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The invention belongs to the technical field of photocuring, and relates to a nitrocarbazole (ketone) oxime ester compound, a product containing the same and application of the nitrocarbazole (ketone) oxime ester compound. Specifically, compared with existing and commercial photoinitiators, the structure of the compound provided by the invention has the advantage that the photosensitive property, especially the photosensitive property under long wavelength, of the compound is improved.

The present invention relates to a sulfonic acid derivative of naphthalimide and a photo-acid generator and photoresist composition each containing the sulfonic acid derivative of naphthalimide, more specifically, to a sulfonic acid derivative of naphthalimide compound and a photo-acid generator and photoresist composition each containing the sulfonic acid derivative of naphthalimide compound, wherein the sulfonic acid derivative of naphthalimide compound has excellent absorbency to light of i-line (365 nm) wavelength, is very easy to prepare a polymerizable composition due to having very high solubility in an organic solvent, and has excellent thermal stability, and exhibits a good acid yield.

Disclosed are a photosensitive resin composition, use thereof, a display device, and a semiconductor device. The photosensitive resin composition comprises: an alkali-soluble resin, a polymerizable monomer different from the alkali-soluble resin, and a photoinitiator comprising at least one oxime ester compound represented by Formula I. The oxime ester compound represented by Formula I has high thermal stability, good solubility in solvents commonly used for preparing photosensitive resin compositions, and can impart good film-forming properties, developability, and photosensitivity to the photosensitive resin composition. The photosensitive resin composition is suitable for use in preparing photo-cured materials such as a photoresist for semiconductors, a colored photoresist, a photo-spacer, etc. The definitions of the substituents in Formula I are as described in the specification and claims.[Formula I]

The application provides a thick film positive photoresist composition, a preparation method and application thereof. The thick film positive photoresist composition comprises 70-90 parts of a base resin, 10-30 parts of a photosensitive compound and 100-150 parts of a solvent A; the base resin comprises a benzophenone modified phenolic resin and optionally an unmodified phenolic resin; the mass percentage of benzophenone groups in the base resin is 0.8-7.5% based on 100% of the mass percentage of the base resin; the photosensitive compound comprises a non-benzophenone photosensitive compound and optionally a benzophenone compound; the mass percentage of the benzophenone compound is less than or equal to 3.0% based on 100% of the mass percentage of the photosensitive compound. The application improves the uniformity of the benzophenone structure in the thick film positive photoresist composition by designing the specific composition of the thick film positive photoresist composition, thereby improving the steepness of the photoresist and realizing the development of the pattern.