the nozzle row direction of an ink ejection device in which multiple nozzle holes are arranged in a row, wherein the ink used has a ratio η2 / η1 of viscosity η1 at the temperature at the time of ejection to viscosity η2 at the temperature at the time of impact of 100 or more, and is characterized in that the amount of ink used to form a coating of dots that constitute the pattern formed on the substrate is controlled so that it does not have a fixed periodicity with adjacent dots and is not uniform as a whole, in accordance with the gradation or density of each pixel that constitutes the image data of the pattern.
Owner:KONICA MINOLTA INC
Packaging method and packaging equipment for PCBA (Printed Circuit Board Assembly)
PendingCN121262751AFinal product manufactureTreatment using electric/magnetic/electromagnetic fieldsElectronic componentPrinted circuit board
The invention discloses a packaging method and packaging equipment of a PCBA (Printed Circuit Board Assembly) board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board, the maximum height of the electronic component relative to the surface of the printed circuit board is smaller than 1 cm, and the packaging method comprises the steps that in the glue spraying process, a glue spraying assembly is controlled to spray UV glue liquid to a target glue spraying area of the PCBA board in a linear back-and-forth movement mode in the horizontal direction. According to the packaging method of the PCBA board, the UV glue solution is sprayed to the area, needing to be protected, of the PCBA board through the glue spraying assembly, and packaging protection of electronic components is achieved.
Owner:SUZHOU KONIG ELECTRONICS TECH CO LTD
Adjustment of supply quantity based on the gap width of the localized feature area
A method for depositing material onto an electronic substrate using a supply system includes: acquiring images of a first feature portion of a first component and a second feature portion of an adjacent second component; executing a measurement command to measure the actual distance of the gap between the first feature portion of the first component and the second feature portion of the second component; dividing the length of the gap into segments and determining the gap width for each segment; determining the number of dots to be supplied by the supply unit for each segment based on the gap width; and performing a supply operation for each segment.
Owner:ILLINOIS TOOL WORKS INC
Systems and methods for printing conformal materials on component edges at high resolution
Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.
Owner:IO TECH GRP LTD
Dispenser and lifting device for the dispenser
ActiveJP2025518962APrinted circuit assemblingLiquid surface applicatorsClassical mechanicsSupport surface
The present disclosure provides a dispenser for discharging a material onto a substrate. The dispenser includes a pair of rails, a heating device, and a pair of lifting devices. One of the pair of rails is movable in the Y-axis direction toward or away from the other to adjust the distance between the pair of rails. Each rail has a support surface and a blocking portion above the support surface for supporting the substrate in the transfer position. The blocking portion is used to maintain the substrate in the discharge position. The heating device is disposed below the pair of rails in the Z-axis direction and is movable in the Z-axis direction. The pair of lifting devices are respectively attached to the pair of rails and each include a lifting member movably connected to the rail and a return member between the rail and the lifting member. The lifting member can be pushed by the heating device to rise and lift the substrate from the transfer position to the discharge position, and can be lowered from the discharge position to the transfer position by the action of the return member when the heating device descends.
Owner:ILLINOIS TOOL WORKS INC
PTFE (Polytetrafluoroethylene) copper-clad plate with high peeling strength and preparation method of PTFE copper-clad plate
PendingCN120902291ALamination ancillary operationsSynthetic resin layered productsPolymer scienceItaconic acid
The invention discloses a preparation method of a PTFE (polytetrafluoroethylene) copper-clad plate with high peeling strength, which comprises the following steps: grafting itaconic acid to the surface of a PTFE prepreg, then covering copper foils on the two surfaces of the PTFE prepreg, and then carrying out high-temperature laminated sintering treatment to obtain the PTFE copper-clad plate. The invention also claims to protect the PTFE copper-clad plate prepared by the method. According to the preparation method of the high-peeling-strength PTFE copper-clad plate, PTFE molecules in the PTFE prepreg are subjected to grafting modification treatment through itaconic acid, so that the characteristic of low surface energy of PTFE is effectively improved, the binding force between the PTFE and the copper foil is greatly enhanced, and the dielectric property of the PTFE copper-clad plate is not damaged; meanwhile, the production process is green, environment-friendly and pollution-free, and the preparation method is short in time consumption, simple to operate and convenient for industrial large-scale production and application.
Owner:SOLOMON (CHANGZHOU) ALLOY NEW MATERIAL CO LTD +1
Circuit board with anti-corrosion properties and electronic device having the same
A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.
Owner:CHAMP TECH OPTICAL (FOSHAN) CORP
A rigid-flex printed circuit board and its manufacturing method
The present application provides a hard-flex board and a method for making the same, wherein the method for making the hard-flex board includes: providing a flexible substrate; laminating a layer of flexible resin-coated copper foil on the two opposite sides of the flexible substrate to obtain a soft board layer; wherein the flexible resin-coated copper foil includes a resin layer, an insulating layer and a copper foil layer in sequence, and the copper foil layer is arranged on the side away from the flexible substrate; pasting a peelable adhesive on the surface of the flexible resin-coated copper foil at the position to be opened; laminating a semi-cured sheet and a resin copper foil layer on the surface of the flexible resin-coated copper foil and the peelable adhesive in sequence to obtain a hard board layer; wherein the resin copper foil layer includes at least one insulating layer and two copper foil layers located on the opposite sides of the insulating layer; removing the hard board layer at the position to be opened by using the peelable adhesive to obtain a hard-flex board. By means of the above method, the production process is reduced and the cost is reduced.
