Printed wiring board and method for manufacturing same

A technology for printed circuit boards and wiring patterns, applied in printed circuit manufacturing, printed circuits, secondary processing of printed circuits, etc. properties, bleed-out suppression, and effects of improving plating resistance
CN101940074BActive Publication Date: 2012-12-05DEXERIALS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DEXERIALS CORP
Publication Date
2012-12-05

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Abstract

A printed wiring board having excellent plating resistance, wherein bleed-out of a cyclic dimethylsiloxane oligomer from a protective layer which is composed of a photosensitive siloxane polyimide resin composition is sufficiently suppressed.  Specifically, a protective layer which is composed of a thermoset product of a photosensitive siloxane polyimide resin composition containing a siloxane polyimide resin, which is obtained by imidizing a tetracarboxylic acid dianhydride, a siloxane diamine having a diphenylsilylene unit and a diamine containing no siloxane, a crosslinking agent and a photoacid generator is formed on at least a part of a copper or copper alloy wiring pattern of a printed wiring board.  A certain amount of at least one substance selected from the group consisting of liquid epoxy resins, benzoxazines and resols is used as the crosslinking agent, and a certain amount of the photoacid generator is used as a sensitizer.  The surface of the copper or copper alloy wiring pattern of a printed wiring board has been subjected to a roughening treatment.
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Description

technical field

[0001] The present invention relates to a printed wiring board provided with a protective layer formed of a photosensitive siloxane polyimide resin composition, and a method for producing the same. Background technique

[0002] Aromatic polyimide resins formed by imidization of aromatic tetracarboxylic acids and aromatic diamines are widely used as interlayer insulating films and However, such an aromatic polyimide resin also requires excellent flexibility and adhesiveness. For this reason, the use of siloxane polyimide resins in which a part of aromatic diamine is replaced with siloxane diamine and a siloxane skeleton is introduced into the polyimide skeleton has been increasing.

[0003] However, since siloxane diamine, which is a raw material of siloxane polyimide resin, contains cyclic dimethylsiloxane oligomers without amino groups as impurities, the siloxane polyimide resin produced in the When imide resin is used as an interlayer insulating film or c...

Claims

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