Forming method for protecting image

Abstract

Production of a resist pattern involves applying first then second photohardenable resist films (F1, F2), sensitive to light in first and second wavelength regions (WL1, WL2) respectively, to a semiconductor chip or a circuit board, where film F2 blocks light of WLR1. Laser light in WL2 is applied through a screen onto part of F2 followed by applying a developer solution, to form a mask pattern. F1 is illuminated with light in WL1 through a membrane mask, and finally F1 is developed.

Description

[0001] technology area [0002] The present invention relates to a method for forming a resist pattern, and in particular to a resist pattern that can shorten exposure time and improve production efficiency when forming a pre-set solder resist when soldering on a printed wiring board. A formation method, and a formation method of a protective pattern that can increase the degree of freedom used in solder resist. Background technique [0003] In the manufacture of printed wiring boards, photosensitive materials are used as etching resist materials for circuit formation or solder resist materials for circuit protection. [0004] Conventionally, when pattern-exposing these protective materials, it is common to develop a construction method by irradiating ultraviolet light through a mask (hereinafter also referred to as a mask) formed with a light-shielding negative pattern such as glass or film. [0005] However, in the case of pattern exposure using a mask, it takes cost and ti...

AI Technical Summary

Problems solved by technology

[0007] However, solder resist materials are generally negative, and when direct exposure is performed, most of the patterned portion becomes the exposed portion, and the non-exposed portion is very small, so there is a concern that it will take a long time for direct exposure with laser light.

[0008] In addition, when the protective material is directly exposed to laser light, it is necessary to use a protective material with several times the sensitivity of the conventional one, so the protective material used is limited.

For example, when other components are mounted on a wiring board or a semiconductor substrate on which a protective film is patterned, the parts at the junction part on the wiring board need to have adhesiveness with resin or metal, but in this case, almost no A protective material that has both adhesion and sensitivity to laser light, but there is a concern that the degree of freedom in the selection of protective materials is low

As another example, when the protective film is made of a plating solution material, both chemical resistance and high sensitivity photosensitivity are required, and it is difficult to maintain chemical resistance and only increase the sensitivity

As a result, there is a concern that the degree of freedom in the choice of protective materials will decrease

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