66 results about "Solder form" patented technology

A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.

A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.

Methods of forming solder ball contacts having dimensions of approximately 2.5 microns in diameter for use in C4-type connections. The methods form solder ball contacts using selective deposition of solder on metal contact pads of a device. The metal contact pads have exposed portions at the bottom of through holes. The through holes define the dimensions of the exposed portions of the metal contact pads, and serve to limit the dimensions of the resulting solder contact by limiting the area upon which deposition preferentially occurs. Subsequent reflow of the deposited solder forms a solder ball contact. Various devices, modules, systems and other apparatus utilizing such methods of forming solder ball contacts.

Disclosed are a printed circuit board for a semiconductor package and a method of manufacturing the same. Specifically, a printed circuit board for a semiconductor package includes predetermined circuit patterns, having a wire bonding portion and a bump portion for mounting a semiconductor and a soldering portion for connection to external parts, in which the bump portion has a pre-solder formed using a tin or tin alloy electroplating process. According to this invention, the pre-solder, which is formed by reflow using an electroplating process, permits easy increase of the height thereof to thus enhance bondability and underfilling capability, may be formed to a desired thickness by controlling a plating thickness, and furthermore, may be applied to a fine pitch through a masking process.

An optical waveguide platform and a method of manufacturing the same are disclosed. The optical waveguide platform comprises an optical waveguide having a lower clad layer, a patterned core layer and an upper clad layer which are laminated on one area of said substrate sequentially, a terrace formed by patterning said lower clad layer, on the other area of said substrate, a metal and a solder formed on said terrace and an optical device mounted on said terrace containing said metal and said solder. According to the present invention, the optical waveguide platform can be manufactured in a simple method without damaging the optical waveguide and the manufacturing cost thereof can be reduced.

Methods for fabrication of thermal interposers, using a low stress photopatternable silicone are provided, for use in production of electronic products that feed into packaging of LEDs, logic and memory devices and other such semiconductor products where thermal management is desired. A photopatternable silicone composition, thermally conductive material and a low melting point compliant solder form a complete semiconductor package module. The photopatternable silicone is applied on a surface of a wafer and selectively radiated to form openings which provided user defined bondline thickness control. The openings are then filled with high conductivity pastes to form high conductivity thermal links. A low melting point curable solder is then applied where the solder wets the silicone as well as the thermally conductive path that leads to low thermal contact resistance between the structured z-axis thermal interposer and the heat sink and / or substrate which can be a wafer or PCB.

A lead frame having a die thereon connects a high current conductive area on the die to a lead frame contact using a copper clip that includes a structure portion that is received with a recess-like “tub” formed in the lead frame contact. In the preferred embodiment, a lead frame structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by solder paste or an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. One or more solder-holding pockets are formed a surface portion of the tub and / or the end of the clip that is received in the tub so that a volume of liquefied solder formed during the solder reflow step will effect alignment of any mis-aligned parts by “drawing” at least one of the parts against a “stop” surface.

A multi stack packaging chip and a method of manufacturing the chip are provided. The method includes forming at least one second circuit element on a first wafer; forming a second wafer having a cavity and a one third circuit element formed opposite to the cavity; forming a solder on the second wafer; and combining the second wafer with the first wafer so that the second circuit element and the cavity correspond. The chip includes a flip-chip packaged chip in which a first circuit element is packaged using a first wafer; a second circuit element formed on the first wafer; a second wafer having a cavity and combined with the first wafer so that the cavity and the second circuit element correspond; a third circuit element formed on the second wafer; and a solder formed on the second wafer, the solder electrically coupling the second wafer to a packaging substrate.

Disclosed are a printed circuit board for a semiconductor package and a method of manufacturing the same. Specifically, a printed circuit board for a semiconductor package includes predetermined circuit patterns, having a wire bonding portion and a bump portion for mounting a semiconductor and a soldering portion for connection to external parts, in which the bump portion has a pre-solder formed using a tin or tin alloy electroplating process. According to this invention, the pre-solder, which is formed by reflow using an electroplating process, permits easy increase of the height thereof to thus enhance bondability and underfilling capability, may be formed to a desired thickness by controlling a plating thickness, and furthermore, may be applied to a fine pitch through a masking process.

Structures and methods for forming good electrical connections between an integrated circuit (IC) chip and a chip carrier of a flip chip package include forming one of: a tensile layer on a front side of the IC chip, which faces a tops surface of the chip carrier, and a compressive layer on the backside of the IC chip. Addition of one of: a tensile layer to the front side of the IC chip and a compressive layer the backside of the IC chip, may reduce or modulate warpage of the IC chip and enhance wetting of opposing solder surfaces of solder bumps on the IC chip and solder formed on flip chip (FC) attaches of a chip carrier during making of the flip chip package.

The invention discloses a connection method of silver, copper and zinc belt-shaped solder and a special connection device used in the connection method. According to the connection method, firstly, oxides on connection faces, to be connected, of two solder belts are removed; the connection portions of the solder belts are placed between an upper copper plate and a lower copper plate after being clamped and overlapped through the upper copper plate and the lower copper plate, and the contact faces of the solder belts are coated with silver solder flux and are placed between an upper pressure column and a lower supporting column; the upper pressure column falls downwards so as to tightly press the connection portions and keeps certain pressure; the upper copper plate and the lower copper plate are heated through an upper conductive electrode and a lower conductive electrode, so that the connection portions of the overlapped solder belts are heated and melted, the surfaces of the upper and lower copper plates are wetted through the melted solder, the surfaces of the copper plates are uniformly laid, the connection portions become thinner under pressure of the upper copper plate and the lower copper plate, redundant solder forms flash, the flash is cut off, the upper copper plate and the lower copper plate are worn off, and then connection is achieved. Materials of connectors of the solder belts are uniform, strength of the materials of the connectors of the solder belts is the same as that of base metal, and connection requirements in the rolling process of the silver, copper and zinc belt-shaped solder can be met. Meanwhile, the special connection device for the method is simple in structure and convenient to operate.