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Solder resist compound and cured product thereof

A technology of composition and solder resist, which is applied in the manufacture of instruments, electrical components, printed circuits, etc., can solve problems such as difficulty in suppressing warping, poor light transmission, and insufficient heat resistance of solder resist, achieving less curing shrinkage, Excellent plating effect

Active Publication Date: 2011-07-06
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, such a photosensitive resin composition with less curing shrinkage has a problem that the heat resistance required as a solder resist is insufficient.
However, black or white light transmission is not good, so in such a composition, the amount of light used for exposure needs to be increased, and the crosslinking of the surface layer of the coating film is more than that of the deep part, making it difficult to suppress warping

Method used

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  • Solder resist compound and cured product thereof
  • Solder resist compound and cured product thereof

Examples

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Embodiment

[0076] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, of course, this invention is not limited to a following example. In addition, the following "parts" mean "parts by mass" unless otherwise specified.

[0077]

[0078] The carboxyl group-containing photosensitive resin (A-1) of the present invention was produced according to the following synthesis examples 1 and 2, and the photosensitive resin (A-2) was produced according to the following synthesis example 3.

Synthetic example 1

[0080] Add 220 parts of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, softening point 92°C, epoxy equivalent 220), 13.4 parts of dimethylolpropionic acid, 65 parts of acrylic acid, 0.46 parts Methyl hydroquinone, 113 parts of carbitol acetate and 48.5 parts of solvent naphtha were heated to 90°C and stirred to dissolve the reaction mixture. Next, the reaction solution was cooled to 60°C, 1.4 parts of triphenylphosphine was added, heated to 100°C, and reacted for about 32 hours to obtain a reactant with an acid value of 0.5 mgKOH / g. Next, 36.5 parts of tetrahydrophthalic anhydride, 13.8 parts of carbitol acetate, and 6.0 parts of solvent naphtha were added thereto, heated to 95°C, reacted for about 6 hours, and cooled to obtain a solid with an acid value of 40 mgKOH / g, a carboxyl group-containing photosensitive resin with a non-volatile content of 65%. Hereinafter, this reaction solution is called varnish (A-1a).

Synthetic example 2

[0082] Add 220 parts (1 equivalent) of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, softening point 92°C, epoxy equivalent 220 ), add 218 parts of carbitol acetate, and heat to dissolve. Next, 0.46 parts of methylhydroquinone as a polymerization inhibitor, and 1.38 parts of triphenylphosphine as a reaction catalyst were added. The mixture was heated to 95-105° C., and 50.4 parts (0.7 equivalent) of acrylic acid and 41.5 parts (0.3 equivalent) of p-hydroxyphenethyl alcohol were slowly added dropwise to react for 16 hours. Cool the reaction product (hydroxyl: 1.3 equivalents) to 80-90°C, add 91.2 parts (0.6 equivalents) of tetrahydrophthalic anhydride, react for 8 hours, and after cooling, take out the reaction solution (called varnish (A-1b )).

[0083] The carboxyl group-containing photosensitive resin thus obtained had an acid value of 83 mgKOH / g of solid matter and a nonvolatile content of 65%.

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Abstract

The present invention provides a soldering inhibitor composition and condensate thereof, which has excellent developing performance, excellent resolving capability, excellent heat-resisting quantity and excellent resistance to plating needed by a pc board, a package substrate, a module base plate necessarily, and can provide a base plate with little curing shrinkage and no-warp. The soldering inhibitor composition is characterized in that: the solidified crosslink density computed by formula (1) being 2*10<3>-1.2*10<4>mol / m<3>, and glass transition temperature being more than 100 EDG C, n=E' min / 3 PhiRT(1).In the formula, n being crosslink density, E' min being minimum value of the storage elastic modulus E', Phi being modified coefficient approximate 1, R being gas constant, T being absolute temperature of E' min.

Description

technical field [0001] The present invention relates to a solder resist composition useful for producing printed wiring boards and module substrates, and a cured product thereof. More specifically, the present invention relates to a solder resist composition and a cured product thereof capable of suppressing warping of a substrate subjected to thinning while maintaining the performance required as a solder resist or a resist for module substrates. Background technique [0002] Due to the recent rapid development of semiconductor components, there is a tendency for electronic equipment to be smaller, lighter, more functional, and more functional, and accordingly, the density of printed circuit boards is being developed. In addition, the substrates used in such printed wiring boards, package substrates, and module substrates have increased to thin substrates. [0003] As a widely used solder resist composition, a photocurable and thermally curable liquid resist ink compositio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004H05K3/28G03F7/027
CPCC08F290/062C08G59/4292G03F7/0048G03F7/027G03F7/033G03F7/038G03F7/0388G03F7/105H05K3/287
Inventor 植田千穗山本修一
Owner TAIYO HLDG CO LTD
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