148results about "Circuit masks application/removal" patented technology

A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.

The invention provides a method to form a pattern of a functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. The mask material is removed from the substrate, forming the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.

The liquid ejection apparatus has: a head having a nozzle group including a plurality of nozzles which are aligned in a first direction and performs ejection of resist liquid onto a wiring substrate; a scanning device which causes the head and the wiring substrate to move relatively in the first direction; an ejection control device which controls the ejection of the resist liquid from the head; and a scanning control device which controls the scanning device in such a manner that the head and the wiring substrate are relatively moved only once in the first direction, through a region of the wiring substrate which corresponds to one relative movement in the first direction of the wiring substrate and the scanning device, wherein the ejection control device controls the ejection of the resist liquid from the head to cause the resist liquid to be ejected onto a same position of the wiring substrate sequentially, at prescribed time intervals, from different nozzles of the nozzle group, to deposit the resist liquid ejected onto the same position of the wiring substrate sequentially from the different nozzles of the nozzle group, in such a manner that a resist pattern having a prescribed thickness and a prescribed pattern is formed on the wiring substrate.

The present invention relates to a method for imprinting a micro-/nano-structure on a substrate, the method comprising (a) providing a mold containing a desired pattern or relief for a microstructure; (b) applying a polymer coating to the mold; and (c) transferring the polymer coating from the mold to a substrate under suitable temperature and pressure conditions to form an imprinted substrate having a desired micro-/nano-structure thereon.

Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing the substrate-adherent polymer from the pattern without requiring solvent. Suitable mechanical removal methods include applying adhesive tape to the substrate-adherent polymer and peeling the tape and substrate-adherent polymer away from the pattern, and abrading the substrate-adherent polymer from the pattern using impact media.

A method for forming a resist pattern on a substrate (18) places a donor element (12) having a layer of thermoresist material proximate the substrate. A gap is maintained such that the surface of the layer of thermoresist material is spaced apart from the surface of the substrate by a number of spacing elements. Thermal energy is directed toward the donor element (12) according to the resist pattern, whereby a portion of thermoresist material is transferred from the donor element (12) across the gap by ablative transfer and is deposited onto the substrate (18) forming the resist pattern.

The present invention aims to produce a three-dimensional structure having a high aspect ratio by using inkjet printing techniques or the like. Specifically, a three-dimensional structure is produced by ejecting a liquid drop of a solution, which contains a solvent and polymer particles dispersed in the solvent while having a viscosity of not more than 100 cps, from a nozzle onto a substrate; then evaporating the solvent and melting the polymer particles by irradiating the liquid drop with light; and then depositing the molten polymer particles on the substrate. The present invention can be applied to production of biochips and the like.

A film applying apparatus is provided with preparatory bonding rolls, laminating rolls, a laminated film wound out from a film roll and a substrate conveyed by a substrate conveying device. The laminated film passes between these rolls and pressure bonding is performed. The diameter of the preparatory bonding rolls is made smaller than the diameter of the laminating rolls. The range of the elastically deformed area at the roll surface where the grasping of the substrate and the laminated film by the preparatory bonding rolls is begun, is made small, thereby limiting the range and reducing the generated amount of air holding or the like.

The invention discloses a method for fabricating a conductive pattern on a flexible substrate. A flexible substrate having a conductive layer thereon is provided. A protective ink is screen printed on the conductive layer, wherein a portion of the conductive layer is exposed through the protective ink. The exposed portion of the conductive layer is removed by etching using the protective ink as a mask. The protective ink is then removed, thus providing a conductive pattern with a minimum line width of not greater than 150 μm. The invention also discloses a composition for the protective ink.

The present invention relates to conductive components manufacturing processes employing conventional direct transfer printers to make components such as printer circuit boards and semiconductors, by way of non-limiting example. The process disclosed allow for the production of customized conductive components, particularly prototype components, utilizing in a convenient, cost effective manner.

Provided is a curable composition, including a polymerization initiator; a polymerizable compound; and an internal addition type release agent having a hydrophilic functional group, in which the internal addition type release agent is prevented from being unevenly distributed in a gas-liquid interface of the curable composition.

The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width.

An inkjet printer which can be used for printing a resist pattern on a printed circuit board when wiring patterns are to be formed on the board. The inkjet printer has a liquid ejecting head which comprises: a liquid chamber filled with liquid and connected to a liquid storage tank; a capillary nozzle connected to the liquid chamber; a discharge unit for acting on the liquid filled in the liquid chamber to eject the liquid through an outlet of the capillary nozzle toward an object to be printed; and a negative pressure generating unit for applying a negative pressure in a direction in which the liquid is ejected from the outlet of the capillary nozzle. Due to the application of negative pressure, a liquid having a viscosity higher than that of a general ink can be ejected.

The invention relates to a radiation curable powder photoresist composition comprising the components A a polymer, B a reactive compound having unsaturated groups and C a free radical photoinitiator, wherein the powder photoresist composition is soluble in a developer and wherein the powder photoresist composition has a Tg between 40 and 120° C.

A method of fabricating a printing plate includes: preparing a substrate; forming a metal layer on an entire surface of the substrate; forming a resist pattern on the metal layer, the resist pattern having a fine pattern exposing a portion of the metal layer; wet etching the exposed metal layer, and removing the resist pattern to form a metal layer pattern exposing a portion of the substrate; wet etching the exposed substrate, and removing the metal layer pattern to form a recessed pattern; and forming a compensation layer on an entire surface of the substrate where the recessed pattern is formed.

A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

The present invention relates to the field of automated equipment, and more particularly to a film mounting machine. The machine is used for mounting a dry film on a printed board, and comprises a machine frame, a transmitting device installed on the machine frame to transmit a printed board, a film mounting module in sliding connection with the machine frame and to have the dry film attached on the surface of the printed board and a control device for controlling the electric components of the transmitting device and the film mounting module to work. In the invention, the film mounting machine can drive the film pressing roll of a film pressing driving device to move in the direction of a printed board so as to press tightly the printed board with a pre-attached dry film. This replaces the traditional method in which a flexible printed board is transmitted under the film pressing roll, and ensures that when the film pressing roll presses tightly a printed board, the problem of film overlapping and bending caused by the breakage of the printed board during transmission can be avoided. The machine can be especially suitable for mounting film on flexible printed boards, and raises the qualification rate of film mounting on the flexible printed boards. In addition, the film mounting process is completely automatic, which saves manpower and cost and increases production efficiency.

A printed circuit board can be formed by a method that includes the step of cutting a circuit pattern out of a low cost plastic sheet material, and transferring the pattern onto a tape. The tape, with the pattern adhesively attached, is transferred onto a conductive film surface on a dielectric board. Thereafter, the tape is removed, leaving the pattern on the conductive film. An acid-etching step is performed on the exposed areas of the conductive film, after which the pattern is removed from the non-etched areas of the conductive film.