38results about "Fixed capacitors" patented technology

A semiconductor package includes a printed circuit board including a circuit pattern and a silicon capacitor connected to the circuit pattern, a semiconductor chip mounted on the printed circuit board, and an external connection terminal attached below the printed circuit board, wherein the silicon capacitor is a stacked structure of a plurality of substrate structures, each of the plurality of substrate structures includes a silicon substrate, a capacitor structure, a via electrode penetrating through the silicon substrate around the capacitor structure, an upper bump pad disposed on top of the via electrode, and a lower bump pad disposed below the via electrode, and, in the plurality of substrate structures, neighboring silicon substrates are bonded to each other through the upper bump pad and the lower bump pad facing each other.

The utility model discloses a capacitor protection assembly and a capacitor, and relates to the technical field of capacitors, and the capacitor protection assembly comprises a housing, a cover body, a support, and a conductive assembly. The shell is provided with a containing cavity for containing the capacitor assembly. The cover body is arranged at the opening of the containing cavity in a covering mode. The support is installed on the cover body, and at least part of the support is located in the containing cavity. The conductive assembly comprises a first conductive part and a second conductive part which are connected, the first conductive part is directly or indirectly connected with the cover body, and the second conductive part is installed on the support. The support is provided with an electric fence, the electric fence is arranged on the peripheral side of the second conductive part, when the capacitor assembly breaks down, the cover body expands in the direction away from the support, and the first conductive part and the second conductive part are disconnected. According to the capacitor protection assembly, the capacitor protection capability can be improved, and the fault probability of the capacitor is reduced.

A capacitor assembly package structure, capacitor structure and method of manufacturing the same, and electronic device. The capacitor assembly package structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other. The insulating package body is configured to encapsulate a plurality of the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. Each of the capacitor structures includes a sintered silver layer, and the sintered silver layer includes more than 95% pure silver material. The average thickness of the sintered silver layer can be less than or equal to 1 μm, and the resistivity of the sintered silver layer can be less than the resistivity of a silver glue material formed by mixing epoxy resin and silver powder.

A roughened-film production control method and system. The method comprises: S1, adjusting a melting temperature such that same is within a range from 230℃ to 240℃, and adjusting the temperature of sheet casting such that same is within a range from 80℃ to 90℃; S2, measuring the light transmittance of a longitudinally stretched thin film; S3, determining whether the light transmittance of the thin film is within a preset range; S4, if the light transmittance of the thin film is within the preset range, keeping the current melting temperature and the temperature of the sheet casting unchanged; and S5, if the light transmittance of the thin film is not within the preset range, adjusting, on the basis of the magnitude of the light transmittance of the thin film, the melting temperature and the temperature of the sheet casting according to a preset step length, and returning back to step S2. By means of testing the light transmittance of a longitudinally stretched thin film online, temperatures are controlled in melting and sheet casting stages, thereby realizing continuous control over the surface roughness and porosity of a capacitor thin film. The technical problems of it being difficult to apply an existing roughened-film drawing process to various roughened-film materials, the efficiency being low, and materials being wasted are solved.

The utility model discloses a chip capacitor implanting mechanism based on a thick rubber plate. The chip capacitor implanting mechanism comprises a mounting base, a mounting seat, an implanting device, an implanting conveying device and a motor vibration device, the implanting device comprises an implanting base plate, an implanting top plate and an implanting frame which are sequentially arranged at intervals from bottom to top, the implanting base plate and the implanting frame are connected through a vertically-extending supporting column, the implanting top plate is arranged between the implanting base plate and the implanting frame in a vertically-moving mode, and the conveying face of the implanting conveying device is located above the implanting top plate. According to the scheme, the motor vibration device is used for replacing an electromagnet in the prior art to achieve vibration implantation of the chip capacitor, the motor vibration device is driven by the motor, and the output end of the motor vibration device is only connected with the implantation device, so that the chip capacitor can be implanted after vibration acts on the implantation device in the implantation process; and then the chip capacitor positioned on the implanting device is driven to vibrate, and the chip capacitor is effectively implanted into the lead-in plate in cooperation with the swinging effect of the mounting seat.

