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Moisture-proof stain-resistant composite circuit board and production process thereof

A circuit board and composite technology, applied in the direction of circuit cover, printed circuit, printed circuit manufacturing, etc., can solve the problems of circuit board damage, circuit board temperature rise, adhesion of pollutants, etc., to ensure performance and heat dissipation Effect, improve the effect of cooling and heat dissipation

Pending Publication Date: 2020-10-09
昆山顺灏电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, the circuit board is in a bare state during use, so that the circuit board will be damp and dusty, which will cause damage to the circuit board for a long time, and damage to the circuit board will cause leakage and damage to the electronic device, which may seriously cause personnel safety accidents
After some circuit boards have been subjected to moisture-proof treatment, due to the need to install a moisture-proof layer, the heat dissipation of the circuit board will be poor, which will affect the work of the circuit board, and the existing circuit board is in a bare state, and the surface of the circuit board is prone to adhesion pollutants. These pollutants will affect the normal performance of the circuit board, and the heat energy emitted by the circuit board during the working process will cause the temperature of the main body of the circuit board to rise, and the high temperature will affect the service performance and working life of the circuit board

Method used

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  • Moisture-proof stain-resistant composite circuit board and production process thereof
  • Moisture-proof stain-resistant composite circuit board and production process thereof
  • Moisture-proof stain-resistant composite circuit board and production process thereof

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Embodiment Construction

[0037] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] see Figure 1-14 As shown, a moisture-proof and stain-resistant composite circuit board and its production process include a circuit board box body 1, a circuit board mounting seat 2, a box body mounting frame 3, a fixing seat 6, a positioning sleeve 7, a mounting bolt 8, a A support 9, a second support 10, a circulating water tank 11, a connecting water pipe 12, a condenser 13, a circuit board mounting plate 14, a circuit board main body 15, an installation support 16, a circulating water pump 17 and a cooling water...

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PUM

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Abstract

The invention discloses a moisture-proof stain-resistant composite circuit board and a production process thereof. A plurality of groups of heat dissipation through holes are formed in the side wall of the rear end of the circuit board box body; and fixed seats are arranged at four corners of the inner side of the front end of the circuit board box body. A box body mounting frame is fixedly mounted at the rear end of the circuit board box body; positioning sleeves are arranged at four corners of a circuit board mounting base; positioning holes matched with the positioning sleeves are formed inthe fixed seats; mounting screw holes are formed in the bottoms of the positioning holes; a rotating cover drives a sealing baffle to rotate to seal or open an air hole, heat dissipation is started when the circuit board works, the use performance and the heat dissipation effect of the circuit board are ensured, and the sealing baffle seals the air holes when the circuit board does not work, so that external dust and impurities are effectively prevented from entering the circuit board, impurities are prevented from adhering to the surface of the circuit board, and the use performance is prevented from being affected.

Description

technical field [0001] The invention relates to a composite circuit board, in particular to a moisture-proof and pollution-resistant composite circuit board and a production process thereof. Background technique [0002] Double-sided circuit board means that there are printed wires on both sides of a board. Generally, vias or pads are used to connect the printed wires on both sides, with an insulating layer in the middle. The components provide the necessary support to facilitate the insertion of each component and realize its electrical connection. It is widely used in electronic devices. Generally, circuit boards are exposed during use, which will cause the circuit board to be damp and dusty, which will cause damage to the circuit board for a long time, and damage to the circuit board will cause leakage and damage to electronic devices, which may seriously cause personnel safety accidents. After some circuit boards have been subjected to moisture-proof treatment, due to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K3/00H05K7/14
CPCH05K7/14H05K7/20272H05K7/20281H05K7/20318H05K7/20172H05K3/00H05K3/0047H05K3/0082H05K2203/0551H05K2203/0214
Inventor 李亚峰曾媛
Owner 昆山顺灏电子科技有限公司
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