13 results about "Solder form" patented technology

A manufacturing method for a light-emitting device, the manufacturing method including: preparing a first substrate provided with a plurality of light-emitting bodies; preparing a second substrate including a first bonding portion having conductivity, a first pad portion electrically connected to the first bonding portion, and a first solder regulating portion located between the first bonding portion and the first pad portion, the second substrate including a solder formed on the first bonding portion; bonding a first object selected from the plurality of light-emitting bodies to the second substrate with the solder; and transferring the first object to the second substrate by separating the first substrate and the second substrate from each other.

The invention relates to a method for soldering an electronic component (2) to a coated base (1) which is made of a metal and is at least partially coated with a coating (1a) made of nickel or a nickel-based alloy (1a), comprising the steps of: a) chemically cleaning the coating (1a) by removing an oxide layer using a cleaning gas; b) soldering the electronic component (2) on the cleaned coating (1a) using a solder, wherein a soldering temperature is selected in such a way that the coating (1a) remains in a solid state and the solder forms a connection (3) to the cleaned coating (1a).

The application discloses a kind of tap solder visual detection methods, collect the image of measured tap and carry out pretreatment separation soldering part connected region and import the measurement model constructed, identify and locate the false soldering defect in soldering part connected region, and calculate the soldering length and false soldering area of soldering part connected region on image.The application covers more defect scenarios through double-parameter joint judgment, reduces the miss rate and false detection rate, improves the detection reliability, and the false soldering area is obtained by comparing the actual soldering area with the standard area, quantifies the degree of insufficient welding coverage, and is not limited by soldering form, reduces the detection deviation caused by form difference.

The utility model relates to the field of wiring harness processing especially, relate to a tin soldering equipment convenient to use, including bottom plate and fixedly set up the support on bottom plate, still include mounting bracket, soldering iron and positioning tooling, the mounting bracket can be relative the support up and down movement, the soldering iron with mounting bracket detachable fixed connection, positioning tooling fixedly set up on bottom plate, and positioning tooling below the soldering iron, the upper surface of positioning tooling is provided with the soldering tin placement groove and raw material placement groove that cross each other perpendicularly, and the intersection position of soldering tin placement groove with the principle placement groove still is provided with the solder forming groove.

Method for soldering an electronic component (2) to a coated base (1) which is formed from a metal and is at least partially coated with a coating (1a) made of nickel or a nickel-based alloy (1a), comprising the steps of: a) chemically cleaning the coating (1a) by removing an oxide layer using a cleaning gas; b) soldering the electronic component (2) to the cleaned coating (1a) using a solder, wherein a soldering temperature is selected such that the coating (1a) remains in a solid state and the solder forms a bond (3) with the cleaned coating (1a).

The invention discloses a heat dissipation structure and a manufacturing method. The heat dissipation structure comprises a base and a plurality of heat pipes. An injection port and a plurality of receiving grooves are respectively arranged on the upper and lower sides of the base. The injection port is arranged across the upper part of the receiving grooves to intersect and communicate with the receiving grooves. A solder layer is arranged between the heat pipe and the receiving groove and connected to the two. When manufacturing, the heat pipe is placed in the receiving groove of the base, and a mechanical processing is first performed to make one side of the heat pipe be pressed (rolled) flat and flush with the lower side of the base. Then, the solder is injected through the injection port so that the solder completely fills the gap between the heat pipe and the receiving groove. Then, the heat pipe and the base are placed together in the heating furnace for heating. After being taken out and cooled, the solder forms a solder layer that combines and fixes the base and the heat pipe and fills the gap between the two, thereby ensuring that the base and the heat pipe can be tightly fitted to avoid the occurrence of thermal resistance.

The purpose of the present invention is to provide a technique capable of reducing the man-hour for switching solder forming tools when multiple types of semiconductor devices are produced. The semiconductor manufacturing apparatus includes: a solder wire supply unit that supplies a solder wire onto a heated base material; a solder forming unit having a solder forming tool that forms the molten solder by being in contact with the solder line and the molten solder being in contact with the base material; a first drive mechanism that drives the solder wire supply unit so that the solder wire supply unit can move in the horizontal direction and the vertical direction; a second drive mechanism that drives the solder forming unit so that the solder forming unit can move in the horizontal direction and the vertical direction; and a control unit that controls the first drive mechanism and the second drive mechanism. The control unit controls the second drive mechanism such that the solder forming unit is moved in the horizontal direction after the solder forming tool is brought into contact with the molten solder. The invention also relates to a manufacturing method of the semiconductor device.