An objective of the present invention is to provide a binder composition, for a dielectric layer, that can endow the dielectric layer with excellent crack resistance and lamination properties. The present invention pertains to the binder composition for the dielectric layer, the binder composition including a copolymer containing a cyano group-containing monomer unit and a (meth)acrylic acid ester monomer unit, wherein the content percentage of the cyano group-containing monomer unit is 10 mass% to 45 mass% when all repeating units contained in the copolymer are set as 100 mass%.

An energy storage device comprising a substrate comprising a groove having a first and a second face. A capacitor material in the groove. The first and the second face of the groove having a coat ofmetal. Wherein the coat of metal on the first face is not in electrical contact with the coat of metal on the second face.

The invention relates to a propulsion unit comprising: an electric motor (10), which includes an annular stator (11) about a longitudinal axis (X) and a rotor arranged radially inside the stator (11), so as to be rotated about the longitudinal axis (X); a power electronic module (20) suitable for supplying electricity to the electric motor (10), the power electronic module (20) comprising an annular casing (21) which extends along the longitudinal axis (X), the casing (21) of the power electronic module (20) comprising a first end disposed longitudinally opposite a first end of the stator (11) of the electric motor (10); means for cooling the electric motor (10) and the power electronic module (20), the cooling means comprising a heat sink (30) inserted longitudinally between the first end of the stator (11) of the electric motor (10) and the first end of the casing (21) of the power electronic module (20).

Describes an electrical tab and a manufacturing method. A method includes disposing a dielectric layer on a second side of a substrate that has a first side and a second side. The method includes developing the dielectric layer on the second side of the substrate. And, the method includes etching the first side of the substrate to form an electrode tab.

The present invention relates to the technical field of a dielectric ceramic powder manufacturing process, and particularly relates to tetragonal nanometer barium titanate powder, a manufacturing method thereof, and an application. The manufacturing method includes: (S.1) manufacturing a mesoporous titanium dioxide precursor with controllable crystal phase, adding it to a barium salt solution so that the molar ratio of barium to titanium is 2 to 4, then adding ethanol and aqueous ammonia to obtain a barium titanate precursor suspension in which the volume ratio of ethanol is 40% to 60%; (S.2) subjecting the barium titanate precursor suspension to a hydrothermal reaction to obtain a barium titanate suspension; and (S.3) centrifugally washing, drying, and pulverizing the barium titanate suspension to obtain tetragonal nanometer barium titanate powder. In the present application, by simultaneously controlling the molar ratio of barium to titanium between the anatase-type mesoporous titanium dioxide precursor and the barium salt in the hydrothermal reaction process and the ratio of ethanol in the hydrothermal medium in the hydrothermal reaction process, barium titanate powder having a higher c / a value and particle size uniformity can be obtained.

This capacitor comprises: a conductive base material; a first dielectric layer disposed on the base material; a first conductor disposed on the first dielectric layer and having a layer shape; a second dielectric layer disposed on the first conductor; and a second conductor disposed on the second dielectric layer. The first conductor includes an exposed section that is not covered by the second dielectric layer or the second conductor. The base material is electrically insulated from the first conductor by the first dielectric layer, and the second conductor is electrically insulated from the first conductor by the second dielectric layer. The base material includes a conduction unit which is electrically connected to the second conductor.

An integrated circuit assembly comprises a plurality of die connection points configured to couple to an integrated circuit die, and a plurality of external connection points configured to couple to external circuitry. A metal power signal trace and a metal ground signal trace are each coupled to at least a respective one of the plurality of die connection points to provide electrical power to the integrated circuit. A first metal-insulator-metal capacitor comprises a plurality of first extensions interleaved with a plurality of extensions of the metal power signal trace and is separated from the plurality of extensions of the metal power signal trace by an insulator. A second metal-insulator-metal capacitor comprises a plurality of second extensions interleaved with a plurality of extensions of the metal ground trace and is also separated from the plurality of extensions of the metal ground trace by an insulator.

