28results about "Printed circuit coating" patented technology

A coating apparatus 10 for applying a film-forming liquid to a peripheral edge of a board while moving a board and a coating unit 20 relative to each other, wherein the coating unit 20 includes a coating mechanism 21 and an extension mechanism 30, and wherein the coating mechanism 21 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board, and wherein the extension mechanism 30 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board. The extension mechanism 30 has an extension part 31 that extends the film-forming liquid applied by the application part 22 to the peripheral edge face and the peripheral upper and lower faces of the board in the form of a thin film, and a force mechanism 34 that forces the extension part 31 toward the peripheral edge face and the peripheral upper and lower faces of the board, and the extension part 31 is configured to be removable without removing the force mechanism 34 from the extension mechanism 30.

To provide a light irradiation device capable of performing uniform and efficient light irradiation on an edge surface and a peripheral edge part of each side of a substrate.SOLUTION: A light irradiation device (ultraviolet irradiation device 90) for emitting light on a peripheral edge part of a substrate to which a film forming liquid is applied by a coating device and curing the film forming liquid, comprises: a lifting stage (UV irradiation stage 91) that can be lifted while the substrate is placed thereon; a light irradiation unit 95 that is disposed around a lifting space of the lifting stage and emits light on the peripheral edge part of the substrate; and a rotation mechanism 96 for rotating the light irradiation unit 95 such that a light irradiation surface of the light irradiation unit 95 adjacently faces at least upper and lower surfaces of the peripheral edge part of the substrate.SELECTED DRAWING: Figure 15

To provide a system and method for applying a coating to a substrate.SOLUTION: A coating system includes: a coating station 24 for applying a coating material to the substrate, where the coating station has a bottom portion; an oven 34 for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion; and a first lift 28 for transporting the substrate from the coating station to the oven. The system can also include an inspection station 54 for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.SELECTED DRAWING: Figure 4

The present invention discloses an inkjet printing system and an inkjet printing method using the same. According to one embodiment of the present invention, the inkjet printing system may include: a platform for mounting a printing medium and for moving the printing medium in a first direction; an inkjet head capable of moving in a second direction orthogonal to the first direction and having a plurality of nozzles capable of ejecting ink onto the printing medium; a measuring instrument capable of moving in the second direction independently of the inkjet head and capable of measuring the height of each section of a coating layer landed on the printing medium; and a processor capable of controlling the opening and closing of the nozzles based on the coating layer height information.

The invention relates to a method for applying a protective coating (5) to a printed circuit board (1) populated with electrical / electronic components (3), wherein a liquid protective agent is sprayed onto the printed circuit board (1) by means of a nozzle (11) and cured to obtain the protective coating (5). It is provided that the protective agent (5) comprises a polymer and a solvent as a carrier substance for the polymer, and that the solvent is reduced on its way from the nozzle (11) to the printed circuit board (1) in order to obtain an at least substantially solvent-free protective coating (5).

The present application provides a pattern forming method and an inkjet printing device, which are high in precision, free from streaks or mottling, uniform in insulating and conductive properties, and good in adhesion of a coating film. The pattern forming method is characterized in that, in a manner in which a plurality of times of movement in a direction perpendicular to and parallel with a nozzle row direction of an ink ejection device in which a plurality of nozzle holes are arranged in the nozzle row direction are performed to eject droplets of ink from nozzles against a substrate as a printing medium to form a pattern, an ink having a ratio η2 / η1 of a viscosity η1 at a temperature at the time of ejection and a viscosity η2 at a temperature at the time of landing of 100 or more is used as the ink, and control is performed in such a manner that, in correspondence with a gray scale or a density of each pixel of the image data constituting the pattern, a liquid amount of the ink used in formation of a coating film of a dot constituting the pattern formed on the substrate and an adjacent dot do not have a constant periodicity, and the coating film as a whole of the pattern is non-uniform.

An object of the present invention is to provide a method for forming a pattern by inkjet printing, which is highly precise and free of streaks and mottled unevenness, has uniform insulating and conductive properties, and provides good adhesion of the coating film. [Solution] The pattern formation method of the present invention is a method of forming a pattern by ejecting ink droplets from the nozzles onto a substrate as a printing medium by moving multiple times perpendicularly and parallel to the nozzle row direction of an ink ejection device in which multiple nozzle holes are arranged in a row, wherein the ink used has a ratio η2 / η1 of viscosity η1 at the temperature at the time of ejection to viscosity η2 at the temperature at the time of impact of 100 or more, and is characterized in that the amount of ink used to form a coating of dots that constitute the pattern formed on the substrate is controlled so that it does not have a fixed periodicity with adjacent dots and is not uniform as a whole, in accordance with the gradation or density of each pixel that constitutes the image data of the pattern.