The invention relates to the technical field of carrier module production, in particular to a carrier module PCB welding device and method. The device comprises a fixing piece and a machining piece arranged on the fixing piece. According to the welding device, when the pre-welding structure slides upwards, the welding flux flows out to wrap the pin of the electronic component, meanwhile, the supply structure is driven to reset, and when the pre-welding structure moves downwards to reset, the supply structure is driven to clamp the welding wire and drive the welding wire to enter the pre-welding structure to be heated and melted to form new welding flux; as the lengths of the welding wires are consistent when the supply structure drives the welding wires to enter the pre-welding structure every time, the amount of the welding flux formed by melting the welding wires through the pre-welding structure every time is consistent, that is, the amount of the welding flux used for welding every time in the welding machining process of the carrier module PCB is consistent, the situation that the welding flux is too little can be avoided, and the welding quality of the carrier module PCB is improved. And the condition of excessive welding flux can be avoided, so that the welding processing quality of the carrier module PCB is ensured.

The invention provides a solder pre-planting device, a pre-planting process and a packaging method. According to the device, through collaborative design of the T-shaped cavity structure, the height adjusting mechanism and the ejector pin stopping piece, accurate positioning and hovering control of the bonding pad are achieved. Wherein the micron-sized annular gap realizes the functions of heat insulation and overflow prevention, the mounting tolerance and the alignment precision are considered after the size of the micron-sized annular gap is optimized, a manual adjusting mode and an automatic adjusting mode are provided, and the operation flexibility and the automation prospect are considered. Through the design, the welding flux forming stability and the product yield are remarkably improved. The pre-planting process based on the device can form a standardized solder body at an independent station, and the packaging method adopts two times of reflow soldering to realize reliable connection. According to the whole scheme, through cooperation of the device, the technology and the method, the production process is simplified, dependence on the precise printing technology is reduced, and efficiency improvement and cost optimization are achieved while the automation level is improved.

The application provides a solder pre-planting device, a pre-planting process and a packaging method. The device realizes accurate positioning and hovering control of the solder pad through the collaborative design of the T-shaped cavity structure, the height adjusting mechanism and the needle stopper. The micron-level annular gap realizes heat insulation and overflow prevention. The size is optimized to balance the installation tolerance and the alignment accuracy, and manual and automatic adjustment modes are provided to balance the operation flexibility and the automation prospect. The design significantly improves the solder forming stability and the product yield. The pre-planting process based on the device can form a standardized solder body in an independent station, and the packaging method realizes reliable connection through two reflow soldering. The overall scheme simplifies the production process, reduces the dependence on precision printing process, improves the automation level, and realizes efficiency improvement and cost optimization.

The present application discloses a small-sized sealed cover plate with a thin solder layer and a preparation method thereof. The method includes: using an automatic chip mounter to attach a mechanically punched cover plate to the adhesive surface of a sputtering process tape with a certain gap, and then attaching the adhesive surface of the single-sided sputtering process tape cut into a certain shape downward to the center of the cover plate; then evaporating a metal adhesion layer and a solder layer on a vacuum evaporation table; finally, using a laser to cut the evaporated layer along a reserved dividing line, heating and dissolving the sputtering process glue and the redundant evaporated layer to remove them, and obtaining the required small-sized sealed cover plate with a thin solder layer after cleaning and drying, which can avoid problems such as solder climbing on the thin cover plate and short circuits between the bonding wires and between the cover plate caused by the spherical solder formed by the melting of the thin package.

This disclosure relates to an LED film comprising: a substrate; an electrode layer formed on at least a portion of the substrate; solder formed on at least a portion of the electrode layer; a light-emitting diode (LED) positioned on the solder and connected to the electrode layer; a molding layer applied to cover the entire surface of the substrate, electrode layer, and LED; and a variable adhesive film located on the molding layer, wherein the LED film satisfies the following Equation 1:1*(B+C)≤A≤5*(B+C)[Equation⁢ 1]where A represents the height of the molding layer measured from the substrate, B represents the thickness of the solder, and C represents the thickness of the LED. The LED film of this disclosure provides excellent adhesion reliability and reworkability after attachment while protecting the LED and electrode.

The present disclosure relates to a printed circuit board that can improve heat dissipation performance and comprises: a substrate; a solder formed on a predetermined region of the substrate; and a heat transfer metal layer formed between the substrate and the solder, wherein the solder is printed through a metal mask such that a plurality of solders are formed on a region of the substrate to which a thermal pad of an integrated circuit (IC) is attached, wherein the plurality of solders formed on the region of the substrate to which the thermal pad is attached may be arranged such that adjacent solders are offset in at least one of an X-axis direction and a Y-axis direction.