The utility model discloses a slurry spreading mechanism for chip capacitor end sealing. The slurry spreading mechanism comprises a slurry disc, a slurry spreading assembly and a mounting bracket, the slurry spreading assembly comprises a slurry collecting cutter, a slurry spreading cutter and a cleaning cutter which are sequentially arranged from front to back in the moving direction of the slurry disc. According to the scheme, the slurry spreading assembly comprises the slurry collecting cutter and the slurry spreading cutter, the slurry collecting cutter and the slurry spreading cutter can move up and down relative to the installation support, in the slurry spreading process, slurry is firstly accumulated at the rear end of the slurry disc through the slurry collecting cutter, and then the accumulated slurry is flatly spread through the slurry spreading cutter according to the thickness requirement; therefore, the slurry preparation speed in the slurry soaking process can be effectively increased. In the slurry spreading process of the slurry spreading cutter, slurry may be adhered to the back of the slurry spreading cutter, so that in order to prevent waste of the slurry and avoid frequent addition of the slurry to the slurry disc, a cleaning cutter is additionally arranged on the rear side of the slurry spreading cutter, and the cleaning cutter can effectively clean the slurry adhered to the back of the slurry spreading cutter so as to avoid waste of the slurry.

A bushing (100) comprises a plurality of electrically conductive elements (1, 2a... 2c, 3, 4, 6) and at least one ultrasonic welded joint (10). The at least one ultrasonic weld joint is formed between the one conductive element and the other conductive element and mechanically and electrically connects the one conductive element and the other conductive element to each other.

An objective of the present invention is to provide a binder composition, for a dielectric layer, that can endow the dielectric layer with excellent crack resistance and lamination properties. The present invention pertains to the binder composition for the dielectric layer, the binder composition including a copolymer containing a cyano group-containing monomer unit and a (meth)acrylic acid ester monomer unit, wherein the content percentage of the cyano group-containing monomer unit is 10 mass% to 45 mass% when all repeating units contained in the copolymer are set as 100 mass%.

The utility model discloses a kind of patch capacitor plate changing mechanism based on thick rubber plate, including needle bed conveying device, partition frame clamping device, new board clamping device, new board conveying device and flattening device;Needle bed conveying device includes first conveying track and transfer platform, and transfer platform is horizontally movably installed in first conveying track;Partition frame clamping device and new board clamping device are successively erected above the end of first conveying track along the conveying direction of transfer platform, partition frame clamping device is used to clamp partition frame, new board clamping device is used to clamp empty thick rubber plate, and the clamp of partition frame clamping device and the clamp of new board clamping device can be moved up and down relative to transfer platform.This scheme changes the surface of patch capacitor from "same plate surface changing" to "plate changing", to avoid the problem that the edge of patch capacitor is exposed to porcelain, the end top appears crack, patch capacitor is pressed skew, etc., to ensure the end sealing quality of patch capacitor.

The application discloses a kind of intelligent power capacitor module with digital display, temperature sensor detects the temperature in capacitor and gives external controller, external controller controls the temperature of nixie tube display;Dial switch switches the working state of intelligent power capacitor module, and debugging state and working state are allowed to be selected by dial switch, external controller is in working state, the capacity that needs reactive power compensation in the circuit of switchboard is analyzed, to control the opening and closing of each relay to control the on-off of the A path and C path of two capacitors to compensate, to realize the switching of capacitor;Transformer converts the high voltage from miniature circuit breaker into low voltage for each relay;Indicator shows the state of capacitor switching and fault indication;Key is in working state for staff to switch the display content of nixie tube, switching display switching current, switching voltage and capacitor internal temperature.

A capacitor is provided with: a conductive base material; a first dielectric layer disposed on the substrate; a first conductor disposed on the first dielectric layer and having a layer shape; a second dielectric layer disposed on the first conductor; and a second conductor disposed on the second dielectric layer. The first conductor includes an exposed portion not covered by the second dielectric layer and the second conductor. The substrate is electrically insulated from the first conductor by the first dielectric layer, and the second conductor is electrically insulated from the first conductor by the second dielectric layer. The base material includes a conductive portion electrically connected to the second conductor.

The bushing includes a plurality of electrically conductive elements and at least one ultrasonic welding joint. The at least one ultrasonic welding joint is formed between one electrically conductive element and another electrically conductive element and mechanically and electrically connects the electrically conductive elements with each other.