The invention discloses a packaging method and packaging equipment of a PCBA (Printed Circuit Board Assembly) board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board, the maximum height of the electronic component relative to the surface of the printed circuit board is smaller than 1 cm, and the packaging method comprises the steps that in the glue spraying process, a glue spraying assembly is controlled to spray UV glue liquid to a target glue spraying area of the PCBA board in a linear back-and-forth movement mode in the horizontal direction. According to the packaging method of the PCBA board, the UV glue solution is sprayed to the area, needing to be protected, of the PCBA board through the glue spraying assembly, and packaging protection of electronic components is achieved.

A method for depositing material onto an electronic substrate using a supply system includes: acquiring images of a first feature portion of a first component and a second feature portion of an adjacent second component; executing a measurement command to measure the actual distance of the gap between the first feature portion of the first component and the second feature portion of the second component; dividing the length of the gap into segments and determining the gap width for each segment; determining the number of dots to be supplied by the supply unit for each segment based on the gap width; and performing a supply operation for each segment.

The invention discloses a preparation method of a PTFE (polytetrafluoroethylene) copper-clad plate with high peeling strength, which comprises the following steps: grafting itaconic acid to the surface of a PTFE prepreg, then covering copper foils on the two surfaces of the PTFE prepreg, and then carrying out high-temperature laminated sintering treatment to obtain the PTFE copper-clad plate. The invention also claims to protect the PTFE copper-clad plate prepared by the method. According to the preparation method of the high-peeling-strength PTFE copper-clad plate, PTFE molecules in the PTFE prepreg are subjected to grafting modification treatment through itaconic acid, so that the characteristic of low surface energy of PTFE is effectively improved, the binding force between the PTFE and the copper foil is greatly enhanced, and the dielectric property of the PTFE copper-clad plate is not damaged; meanwhile, the production process is green, environment-friendly and pollution-free, and the preparation method is short in time consumption, simple to operate and convenient for industrial large-scale production and application.

A method of depositing material on an electronic substrate with a dispensing system includes acquiring an image of a first feature of a first component and an adjacent second feature of a second component, performing a measure command to measure an actual distance of a gap between the first feature of the first component and the second feature of the second component, dividing the length of the gap into segments to determine a gap width for each segment, based on the gap width, determining a number of dots to be dispensed by the dispensing unit for each segment, and performing the dispense operation for each segment.

The application provides a printed circuit board, a preparation method thereof and a display device. The printed circuit board comprises a hard board area and a soft board area. The soft board area is located at the periphery of a first edge of the hard board area. The printed circuit board of the hard board area comprises a substrate, an adhesive film, a cover film and a first metal layer which are stacked on one side of the substrate. The adhesive film is arranged close to the substrate. The cover film is provided with a flow guide groove on the surface close to the adhesive film. The flow guide groove extends to a second edge of the hard board area. By arranging the flow guide groove on the surface of the cover film close to the adhesive film and extending the flow guide groove to the second edge of the hard board area, the overflow of the adhesive film can be effectively guided to the periphery of the second edge through the flow guide groove. Since the soft board area is located at the periphery of the first edge, the overflow of the adhesive film to the soft board area can be effectively reduced, the reserved overflow space of the printed circuit board is reduced, and the size of the printed circuit board is reduced.

A method for forming an electrical circuit according to the present disclosure includes: a wiring forming step of forming a metal wiring on a resin layer; a first application step of applying a conductive fluid to a predetermined mounting position of an electrode of the electronic component on the metal wiring; a first curing step for curing the conductive fluid applied in the first application step; a second application step for applying a conductive fluid onto the conductive fluid cured in the first curing step; a mounting step for mounting an electronic component such that an electrode is in contact with the conductive fluid coated in the second coating step; and a second curing step for curing the conductive fluid coated in the second coating step after mounting the electronic component in the mounting step.

The present disclosure provides a dispenser for discharging a material onto a substrate. The dispenser includes a pair of rails, a heating device, and a pair of lifting devices. One of the pair of rails is movable in the Y-axis direction toward or away from the other to adjust the distance between the pair of rails. Each rail has a support surface and a blocking portion above the support surface for supporting the substrate in the transfer position. The blocking portion is used to maintain the substrate in the discharge position. The heating device is disposed below the pair of rails in the Z-axis direction and is movable in the Z-axis direction. The pair of lifting devices are respectively attached to the pair of rails and each include a lifting member movably connected to the rail and a return member between the rail and the lifting member. The lifting member can be pushed by the heating device to rise and lift the substrate from the transfer position to the discharge position, and can be lowered from the discharge position to the transfer position by the action of the return member when the heating device descends.

