Printed wiring board and method for manufacturing same

A technology for printed circuit boards and wiring patterns, applied in printed circuit manufacturing, printed circuits, secondary processing of printed circuits, etc. properties, bleed-out suppression, and effects of improving plating resistance

Active Publication Date: 2012-12-05
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since siloxane diamine, which is a raw material of siloxane polyimide resin, contains cyclic dimethylsiloxane oligomers without amino groups as impurities, the siloxane polyimide resin produced in the When imide resin is used as an interlayer insulating film or cover film, etc. for electronic components, when electronic components are applied to heat treatment processes such as reflow soldering processes, cyclic dimethylsiloxane oligomerization occurs as outgassing Substances reattach or ooze out on the surface of the interlayer-interline insulating film or cover film, resulting in problems such as contact failure of electronic components, decreased conductivity, and decreased adhesive strength.

Method used

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  • Printed wiring board and method for manufacturing same
  • Printed wiring board and method for manufacturing same
  • Printed wiring board and method for manufacturing same

Examples

Experimental program
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Effect test

Embodiment

[0072] Hereinafter, the present invention will be specifically described by way of examples.

reference example 1

[0073] Reference Example 1 (Photosensitive Silicone Polyimide Resin Composition Containing a Crosslinking Agent)

[0074] (1) Manufacture of siloxane polyimide resin

[0075] In the reaction vessel of the polyimide resin synthesis device equipped with Dean-Stark (Dean-Stark), drop 862.65g (0.639mol) of diaminosiloxane (diaminodiphenyl / dimethyl Siloxane (amine equivalent: 675 g / mol, trade name: X-22-9409, manufactured by Shin-Etsu Chemical Co., Ltd.), 363.6 g (1.01 mol) of 3,3',4,4'-diphenylsulfone tetracarboxylate Acid dianhydride (リカシツドDSDA, manufactured by Nippon Physical and Chemical Co., Ltd., purity 99.6%), the triglyme of 547g and the toluene of 200g, the mixture was fully stirred for 2 hours. Then, the temperature was raised to 185° C., and kept at this temperature For 2 hours, the reaction solution was stirred under reflux while recovering water with a Dean-Stark.

[0076] The obtained reaction mixture was applied to a silicon wafer from which the oxide film had been...

reference example 2

[0080] Reference Example 2 (Photosensitive silicone polyimide resin composition without crosslinking agent)

[0081] Except liquid epoxy resin (jER807, Japan Epoxy Resin Co.), benzo Except for oxazine (BF-BXZ, Konishi Chemical Co., Ltd.) and resole phenolic resin (BRL-274, Showa Polymer Co., Ltd.), a siloxane polyimide resin was obtained in the same manner as in Reference Example 1, and a photosensitive silicone resin was obtained. Alkane polyimide resin composition.

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Abstract

A printed wiring board having excellent plating resistance, wherein bleed-out of a cyclic dimethylsiloxane oligomer from a protective layer which is composed of a photosensitive siloxane polyimide resin composition is sufficiently suppressed.  Specifically, a protective layer which is composed of a thermoset product of a photosensitive siloxane polyimide resin composition containing a siloxane polyimide resin, which is obtained by imidizing a tetracarboxylic acid dianhydride, a siloxane diamine having a diphenylsilylene unit and a diamine containing no siloxane, a crosslinking agent and a photoacid generator is formed on at least a part of a copper or copper alloy wiring pattern of a printed wiring board.  A certain amount of at least one substance selected from the group consisting of liquid epoxy resins, benzoxazines and resols is used as the crosslinking agent, and a certain amount of the photoacid generator is used as a sensitizer.  The surface of the copper or copper alloy wiring pattern of a printed wiring board has been subjected to a roughening treatment.

Description

technical field [0001] The present invention relates to a printed wiring board provided with a protective layer formed of a photosensitive siloxane polyimide resin composition, and a method for producing the same. Background technique [0002] Aromatic polyimide resins formed by imidization of aromatic tetracarboxylic acids and aromatic diamines are widely used as interlayer insulating films and However, such an aromatic polyimide resin also requires excellent flexibility and adhesiveness. For this reason, the use of siloxane polyimide resins in which a part of aromatic diamine is replaced with siloxane diamine and a siloxane skeleton is introduced into the polyimide skeleton has been increasing. [0003] However, since siloxane diamine, which is a raw material of siloxane polyimide resin, contains cyclic dimethylsiloxane oligomers without amino groups as impurities, the siloxane polyimide resin produced in the When imide resin is used as an interlayer insulating film or c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28C08L61/00C08L63/00C08L79/08H05K3/26H05K3/38
CPCC08L83/10H05K2201/0162C08G73/106C08L79/08H05K3/287H05K3/382C08G77/455H05K2201/0154
Inventor 须永友康金谷纮希野村麻美子石井淳一大森良男
Owner DEXERIALS CORP
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