16results about "Printed circuit coating" patented technology

A coating apparatus 10 for applying a film-forming liquid to a peripheral edge of a board while moving a board and a coating unit 20 relative to each other, wherein the coating unit 20 includes a coating mechanism 21 and an extension mechanism 30, and wherein the coating mechanism 21 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board, and wherein the extension mechanism 30 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board. The extension mechanism 30 has an extension part 31 that extends the film-forming liquid applied by the application part 22 to the peripheral edge face and the peripheral upper and lower faces of the board in the form of a thin film, and a force mechanism 34 that forces the extension part 31 toward the peripheral edge face and the peripheral upper and lower faces of the board, and the extension part 31 is configured to be removable without removing the force mechanism 34 from the extension mechanism 30.

To provide a system and method for applying a coating to a substrate.SOLUTION: A coating system includes: a coating station 24 for applying a coating material to the substrate, where the coating station has a bottom portion; an oven 34 for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion; and a first lift 28 for transporting the substrate from the coating station to the oven. The system can also include an inspection station 54 for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.SELECTED DRAWING: Figure 4

The invention relates to a method for applying a protective coating (5) to a printed circuit board (1) populated with electrical / electronic components (3), wherein a liquid protective agent is sprayed onto the printed circuit board (1) by means of a nozzle (11) and cured to obtain the protective coating (5). It is provided that the protective agent (5) comprises a polymer and a solvent as a carrier substance for the polymer, and that the solvent is reduced on its way from the nozzle (11) to the printed circuit board (1) in order to obtain an at least substantially solvent-free protective coating (5).

The present application provides a pattern forming method and an inkjet printing device, which are high in precision, free from streaks or mottling, uniform in insulating and conductive properties, and good in adhesion of a coating film. The pattern forming method is characterized in that, in a manner in which a plurality of times of movement in a direction perpendicular to and parallel with a nozzle row direction of an ink ejection device in which a plurality of nozzle holes are arranged in the nozzle row direction are performed to eject droplets of ink from nozzles against a substrate as a printing medium to form a pattern, an ink having a ratio η2 / η1 of a viscosity η1 at a temperature at the time of ejection and a viscosity η2 at a temperature at the time of landing of 100 or more is used as the ink, and control is performed in such a manner that, in correspondence with a gray scale or a density of each pixel of the image data constituting the pattern, a liquid amount of the ink used in formation of a coating film of a dot constituting the pattern formed on the substrate and an adjacent dot do not have a constant periodicity, and the coating film as a whole of the pattern is non-uniform.

An object of the present invention is to provide a method for forming a pattern by inkjet printing, which is highly precise and free of streaks and mottled unevenness, has uniform insulating and conductive properties, and provides good adhesion of the coating film. [Solution] The pattern formation method of the present invention is a method of forming a pattern by ejecting ink droplets from the nozzles onto a substrate as a printing medium by moving multiple times perpendicularly and parallel to the nozzle row direction of an ink ejection device in which multiple nozzle holes are arranged in a row, wherein the ink used has a ratio η2 / η1 of viscosity η1 at the temperature at the time of ejection to viscosity η2 at the temperature at the time of impact of 100 or more, and is characterized in that the amount of ink used to form a coating of dots that constitute the pattern formed on the substrate is controlled so that it does not have a fixed periodicity with adjacent dots and is not uniform as a whole, in accordance with the gradation or density of each pixel that constitutes the image data of the pattern.

The invention discloses a packaging method and packaging equipment of a PCBA (Printed Circuit Board Assembly) board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board, the maximum height of the electronic component relative to the surface of the printed circuit board is smaller than 1 cm, and the packaging method comprises the steps that in the glue spraying process, a glue spraying assembly is controlled to spray UV glue liquid to a target glue spraying area of the PCBA board in a linear back-and-forth movement mode in the horizontal direction. According to the packaging method of the PCBA board, the UV glue solution is sprayed to the area, needing to be protected, of the PCBA board through the glue spraying assembly, and packaging protection of electronic components is achieved.

A method for depositing material onto an electronic substrate using a supply system includes: acquiring images of a first feature portion of a first component and a second feature portion of an adjacent second component; executing a measurement command to measure the actual distance of the gap between the first feature portion of the first component and the second feature portion of the second component; dividing the length of the gap into segments and determining the gap width for each segment; determining the number of dots to be supplied by the supply unit for each segment based on the gap width; and performing a supply operation for each segment.

A method of depositing material on an electronic substrate with a dispensing system includes acquiring an image of a first feature of a first component and an adjacent second feature of a second component, performing a measure command to measure an actual distance of a gap between the first feature of the first component and the second feature of the second component, dividing the length of the gap into segments to determine a gap width for each segment, based on the gap width, determining a number of dots to be dispensed by the dispensing unit for each segment, and performing the dispense operation for each segment.