The purpose of the present invention is to provide an application device of which an extending portion can be easily replaced and cleaned, for example, and that has excellent maintainability and improved stability of an extending operation by the extending portion. An application device 10 applies a film-forming liquid onto a peripheral portion of a substrate while the substrate and an application unit 20 are moved relative to each other. The application unit 20 includes an application mechanism 21 and an extension mechanism 30. The application mechanism 21 comprises an applying portion 22 that applies the film-forming liquid onto at least a peripheral-portion end surface of the substrate. The extension mechanism 30 comprises: an extending portion 31 that extends the film-forming liquid applied by the applying portion 22 into a thin film on the peripheral-portion end surface of the substrate and the upper and lower surfaces of the peripheral portion; and a biasing mechanism 34 that biases the extending portion 31 toward the peripheral-portion end surface of the substrate and the upper and lower surfaces of the peripheral portion. The application device 10 is configured such that the extending portion 31 can be removed without removing the biasing mechanism 34 from the extension mechanism 30.

The invention relates to the technical field of PCB manufacturing, and discloses a manufacturing method of a 30 oz ultra-thick copper double-sided PCB. According to the invention, through the manufacturing process of preferentially completing the manufacturing of the outer-layer circuit and then completing the manufacturing of the inner-layer circuit, and carrying out pre-pressing glue filling, the problem of single-time large-scale glue filling caused by 30 oz range in the traditional method is decomposed into two controllable 15 oz glue filling processes, so that the quality risks of lack of glue in pressing, deviation and the like are eliminated from the source, and the production efficiency is improved. The mechanical strength of the circuit and the stability of an inner layer etching pattern are enhanced; the laser cutting bonding sheet is adopted to precisely join the circuit and is matched with the pressing pad to enhance glue filling, so that the board warping problem caused by traditional manual glue filling is avoided, meanwhile, the range of the solder mask surface is reduced to the conventional level through the pre-leveling process, the solder mask frequency is reduced, the process time is greatly shortened, and the production efficiency is improved. And the defects of blistering, cracking and the like caused by multiple times of baking can be overcome, so that the production efficiency and the product consistency of the PCB are improved.

The present invention provides an injection molded product, the purpose of which is to form a sealing material on a through-hole, thereby suppressing the sealing material from flowing through the conductive material filled in the through-hole by heat and resin pressure during resin injection, thereby preventing the conductive layers formed on both sides of the base sheet from being broken. The injection molded product (10) is in the shape of a flat rectangular parallelepiped, and comprises a flat molded resin body (11) composed of injection molding resin and a base sheet (40) fixed to the surface of the molded resin body (11). The base sheet (40) has a first conductive layer (44) and a through-hole (43) extending from the first side (41) to the second side (42) formed on the first side (41). The through-hole (43) is filled with conductive material, and a second conductive layer (45) is formed in a manner electrically connected to the first conductive layer (44) via the filled conductive material. In addition, a sealing material (46) is formed on the first conductive layer (44) in a manner covering the through-hole (43). The molded resin body (11) is fixed to the first surface (41) side of the base sheet (40) in a manner covering the sealing material (46).

The invention relates to the technical field of power substrates, in particular to a power substrate based on an aluminum silicon carbide material and a preparation method thereof, and the preparation method comprises the following steps: firstly printing an insulating film on the surface of an aluminum silicon carbide substrate, then printing and sintering a conductor welding spot, then welding a component, and welding a power device by a reflow soldering process for welding the component. Aluminum silicon carbide is adopted as a base material, an insulating film is firstly printed on the base material through a thick film technology, welding spots and the like for welding are printed on the insulating film, then components can be welded, and finally paint or glue is coated for protection. The insulating layer adopts a silicon resin system which is better matched with the thermal expansion coefficient of aluminum silicon carbide.

A method of depositing material on an electronic substrate using a dispensing system includes: acquiring an image of a first feature of a first component and an adjacent second feature of a second component; executing a measurement command to measure an actual distance of a gap between a first feature of the first component and a second feature of the second component; a length of the gap is divided into a plurality of segments to determine a gap width for each segment based on the gap width, determine a number of points assigned by the assignment unit for each segment, and perform an assignment operation for each segment.

