Forming method for protecting image

Abstract

The invention provides a resist pattern forming method which can perform exposure of solder material and perform exposure using laser light by the same solder material. A solder film 7 with UV photosensitivity covered by cover film 6 is formed on the print wiring board 3 and a protective film 8 with visible photosensitivity for screening UV is formed above the solder film 7. The visible light laser 10 is used to expose. A resist pattern 11 is exposed on the protective film 8 and the water is used to develop to form solidifying film of protective film 8, and a mask parttern is generated by theresist pattern 11. Subsequently, using UV, the said mask parttern is used as mask and a solder film 5 is exposed on the solder film 7. A weak base developing liquid is used to develop. A solder pattern 5 generated by solidifying film of solder film 7 is formed on the print wiring board 3.

Description

[0001] technology area [0002] The present invention relates to a method for forming a resist pattern, and in particular to a resist pattern that can shorten exposure time and improve production efficiency when forming a pre-set solder resist when soldering on a printed wiring board. A formation method, and a formation method of a protective pattern that can increase the degree of freedom used in solder resist. Background technique [0003] In the manufacture of printed wiring boards, photosensitive materials are used as etching resist materials for circuit formation or solder resist materials for circuit protection. [0004] Conventionally, when pattern-exposing these protective materials, it is common to develop a construction method by irradiating ultraviolet light through a mask (hereinafter also referred to as a mask) formed with a light-shielding negative pattern such as glass or film. [0005] However, in the case of pattern exposure using a mask, it takes cost and ti...

AI Technical Summary

Problems solved by technology

[0007] However, solder resist materials are generally negative, and when direct exposure is performed, most of the patterned portion becomes the exposed portion, and the non-exposed portion is very small, so there is a concern that it will take a long time for direct exposure with laser light.

[0008] In addition, when the protective material is directly exposed to laser light, it is necessary to use a protective material with several times the sensitivity of the conventional one, so the protective material used is limited.

For example, when other components are mounted on a wiring board or a semiconductor substrate on which a protective film is patterned, the parts at the junction part on the wiring board need to have adhesiveness with resin or metal, but in this case, almost no A protective material that has both adhesion and sensitivity to laser light, but there is a concern that the degree of freedom in the selection of protective materials is low

As another example, when the protective film is made of a plating solution material, both chemical resistance and high sensitivity photosensitivity are required, and it is difficult to maintain chemical resistance and only increase the sensitivity

As a result, there is a concern that the degree of freedom in the choice of protective materials will decrease

Images