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Carboxyl group-containing polyurethane and thermosetting resin composition using the same

A technology of resin composition and polyurethane resin, which is applied in the photoplate making process of patterned surface, instruments, optical mechanical equipment, etc., and can solve the problems of deterioration of plating resistance and solder heat resistance, high flexibility, and low long-term insulation performance

Inactive Publication Date: 2010-11-24
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when such a composition is adjusted to impart low warpage and high flexibility to a film formed from the resist ink composition, there is a problem that plating resistance and solder heat resistance deteriorate
In addition, the problem with the use of dibasic anhydrides is that the long-term insulation performance is low under high temperature and high humidity conditions.

Method used

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  • Carboxyl group-containing polyurethane and thermosetting resin composition using the same
  • Carboxyl group-containing polyurethane and thermosetting resin composition using the same
  • Carboxyl group-containing polyurethane and thermosetting resin composition using the same

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Abstract

The invention relates to a carboxyl group-containing polyurethane, which is obtained by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol having a molecular weight of 300 to 50,000, (c) a dihydroxy compound having a carboxyl group and when necessary (d) a monohydroxy compound, a thermosetting composition using the carboxyl group-containing polyurethane and a paste for forming a film using thermosetting composition . The thermosetting composition of the invention is excellent in adhesion to a substrate, low warpage, flexibility, plating resistance and soldering heat resistance.

Description

Carboxyl group-containing polyurethane and thermosetting resin composition using the same Cross References to Related Applications This application is filed pursuant to 35 U.S.C.Section 111(a), pursuant to 35 U.S.C.Section 119(e)(1), requiring US Provisional Application No. filed March 16, 2005 under 35 U.S.C.111(b) .661,902 and the benefit of US Provisional Application No. 662,389, filed March 17, 2005. technical field The present invention relates to a carboxyl group-containing polyurethane resin made of polycarbonate having a specific structure as a raw material, and a thermosetting resin composition prepared by mixing the carboxyl group-containing polyurethane resin with an epoxy resin, and also relates to a A film-forming paste in which a solvent and specific inorganic and / or organic fine particles are mixed in the thermosetting resin composition. The thermosetting resin composition according to the present invention can provide a thermosetting resin composition havi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/44C08G18/66C08G18/28G03F7/035
CPCC08G18/0823C08G18/3212C08G18/44C08G18/672C08G18/73C08G18/757C08G18/758C08G18/7621C08G18/7642C08G59/4269C08L63/00C08L75/16C08G18/6659C08L2666/22C08G18/28C08G18/66G03F7/035
Inventor 内田博木村和弥坂田优子
Owner RESONAC HOLDINGS CORPORATION
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