The present invention provides a method and system for charge-controlled electric field-driven jet micro-nano 3D printing of curved surface conformal multilayer circuits. This method utilizes charge injection electrowetting and contact electric field-driven jet micro-nano 3D printing to form high-precision conformal thin-film dielectric layers. This method combines active residual charge elimination with non-contact electric field-driven jet deposition micro-nano 3D printing to produce high-resolution curved surface conformal circuits. By organically combining active charge control with electric field-driven jet micro-nano 3D printing, high-precision conformal thin-film dielectric layers and conductive layers, as well as their interlayer interconnects, can be integrated to print conformal circuits. This method achieves efficient, low-cost, high-precision, and uniform production of curved surface conformal multilayer circuits.

The invention discloses a PCB (printed circuit board) based on solder resist ink and a preparation process thereof, relates to the technical field of printed circuit boards, and provides the preparation process of the PCB, the PCB is coated with the solder resist ink, so that the PCB has good dielectric property, the water resistance can be improved, and the service life of the PCB is prolonged. And safe operation of the circuit board is protected permanently. According to the invention, methacrylate double bonds are introduced into the light-cured o-cresol formaldehyde epoxy resin, so that rapid curing of UV is realized. The urushiol modified epoxy resin is added, and a benzene ring side chain of urushiol is copolymerized with the epoxy resin to form a rigid framework, so that the heat resistance and water resistance of the ink are improved.

The invention discloses an ultrathin jumper-free grouting line and a preparation method thereof. The ultrathin jumper-free grouting line comprises a color frame, an upper PET (polyethylene terephthalate) layer, a glue layer and a lower PET layer which are sequentially arranged from top to bottom, the upper-layer conductive silver paste is arranged between the color frame and the upper-layer PET, the middle-layer conductive silver paste is arranged between the upper-layer PET and the glue layer, the lower-layer conductive silver paste is arranged between the glue layer and the lower-layer PET, the upper-layer PET is provided with a plurality of first filling holes used for connecting the upper-layer conductive silver paste and the middle-layer conductive silver paste, and the glue layer is provided with a plurality of through holes. The thin film circuit has the advantages that the conduction of the upper layer conductive silver paste and the lower layer conductive silver paste is realized by filling holes in the upper layer PET of the whole circuit, and the UV glue of the existing thin film circuit and a jumper laid on the UV glue are omitted, so that the UV glue does not need to be consumed when the circuit is prepared, the cost is saved, and the height of the whole circuit is reduced. And meanwhile, connection between UV glue and a silver paste circuit is not needed any more, operation steps are omitted, the preparation process is simplified, and preparation is facilitated.

The present invention addresses the problem of providing a method of pattern formation by ink-jet printing, with which high-density printing with no streak or inconsistency is obtained, uniform insulating properties and conductive properties are obtained, and a print with high adhesion is obtained. The method of pattern formation of the present invention is a method of forming a pattern by ejecting ink droplets onto a substrate, which serves as a print medium from nozzles of an ink ejecting device, which has a plurality of nozzle holes arranged in a line, while moving multiple times perpendicularly to or in parallel with the column direction of the nozzles, the method being characterized in that a ratio η2 / η1 of the ink is at least 100, where η1 is a viscosity at a temperature of ejected ink and η2 is a viscosity at a temperature of ink dropped onto the substrate, and, correspondingly to the gradation or density of pixels constituting the image data of the pattern, the volume of the ink used for forming a print of dots constituting the pattern formed on the substrate is controlled so as not to have certain periodicity with adjacent dots or uniformity over the print of the pattern.

The application relates to the technical field of power substrates, in particular to a power substrate based on aluminum silicon carbide and a preparation method thereof, which comprises the following steps: first, printing an insulating film on the surface of an aluminum silicon carbide base, then printing a conductor soldering point and sintering, and then welding a component, wherein the power device is welded by a reflow soldering process. In the application, aluminum silicon carbide is used as a base material, an insulating film is first printed on the base material by a thick film process, a soldering point for welding is printed on the insulating film, and then a component can be welded, and finally paint or glue is coated for protection; the insulating layer adopts a silicon resin system, and is more matched with the thermal expansion coefficient of aluminum silicon carbide.

The invention relates to a system for providing a painting program for coating a circuit board, populated with electronic components, conductor tracks and electronic contact faces of an assembly, with a protective paint by a coating machine, comprising: an input unit which is configured to read in data from a stored 3D model of the assembly; a painting region identification unit which is configured to automatically identify painting regions of the respective electronic components and / or of the conductor tracks and / or electronic contact faces of the assembly based on the read-in data of the assembly; a painting path determination unit which is configured to automatically determine at least one painting path for coating at least the electronic component of the assembly based on the identified painting regions; a computing unit which is configured to create the painting program based on the identified painting regions and the determined painting path; and an output unit which is configured to output the painting program created by the computing unit to the coating machine.