The invention discloses a non-photopolymerization PCB solder
resist ink windowing and solder
resist oil bridge process, which is used for high-precision PCB micro bonding pad solder
resist ink windowing and solder resist oil bridge, and comprises the following steps of S1, manufacturing a blocking point screen, S2, silk-screening ink, S3, carrying out pre-baking treatment, S4, carrying out ink leveling treatment, and leveling the pre-baked solder resist ink by adopting an ink leveling
machine, S5,
drying and curing treatment: carrying out high-temperature
drying and curing on the
printed circuit board with the ink leveled, S6,
grinding treatment:
grinding the ink on the
copper surface of the bonding pad to completely
expose the
copper layer of the bonding pad, and S7, cleaning and
drying treatment: cleaning and drying the ground PCB through a horizontal
surface cleaning machine, and carrying out micro-
etching leveling and cleaning on the exposed
copper surface by using a micro-
etching leveling liquid and high-pressure water. The process is suitable for any-sizepad windowing and solder resist oil bridge manufacturing, and a powerful quality guarantee is provided for electronic products which are more and more integrated and precise.