Novel circuit forming method

Abstract

The invention provides a novel circuit forming method, and relates to the technical field of circuit forming. The new circuit forming method comprises the following steps: S1, pretreating a product substrate; S2, coating photoresist on the pre-treated substrate by using a coating roller to obtain a product with a photoresist pattern; S3, baking the product coated with the photoresist pattern to cure the photoresist; and S4, etching the baked product with the cured photoresist pattern to remove a copper foil which is not covered by the photoresist, and then, carrying out development to remove the photoresist on the surface of the product to obtain a required circuit pattern. According to the invention, the circuit board is manufactured by using a roller pattern coating method, so that the processes of exposure, development and the like are omitted, the original production process steps can be simplified, the labor and equipment costs are greatly reduced, adverse effects caused by manualoperation are avoided, the product quality can be ensured, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of circuit forming, in particular to a new circuit forming method. Background technique [0002] With the development of industrial technology and the arrival of Industry 4.0, the automation of various manufacturing factories is getting higher and higher. For the circuit board industry, automation is mainly reflected in each process. Due to the intelligence of the equipment, each processing process tends to be intelligent. As far as several processes of circuit forming in the prior art circuit board processing are concerned, it is generally necessary to carry out Manually paste the dry film, expose, develop, etch the circuit, and then remove the dry film to expose the required circuit. [0003] Above traditional method has the following deficiencies: [0004] 1. In the actual operation process of manual dry film sticking, there will be deviation, missed sticking, re-sticking, etc., which will cause waste o...

AI Technical Summary

Problems solved by technology

[0004] 1. In the actual operation process of manual dry film sticking, there will be deviation, missed sticking, re-sticking, etc., which will cause waste of materials, increase production costs, and reduce the efficiency of operations;

[0005] 2. In order not to waste the base material, the products with the above errors will be reworked. During the rework process, the product quality will be adversely affected, and the final yield of the product may be affected;

[0006] 3. During the exposure process, there will be poor exposure due to insufficient energy, and there is also the possibility of rework, and the equipment used for exposure is also very expensive, and the overall cost is relatively high;

[0007] 4. At present, alkaline liquid is mostly used in development and etching. During the production process, the development process causes liquid residue, which affects the subsequent line etching and ultimately affects the overall yield of the product.

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