4 results about "Solder form" patented technology

The application discloses a kind of tap solder visual detection methods, collect the image of measured tap and carry out pretreatment separation soldering part connected region and import the measurement model constructed, identify and locate the false soldering defect in soldering part connected region, and calculate the soldering length and false soldering area of soldering part connected region on image.The application covers more defect scenarios through double-parameter joint judgment, reduces the miss rate and false detection rate, improves the detection reliability, and the false soldering area is obtained by comparing the actual soldering area with the standard area, quantifies the degree of insufficient welding coverage, and is not limited by soldering form, reduces the detection deviation caused by form difference.

The utility model relates to the field of wiring harness processing especially, relate to a tin soldering equipment convenient to use, including bottom plate and fixedly set up the support on bottom plate, still include mounting bracket, soldering iron and positioning tooling, the mounting bracket can be relative the support up and down movement, the soldering iron with mounting bracket detachable fixed connection, positioning tooling fixedly set up on bottom plate, and positioning tooling below the soldering iron, the upper surface of positioning tooling is provided with the soldering tin placement groove and raw material placement groove that cross each other perpendicularly, and the intersection position of soldering tin placement groove with the principle placement groove still is provided with the solder forming groove.

The invention provides a solder pre-planting device, a pre-planting process and a packaging method. According to the device, through collaborative design of the T-shaped cavity structure, the height adjusting mechanism and the ejector pin stopping piece, accurate positioning and hovering control of the bonding pad are achieved. Wherein the micron-sized annular gap realizes the functions of heat insulation and overflow prevention, the mounting tolerance and the alignment precision are considered after the size of the micron-sized annular gap is optimized, a manual adjusting mode and an automatic adjusting mode are provided, and the operation flexibility and the automation prospect are considered. Through the design, the welding flux forming stability and the product yield are remarkably improved. The pre-planting process based on the device can form a standardized solder body at an independent station, and the packaging method adopts two times of reflow soldering to realize reliable connection. According to the whole scheme, through cooperation of the device, the technology and the method, the production process is simplified, dependence on the precise printing technology is reduced, and efficiency improvement and cost optimization are achieved while the automation level is improved.

The application provides a solder pre-planting device, a pre-planting process and a packaging method. The device realizes accurate positioning and hovering control of the solder pad through the collaborative design of the T-shaped cavity structure, the height adjusting mechanism and the needle stopper. The micron-level annular gap realizes heat insulation and overflow prevention. The size is optimized to balance the installation tolerance and the alignment accuracy, and manual and automatic adjustment modes are provided to balance the operation flexibility and the automation prospect. The design significantly improves the solder forming stability and the product yield. The pre-planting process based on the device can form a standardized solder body in an independent station, and the packaging method realizes reliable connection through two reflow soldering. The overall scheme simplifies the production process, reduces the dependence on precision printing process, improves the automation level, and realizes efficiency improvement and cost optimization.