Surface fitting device package lead connecting method

A wire bonding and wire bonding technology, applied in the field of new wire bonding, can solve problems such as misalignment, complicated manufacturing process, easy damage or cracking
CN1389908AInactive Publication Date: 2003-01-08SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Publication Date
2003-01-08
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.
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Description

technical field

[0001] The present invention relates to a wire bonding method for SMD packages, and in particular to a novel wire bonding method capable of correctly positioning the wires in the SMD package to completely avoid leakage. Background technique

[0002] Those skilled in the art know that chip-embedded packages are usually used to quickly and easily mount devices with special functions, such as surface acoustic wave (SAW) filters, on a substrate. A chip embedded in a chip-embedded package is electrically connected to a substrate through leads provided in the package. Chip-embedded packages are generally classified into pin-type packages or surface-mount device (SMD) packages, in which the leads of the pin-type package protrude from the package body and are soldered on the substrate, and the surface-mount device (SMD) package can be inserted into the substrate formed on the substrate. in the groove on the bottom.

[0003] Such an SMD package is generally classifi...

Claims

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