Owner:SHENNAN CIRCUITS
Hydrophobic low-dielectric-constant film and preparation method therefor
The present disclosure provides a hydrophobic low-dielectric-constant film and a preparation method therefor. The low-dielectric-constant film is formed from one or more fluorine-containing compounds A by means of a plasma enhanced chemical vapor deposition method, and the one or more fluorine-containing compounds comprise a compound having the general formula CxSiyOmHnF2x+2y−n+2 or CxSiyOmHnF2x+2y−n, x being an integer from 1 to 20, y being an integer from 0 to 8, m being an integer from 0 to 6, and n being 0, 3, 6, 7, 9, 10, 12, 13, 15, 16, 17 and 19. Thus, a nano-film having a low dielectric constant and good hydrophobicity is formed on the surface of a substrate.
Owner:JIANGSU FAVORED NANOTECHNOLOGY CO LTD
Dispense volume adjustment based on gap width of located features
A method of depositing material on an electronic substrate with a dispensing system includes acquiring an image of a first feature of a first component and an adjacent second feature of a second component, performing a measure command to measure an actual distance of a gap between the first feature of the first component and the second feature of the second component, dividing the length of the gap into segments to determine a gap width for each segment, based on the gap width, determining a number of dots to be dispensed by the dispensing unit for each segment, and performing the dispense operation for each segment.
Owner:ILLINOIS TOOL WORKS INC
Automatic printing press
ActiveCN108393244BImprove yieldsave human effortLiquid surface applicatorsCoatingsProcess engineeringPrinting press
The automatic printing machine of the present invention comprises a printing table, a transmission mechanism, a front material storage mechanism and a rear material storage mechanism, the printing table is provided with a printing slot; the transmission mechanism is arranged under the printing table, and the front material storage mechanism and the rear material storage mechanism are arranged at both ends of the transmission mechanism; the transmission mechanism can transmit the printing substrate between the front material storage mechanism and the printing mechanism, and between the printing mechanism and the rear material storage mechanism, and the transmission mechanism can also push the printing substrate into the printing slot and has a retraction stroke. The entire printing process of the automatic printing machine includes the automated processes of loading, alignment, printing and unloading, the printing consistency of the printing substrate is good, the yield of the product is improved, and manpower is saved.
Owner:JIANGMEN JUNEWAY ELECTRONIC TECH CO LTD
Gas cushion apparatus and technique for substrate coating
To provide a gas cushion apparatus and technique for substrate coating.SOLUTION: Coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system by using a gas cushion. For example, liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after printing patterned liquid. The substrate can be conveyed to a treatment zone while supported by using the gas cushion. The liquid coating can be treated to provide the solid layer while continuing to support the substrate by using the gas cushion.SELECTED DRAWING: Figure 2
Owner:KATEEVA INC
Printed circuit board for battery pack capable of measuring temperature and its manufacturing method
PendingJP2025502430AThermometer detailsCell temperature controlPhysical chemistryPrinted circuit board
The present invention relates to a printed circuit board for a battery pack capable of measuring temperature and a manufacturing method thereof. The printed circuit board for a battery pack capable of measuring temperature according to the present invention is a printed circuit board provided in a battery pack including a plurality of secondary batteries, and includes a film, a conductive pattern provided in a first portion of the film, and a temperature element provided in a second portion of the film for measuring the temperature inside the battery pack.
Owner:LG ENERGY SOLUTION LTD
Dispenser and lifting device of dispenser
Owner:ILLINOIS TOOL WORKS INC
A glass substrate pressure stabilizing spray plate device
The present application provides a glass substrate pressure-stabilizing spray disc device, which relates to the field of pressure-stabilizing spray discs, including a symmetrically arranged frame and a filter assembly arranged at the bottom of the frame, a connecting steel plate symmetrically installed on the top of the frame, four groups of spray discs evenly arranged on the inner side of the frame from top to bottom, three groups of water troughs are arranged on the side walls of the four groups of spray discs at intervals up and down, and the two ends and the middle of the four groups of water troughs are all connected, and liquid outlet holes are evenly arranged inside the water troughs, and the liquid outlet holes pass through the spray discs, and a sealing cover is arranged on the outer side of the spray disc, and the sealing cover matches the water trough. The present application achieves the adjustment of the gap between the frame and the plate by fixedly connecting the frame with an external eccentric wheel, and by setting a linear slide rail to cooperate with an external electric push rod and a fiber steel plate, and adjusts the pressure distribution of the liquid medicine in different areas by adjusting the spray disc in different areas, thereby making the distribution of the liquid medicine more uniform.
Owner:SHENZHEN TECHSTAR PRECISION IND CO LTD