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High-electromagnetic-compatibility circuit board and manufacturing method thereof

A manufacturing method and technology of compatible wires, applied in the use/removal method of circuit mask, printed circuit manufacturing, circuit cover, etc., to achieve the effect of high pollution, low pass rate and quality, and improved reliability

Inactive Publication Date: 2020-09-22
GUANGDE SANSN TECH CO LTD
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  • Description
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  • Application Information

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Problems solved by technology

[0002] Today's 5G information technology is in a state of rapid development. The fifth-generation communication technology is an extension after 4G and an evolution of the existing wireless communication technology. The biggest change is that 5G technology is a set of technical standards, and its service objects have changed from the past Human-to-human communication increases the communication between people and objects, and between objects and objects; the key to 5G technology is to ensure high-speed signal transmission and anti-interference capabilities, and relying on traditional design models can no longer meet existing needs

Method used

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  • High-electromagnetic-compatibility circuit board and manufacturing method thereof

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Embodiment Construction

[0012] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further clarified below in conjunction with the accompanying drawings and specific embodiments.

[0013] The existing traditional circuit board production process is: material cutting—inner layer pretreatment—inner layer coating—inner layer exposure—inner layer DES—inner layer AOI—pre-pressing treatment—lamination—hot pressing—cold pressing— Targeting—edge milling—drilling—PTH—electroplating—line pretreatment—line dry film—line exposure—line DES—line AOI—solder mask pretreatment—solder mask printing—solder mask exposure—solder mask development—solder mask baking —Text printing—printing blue glue—gold plating—molding—electrical testing—FQC—OQC.

[0014] Although the above-mentioned traditional circuit board manufacturing method can realize the gold-plating process, the residue of the gold-plated wire and the proces...

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Abstract

The invention belongs to the technical field of printed circuit boards, and particularly relates to a high-electromagnetic-compatibility circuit board and a manufacturing method thereof. The manufacturing method includes the steps: after a circuit pretreatment procedure, protecting the positions, not needing gold plating, on the circuit board through a selective dry film; plating the whole board with gold, and then processing the circuit board through the circuit dry film. According to the invention, the problems of more personnel, large material consumption, low product percent of pass and quality, heavy pollution and high cost caused by a redundant and complex production process are solved, the reliability of the product is greatly improved, and the manufacturing cost of the circuit board is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a high electromagnetic compatibility circuit board and a manufacturing method thereof. Background technique [0002] Today's 5G information technology is in a state of rapid development. The fifth-generation communication technology is an extension of 4G and an evolution of the existing wireless communication technology. The biggest change is that 5G technology is a set of technical standards, and its service objects have changed from the past Human-to-human communication has increased the communication between people and things, and things and things; the key to 5G technology is to ensure high-speed signal transmission and anti-interference capabilities, and relying on traditional design models can no longer meet existing needs. Reliable electromagnetic compatibility enables the equipment or system to operate in compliance with the requirements in its ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0082H05K3/0079H05K2203/0548H05K2203/0551
Inventor 孙静晨张小华刘常兴李文超
Owner GUANGDE SANSN TECH CO LTD
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