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Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it

A technology of photosensitive resin and printed circuit board, which is applied in the field of photosensitive resin composition, and can solve problems such as many processes, no effective solution has been established, and low reliability of solder ball welding

Inactive Publication Date: 2004-05-26
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, we found that compared to conventional electroplating printed circuit boards, the mechanical strength is lower due to the phosphorus contained in the nickel plating layer, and the joint yield is not good, and the reliability of solder ball bonding is low. The problem
In addition, we also found that not only the reliability of solder ball bonding is low, but also the problem of many and complicated processes
[0004] In addition, in recent years, there has been a problem that mounted components such as CSP and BGA tend to fall off the substrate surface due to the bending and deformation caused by the impact of dropping or the strong pressing of input keys.
As a solution to this, there are considerations such as using a base material that can absorb the impact of dropping, etc., and working on an electroless plating method, but an effective solution has not yet been established.

Method used

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  • Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it
  • Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it
  • Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0085] Hereinafter, the present invention will be more specifically described by way of examples of the present invention and comparative examples thereof, but the present invention is not limited to these examples.

[0086] Synthesis of binder polymer

[0087] In the flask that is equipped with stirrer, reflux cooler, thermometer, dropping funnel and nitrogen inlet tube, add the ethylene glycol monomethyl ether of 700 grams to the mixed solution (hereinafter referred to as solution A) of 3: 2 for the weight ratio of toluene, while Blow in nitrogen gas and heat to 85°C while stirring. Add 110 grams of methacrylic acid, 225 grams of methyl methacrylate, 135 grams of ethyl acrylate, 30 grams of styrene, and 3 grams of azobisisobutyronitrile into the solution A at 85 °C for 4 hours. , and then kept stirring at 85°C for 2 hours. Then, 60 g of the solution A was taken, 0.3 g of azobisisobutyronitrile was dissolved therein, and the solution was dropped into the flask over 10 minut...

example 1

[0100] (a) With the material formulation shown in Table 1, the photosensitive resin composition solution of the present invention was obtained.

[0101] (b) On a polyethylene terephthalate film (hereinafter referred to as PET) of a size (380 mm in width x 20 microns in thickness), apply the solution of the photosensitive resin composition obtained in the previous process until it dries. The film thickness was 50 micrometers. Then, it was dried at 100° C. using a hot-air convection dryer, and a polyethylene film having a thickness of 35 μm was placed thereon, and coated with pressure with a roll to obtain the photosensitive element of the present invention.

example 2～12

[0103] A photosensitive member of the present invention was obtained as in Example 1 except that the composition formula shown in Table 1 was replaced.

[0104] In Table 1, the formulation of the photosensitive resin composition of Examples 1-12 is shown. In the table, the unit is parts by weight. Binder polymer is expressed by weight of non-volatile matter.

[0105] example 1

Example 2

Example 3

Example 4

Example 5

Example 6

Example 7

Example 8

Example 9

Example 10

Example 11

Example 12

binder polymer

60

60

60

60

60

60

60

60

60

60

60

60

bisphenol A polyethylene oxide

dimethacrylic acid

Esters (BPE-500)

-

-

-

-

-

20

-

-

-

20

-

-

bisphenol A polyethylene oxide

dimethacrylic acid

Esters (BPE...

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Abstract

An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.

Description

field of invention [0001] The present invention relates to a method for producing a printed circuit board and a photosensitive resin composition used therein. In particular, it relates to a method of manufacturing a printed circuit board capable of simplifying processes, improving connection reliability of mounting members, and improving yield, and a photosensitive resin composition used therein. Background technique [0002] Conventionally, in the field of manufacturing printed circuit boards, metal plating has been performed on circuits for the purpose of protecting circuits, reducing contact resistance, and the like. Moreover, with the popularization of portable electronic devices, as the form of the mounting components used, the chip size package (Chip Scale Package, hereinafter referred to as CSP) and ball grid array (Ball Grid Array, hereinafter referred to as BGA) that are conducive to miniaturization are rapidly increasing. Increase. In this type of mounting part, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24H05K3/28
CPCH05K2203/0571H05K2203/072H05K2203/0574H05K3/28H05K2203/0588H05K3/243G03F7/027
Inventor 赤堀聪彦沢边贤名取美智子青木知明梶原卓哉
Owner RESONAC CORPORATION
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