An electrostatic device includes a top and a bottom silicon layer, around an insulating buried layer. A beam opening allows a beam of charged particles to travel through. The device is encapsulated in an insulating layer. One or more electrodes and ground planes are deposited on the insulating layer. These also cover the inside of the beam opening. Electrodes and ground planes are physically and electrically separated by micro-trenches and micro-undercuts that provide shadow areas when the conductive areas are deposited. Electrodes may be shaped as elongated islands and may include portions overhanging the top silicon layer, supported by electrode-anchors. Manufacturing starts from a single wafer including the top, buried, and bottom layers, or it starts from two separate silicon wafers. Manufacturing includes steps to form the top and bottom beam openings and microstructures, to encapsulate the device in an insulating layer, and to deposit electrodes and ground areas.

The utility model discloses a chip capacitor press-in mechanism based on a thick rubber plate. The chip capacitor press-in mechanism comprises a detection conveying device, a first cleaning device, a detection device, a press-in conveying device and a needle bed press-in device, the detection conveying device and the press-in conveying device are sequentially connected end to end, the press-in conveying device moves up and down relative to the detection conveying device, and the needle bed press-in device is located in the press-in conveying device; the first cleaning device and the detection device are sequentially arranged on the detection conveying device in the conveying direction of the detection conveying device. According to the scheme, firstly, the upper surface of the assembly is cleaned through the first cleaning device, so that products which are not implanted into the guide-in hole and / or products which are obliquely inserted into the guide-in hole on the surface of the guide-in plate are removed; and then whether foreign matters exist on the upper surface of the assembly is detected through the detection device, so that the subsequent press-in process is ensured to be smoothly carried out, and the conditions of product deformation, damaged needle of a needle bed, blockage of a guide-in hole / plate hole, damaged plate of a guide-in plate / thick rubber plate and the like can be effectively avoided.

Soluble water scavenger molecules for use with dielectric fluids are disclosed. An example dielectric fluid-based composition for reducing water content in a dielectric fluid may include a water-scavenging agent disposed within a dielectric fluid. The example dielectric fluid-based composition may further include the water-scavenging agent being soluble in the dielectric fluid. The example dielectric fluid-based composition may further include the water-scavenging agent being configured to react with water molecules in the dielectric fluid. The example dielectric fluid-based composition may be disposed in an electrical equipment immersed in oil. The electrical equipment may further include at least one solid insulation in operational contact with the dielectric fluid.

An aircraft propulsion device, said propulsion device comprising: an electric motor (10) comprising an annular stator (11) about a longitudinal axis (X) and a rotor arranged radially inside said stator (11) for rotation about said longitudinal axis (X); a power module (20) adapted to supply power to the electric motor (10), where the power module (20) comprises an annular housing (21) extending along the longitudinal axis (X), and where the housing (21) of the power module (20) comprises a first end arranged longitudinally opposite to a first end of the stator (11) of the electric motor (10); means for cooling the electric motor (10) and the power module (20), wherein the cooling means comprise a heat sink (30) longitudinally interposed between a first end of the stator (11) of the electric motor (10) and a first end of the housing (21).

The utility model discloses a chip capacitor leveling mechanism based on a thick rubber plate. The chip capacitor leveling mechanism comprises a leveling conveying device, a jacking platform, a feeding belt, a turnover device, a lead-in plate recovery device and a leveling device, the leveling and conveying device comprises a conveying rack and a conveying tray, and the conveying tray is horizontally and movably mounted at the top of the conveying rack; the jacking platform, the feeding belt, the turnover device and the guide-in plate recovery device are sequentially arranged at the feeding end of the conveying rack in a right-facing mode from bottom to top, and the jacking platform can move up and down relative to the feeding belt and the turnover device and can penetrate out of the feeding belt and the conveying face of the leveling conveying device. According to the chip capacitor leveling mechanism based on the thick rubber plate, the leveling clamp is used for clamping the thick rubber plate, the thick rubber plate is made to move downwards to the top of the leveling platform, after the ends of chip capacitors in the thick rubber plate abut against the upper surface of the leveling platform, the ends of the chip capacitors are flush, and the leveling action is completed; and the end sealing quality can be ensured.

