Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photocurable and thermosetting resin composition, solder resist dry film prepared therefrom, and circuit board comprising said solder resist dry film

A resin composition, thermosetting technology, applied in photosensitive materials for optomechanical equipment, optomechanical equipment, optics, etc., can solve the problems of inability to fully display thermal radiation performance, difficult to adhere to electronic components, etc., and achieve excellent photocuring performance, improved heat radiation performance, reduced dimensional stability, and minimized distortion

Active Publication Date: 2018-09-25
LG CHEM LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after equipped with the heat dissipation plate, silicone rubber sheet, etc., it is difficult to adhere them firmly and tightly to the electronic components, and there is a limitation that the heat radiation performance cannot be fully exhibited

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photocurable and thermosetting resin composition, solder resist dry film prepared therefrom, and circuit board comprising said solder resist dry film
  • Photocurable and thermosetting resin composition, solder resist dry film prepared therefrom, and circuit board comprising said solder resist dry film
  • Photocurable and thermosetting resin composition, solder resist dry film prepared therefrom, and circuit board comprising said solder resist dry film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment and

[0172] Embodiment and comparative example: the preparation of resin composition, dry film and printed circuit board

Embodiment 1 and 2 and comparative Embodiment 1

[0174] A resin composition was prepared by mixing the components shown in Table 1 below. In this paper, a mixture of epoxy (meth)acrylate compounds derived from cresol novolac and epoxy (meth)acrylate compounds derived from bisphenol F in a weight ratio of 3:1 was used as the acid-modified low Polymer.

[0175] The resin composition prepared as above was applied on PET as a carrier film, and it was dried by an oven at 75° C., and then PE was laminated as a release film, thereby preparing a carrier film, a photosensitive film (thickness: 20μm) and a dry film composed of a release film.

[0176] After peeling off the cover film of the prepared dry film, the photosensitive film layer is vacuum laminated on the circuit-forming substrate, and a light shield corresponding to the circuit pattern is placed on the photosensitive film layer and exposed to ultraviolet light. Using ultraviolet light with a wavelength of 365nm at 350mJ / cm 2 exposure at the exposure level.

[0177] Ther...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a resin composition which is photocurable and thermosetting, and which comprises an acid-modified oligomer, a photo-polymerizable monomer, a thermosetting binder resin, a photoinitiator, at least two types of spherical alumina particles having mutually different particle sizes, and an organic solvent; a dry film solder resist obtained from the resin composition; and a circuit board comprising the dry film solder resist.

Description

technical field [0001] The invention relates to a photocurable and thermosetting resin composition, a dry film solder resist and a circuit board. Background technique [0002] Due to the miniaturization and weight reduction of various electronic devices, photosensitive protective films capable of forming minute opening patterns have been used in printed circuit boards (PCBs), semiconductor packaging substrates, flexible printed circuit boards (FPCBs), and the like. [0003] Protective films (also called solder resists) generally require developability, high resolution, insulation, resistance to soldering heat, resistance to gold plating, and the like. Specifically, solder resists for package substrates require, for example, crack resistance to a temperature cycle test (TCT) of 55° C. to 125° C. or between fine metal wires, in addition to the above properties. Highly accelerated stress test (highly accelerated stress test, HAST) performance. [0004] Recently, as a solder r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/032
CPCG03F7/038G03F7/0047G03F7/027G03F7/029G03F7/031
Inventor 崔炳柱郑遇载崔宝允李光珠郑珉寿具世真
Owner LG CHEM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com