Solder bump forming method and apparatus

a technology of soldering method and forming method, which is applied in the direction of soldering apparatus, manufacturing tools,auxillary welding devices, etc., can solve the problems of increased production cost, prolonged adjustment operation of positioning time, and inability to use methods that have not been widely used, so as to eliminate the limitation on the type of target substrate and be easily separated
US20010010324A1Inactive Publication Date: 2001-08-02VEECO INSTR
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
VEECO INSTR
Publication Date
2001-08-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.
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Description

[0001] The present invention relates to a method of and an apparatus for forming a solder bump. More particularly, the invention relates to a method of and an apparatus for forming a minute solder bump having an appropriate size on a substrate or a chip.

[0002] The formation of extremely small solder bumps (balls) is a very important process in the production of many types of electronic devices, and is particularly important for flip-chip mounting of semiconductor chips on highly integrated cards and boards, chip carriers, etc. Therefore, various means for achieving such formation have been devised and utilized in the industry. Exemplary methods include a solder plating process and a solder powder bonding method. However, these methods have not come into widespread use, because the methods require large scale apparatus and suffer from limitations on the bump density and type of solders that can be used.

[0003] One method that imposes a less strict limitation on the solder type and ens...

Claims

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