The present disclosure provides a dispenser for discharging a material onto a substrate. The dispenser includes a pair of rails, a heating device, and a pair of lifting devices. One of the pair of rails is movable in the Y-axis direction toward or away from the other to adjust the distance between the pair of rails. Each rail has a support surface and a blocking portion above the support surface for supporting the substrate in the transfer position. The blocking portion is used to maintain the substrate in the discharge position. The heating device is disposed below the pair of rails in the Z-axis direction and is movable in the Z-axis direction. The pair of lifting devices are respectively attached to the pair of rails and each include a lifting member movably connected to the rail and a return member between the rail and the lifting member. The lifting member can be pushed by the heating device to rise and lift the substrate from the transfer position to the discharge position, and can be lowered from the discharge position to the transfer position by the action of the return member when the heating device descends.

The invention relates to the technical field of PCB manufacturing, and discloses a manufacturing method of a 30 oz ultra-thick copper double-sided PCB. According to the invention, through the manufacturing process of preferentially completing the manufacturing of the outer-layer circuit and then completing the manufacturing of the inner-layer circuit, and carrying out pre-pressing glue filling, the problem of single-time large-scale glue filling caused by 30 oz range in the traditional method is decomposed into two controllable 15 oz glue filling processes, so that the quality risks of lack of glue in pressing, deviation and the like are eliminated from the source, and the production efficiency is improved. The mechanical strength of the circuit and the stability of an inner layer etching pattern are enhanced; the laser cutting bonding sheet is adopted to precisely join the circuit and is matched with the pressing pad to enhance glue filling, so that the board warping problem caused by traditional manual glue filling is avoided, meanwhile, the range of the solder mask surface is reduced to the conventional level through the pre-leveling process, the solder mask frequency is reduced, the process time is greatly shortened, and the production efficiency is improved. And the defects of blistering, cracking and the like caused by multiple times of baking can be overcome, so that the production efficiency and the product consistency of the PCB are improved.

The invention discloses a PCB (printed circuit board) based on solder resist ink and a preparation process thereof, relates to the technical field of printed circuit boards, and provides the preparation process of the PCB, the PCB is coated with the solder resist ink, so that the PCB has good dielectric property, the water resistance can be improved, and the service life of the PCB is prolonged. And safe operation of the circuit board is protected permanently. According to the invention, methacrylate double bonds are introduced into the light-cured o-cresol formaldehyde epoxy resin, so that rapid curing of UV is realized. The urushiol modified epoxy resin is added, and a benzene ring side chain of urushiol is copolymerized with the epoxy resin to form a rigid framework, so that the heat resistance and water resistance of the ink are improved.

The invention discloses an ultrathin jumper-free grouting line and a preparation method thereof. The ultrathin jumper-free grouting line comprises a color frame, an upper PET (polyethylene terephthalate) layer, a glue layer and a lower PET layer which are sequentially arranged from top to bottom, the upper-layer conductive silver paste is arranged between the color frame and the upper-layer PET, the middle-layer conductive silver paste is arranged between the upper-layer PET and the glue layer, the lower-layer conductive silver paste is arranged between the glue layer and the lower-layer PET, the upper-layer PET is provided with a plurality of first filling holes used for connecting the upper-layer conductive silver paste and the middle-layer conductive silver paste, and the glue layer is provided with a plurality of through holes. The thin film circuit has the advantages that the conduction of the upper layer conductive silver paste and the lower layer conductive silver paste is realized by filling holes in the upper layer PET of the whole circuit, and the UV glue of the existing thin film circuit and a jumper laid on the UV glue are omitted, so that the UV glue does not need to be consumed when the circuit is prepared, the cost is saved, and the height of the whole circuit is reduced. And meanwhile, connection between UV glue and a silver paste circuit is not needed any more, operation steps are omitted, the preparation process is simplified, and preparation is facilitated.

The present invention addresses the problem of providing a method of pattern formation by ink-jet printing, with which high-density printing with no streak or inconsistency is obtained, uniform insulating properties and conductive properties are obtained, and a print with high adhesion is obtained. The method of pattern formation of the present invention is a method of forming a pattern by ejecting ink droplets onto a substrate, which serves as a print medium from nozzles of an ink ejecting device, which has a plurality of nozzle holes arranged in a line, while moving multiple times perpendicularly to or in parallel with the column direction of the nozzles, the method being characterized in that a ratio η2 / η1 of the ink is at least 100, where η1 is a viscosity at a temperature of ejected ink and η2 is a viscosity at a temperature of ink dropped onto the substrate, and, correspondingly to the gradation or density of pixels constituting the image data of the pattern, the volume of the ink used for forming a print of dots constituting the pattern formed on the substrate is controlled so as not to have certain periodicity with adjacent dots or uniformity over the print of the pattern.

The application relates to the technical field of power substrates, in particular to a power substrate based on aluminum silicon carbide and a preparation method thereof, which comprises the following steps: first, printing an insulating film on the surface of an aluminum silicon carbide base, then printing a conductor soldering point and sintering, and then welding a component, wherein the power device is welded by a reflow soldering process. In the application, aluminum silicon carbide is used as a base material, an insulating film is first printed on the base material by a thick film process, a soldering point for welding is printed on the insulating film, and then a component can be welded, and finally paint or glue is coated for protection; the insulating layer adopts a silicon resin system, and is more matched with the thermal expansion coefficient of aluminum silicon carbide.