The invention discloses a silicon-based capacitor, a production process and application thereof, and relates to the technical field of capacitors. The packaging structure comprises a packaging frame, a pair of silicon substrates is arranged in the packaging frame, the tops and the bottoms of the silicon substrates are fixedly connected with a plurality of small convex points, the small convex points are arranged in a rectangular shape, the tops of the small convex points are fixedly connected with a first metal sheet, the top of the first metal sheet is fixedly connected with an insulating layer, and the top of the insulating layer is fixedly connected with a second metal sheet. One end of the first metal sheet and one end of the second metal sheet are fixedly connected with electrode plates, and clamping grooves are symmetrically formed in the inner side of the packaging frame. According to the invention, when the plurality of silicon substrates are stacked up and down in the packaging frame, the two layers of small bumps are driven by the silicon substrates to abut against and support each other, so that the pressure of the adjacent silicon substrates on the second metal sheet, the insulating layer and the first metal sheet is effectively reduced, the air circulation between the two silicon substrates is improved, and the reliability of the packaging structure is improved. And meanwhile, heat is dissipated into the environment by utilizing the heat dissipation assembly, so that the working temperature of the capacitor is reduced.

The purpose of the present invention is to provide an adhesive composition for a dielectric layer, which is capable of imparting excellent crack resistance and lamination properties to the dielectric layer. This adhesive composition for a dielectric layer contains a copolymer that contains a cyano-group-containing monomer unit and a (meth) acrylic acid ester monomer unit, and the content ratio of the cyano-group-containing monomer unit is from 10% by mass to 45% by mass (inclusive) when all repeating units contained in the copolymer are 100% by mass.

An energy storage device comprising a substrate comprising a series of grooves. Each groove having a first and a second face. Wherein there is a capacitor material in each groove of the series of grooves.

A dielectric composition containing a barium titanate-based matrix main component and a minor component is disclosed. [Solution] The dielectric composition comprises at least one of the following minor components: a first minor component which is an oxide or carbonate of Yb; a second minor component which is an oxide containing Ba and Zr; a third minor component which is an oxide or carbonate of Y; a fourth minor component which is an oxide or carbonate of Mg; a fifth minor component which is an oxide or carbonate of V and Mn; and a sixth minor component which is an oxide or carbonate of Si, wherein at least one minor component comprises the first minor component and satisfies the X8R characteristics specified in the EIA standard.

This invention belongs to the field of capacitor processing technology, specifically relating to a plant-based synthetic ester environmentally friendly impregnating agent, its preparation method, and its application. The plant-based synthetic ester environmentally friendly impregnating agent provided by this invention comprises: an ester obtained by esterification of an organic alcohol and a plant-based fatty acid; wherein the organic alcohol is a straight-chain or branched alcohol; the straight-chain or branched alcohol has 4 to 10 carbon atoms; the plant-based fatty acid is composed of plant-based carboxylic acids, including one or more of plant-based saturated fatty acids and unsaturated fatty acids. This plant-based synthetic ester environmentally friendly impregnating agent has a high flash point, low pour point, good dielectric strength and volume resistivity, low dielectric loss, and excellent impregnation properties. It also features environmental degradability, renewable raw material sources, non-toxicity and harmlessness to humans, and excellent high-temperature performance, meeting the technical requirements of a new generation of high-performance, high-safety, and environmentally friendly capacitors.

The present invention relates to the technical field of a dielectric ceramic powder manufacturing process, and particularly relates to tetragonal nanometer barium titanate powder, a manufacturing method thereof, and an application. The manufacturing method includes: (S.1) manufacturing a mesoporous titanium dioxide precursor with controllable crystal phase, adding it to a barium salt solution so that the molar ratio of barium to titanium is 2 to 4, then adding ethanol and aqueous ammonia to obtain a barium titanate precursor suspension in which the volume ratio of ethanol is 40% to 60%; (S.2) subjecting the barium titanate precursor suspension to a hydrothermal reaction to obtain a barium titanate suspension; and (S.3) centrifugally washing, drying, and pulverizing the barium titanate suspension to obtain tetragonal nanometer barium titanate powder. In the present application, by simultaneously controlling the molar ratio of barium to titanium between the anatase-type mesoporous titanium dioxide precursor and the barium salt in the hydrothermal reaction process and the ratio of ethanol in the hydrothermal medium in the hydrothermal reaction process, barium titanate powder having a higher c / a value and particle size uniformity can be obtained.