174results about How to "Low warpage" patented technology

The invention provides a light-sensitive polymer composition and condensate thereof, and a printed circuit board with solder resist and the like curing coating formed by the condensate, wherein the light-sensitive polymer composition can inhibit the generation of warping resulting from heating in the process of producing flexible substrates and processes thereafter, and component mounting process, further the invention has high light sensitivity even if adding small quantity of photo-polymerization initiator and the laser can directly exposure. The light-sensitive polymer composition contains: (A) carboxyl-containing resin, (B) proxetil photo-polymerization initiator, and (C)a compound which has more than two ethylenically unsaturated groups in the molecule; and the composition can develop through a dilute alkali water solution, wherein, the composition contains 0.1-1.5 weight parts of the proxetil photo-polymerization initiator (B) relative to 100 weight parts of the carboxyl-containing resin (A).

The invention provides a high conductivity polycarbonate (PC) composite material and a preparation method thereof. The polycarbonate composite material is prepared from the following components in parts by weight: 40-60 parts of PC resin, 10-30 parts of conductive master batch, 10-30 parts of reinforcing filler, 2-6 parts of toughening agent, 0.08-1.5 parts of first antioxidant and 0.05-3.0 partsof first lubricating agent, wherein the conductive master batch is prepared from the following components in parts by weight: 40-70 parts of thermoplastic resin, 30-50 parts of conductive filler, 0.1-0.6 part of second antioxidant and 0.5-2 parts of second lubricating agent. The PC composite material provided by the invention has very good electrical conductivity, and the volume resistivity of thePC composite material can reach 10<2> omega.m. Furthermore, the addition ratio of the conductive filler material is lower; when the adding amount of the conductive filler is about 10%, the volume resistivity can reach 10<4> omega.m or below, but the composite material can maintain good mechanical properties. In addition, the high conductivity PC composite material also has higher fluidity and lowwarping property, thus being suitable for performing injection molding on large-size workpieces.

Method for thermal spraying a metal stream onto a low heat resistant substrate using an adhesive/release promoted interface with the metal stream and the articles so produced for use in various applications.

The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.

A mobile telephone housing comprising a polyamide composition having excellent stiffness and toughness and low warpage.

The present invention relates to a foam body with a plurality of separate bubbles and/or a plurality of successive bubbles and a method for producing the foam body, in particular to a method for producing a foam body of micro bubbles in diameter equal to or smaller than 10 Mu m with expected thickness, shape, and foamy structure. The present invention provides a method for producing a foam body through the following procedures: an irradiation procedure: irradiate beams with active energy on a foam compound, wherein, the foam compound contains acid generator that can produce acid or alkali generator that can produce alkali under the beams with active energy, and a chemical compound that can react with acid or alkali and decompose and release decomposed functional groups of one or more low boiling point volatile matters; and, a foaming procedure: the foam compound generate foams under pressure control within the temperature range in which the low boiling point volatile matters are released.

An injection molded body includes a fiber reinforced thermoplastic resin composition formed by combining fibrous filler with thermoplastic resin so that the weight average fiber length in the injection molded body is 300 μm or more, and the injection molded body has a skin layer, a core layer and a skin layer in this order in the thickness direction. The thickness of the core layer, in which the primary orientation direction of the fibrous filler is 40° or less when the direction perpendicular to the flow direction of the resin composition at the time of injection molding is set at 0°, is 20% or less relatively to the thickness of the injection molded body.

The invention discloses an extension pin Fan-out Panel Level ball grid array (BGA) package part and manufacture process thereof. The package part is mainly composed of a chip, a plastic package material, an insulation layer, metal copper, nickel porpezite, a solder ball, a soldering disk, a second insulation layer, a reversely-bonded chip, secondary metal copper distribution wires and a third insulation layer. The manufacture process comprises the following steps of thinning a wafer, scratching a wafer, reversely bonding a chip, plastically packing, tearing a film, turning, carrying out primary insulation treatment, punching holes first time, distributing copper wires first time, carrying out secondary insulation treatment, punching holes second time, distributing copper wires second time, carrying out third insulation treatment, punching holes third time, plating nickel porpezite, printing, reflow soldering and cutting. The manufacture process solve the wire cross problem, saves cost and improve electric performance and reliability of products.

The present invention provides a thermosetting resin composition and the condensate thereof. The thermosetting resin composition is suitable for forming a flexible film which has excellent sealing property to substrate, excellent flexibility resistance, low warping, excellent heat resistance of solder, excellent chemical coating resistance and excellent chemical insulating property. The thermosetting resin composition comprises the following components: (A) carboxyl-containing polyurethane resin obtained from the compound which has isocyanate group which is not directly connected to aromatic nucleus, and (B) a thermosetting compound. The carboxyl-containing polyurethane resin is preferably a polyurethane resin which is obtained through the reaction of the following components: (a) a compound which has the isocyanate group which is not directly connected to aromatic nucleus, preferably aliphatic isocyanic ester compound or branched chain aliphatic isocyanic ester compound, (b) a compound which has more than two hydroxyl groups in one molecule, and (c) a compound which has one hydroxyl group and more than one phenolic hydroxyl group in one molecule.

The invention discloses a resin composition which is prepared from the following components (by weight based on solids): (a) 40-80 parts of benzoxazine structure-containing diamine modified bismaleimide resin; (b) 10-50 parts of epoxy resin; (c) 10-40 parts of active ester. As for the resin composition, through preferred pre-reaction of bismaleimide and benzoxazine-containing diamine resin at low temperature, benzoxazine almost does not perform ring-opening reaction at low temperature; by consuming a part of reactive groups through pre-reaction, a prepolymer with certain molecular weight is formed, steric hindrance of benzoxazine ring-opening reaction is improved, the reaction rate of a benzoxazine structure, which is in a resin structure, in a system is slowed down, a rheological reaction window of the resin composition is well regulated, and a risk that defects such as substrate white spots or white textures appear caused by too fast reaction of the resin composition in a pressing process is lowered.

There is provided a photosensitive thermosetting resin composition of an alkali development type from which it is possible to form a coating film that is halogen-free yet has high-level flame retardancy, has a superior low warpage property after it is cured, is excellent in plasticity, resolution, soldering heat resistance, chemical resistance, and the like, and a flexible printed circuit board using the same. There is provided a photosensitive thermosetting resin composition of an alkali development type and a flexible printed circuit board using the same, the photosensitive thermosetting resin composition including: (A) a resin component having a (meth)acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkali solution; (B) a phosphorus-containing epoxy thermosetting resin component; (C) a photopolymerization initiator; (D) an organophosphorus compound; and (E) a diluent, and having excellent performance in all the properties comparable to those of conventional photosensitive thermosetting resin compositions using brominated epoxy resin and a halogen-based flame retardant, and having an excellent property of not generating hydrogen bromide which has been a problem at the time of the combustion.

The invention provides a low-warpage high-impact-resistance long fiber-enhanced polypropylene composite material and a preparation method. A production raw material of the low-warpage high-impact-resistance long fiber-enhanced polypropylene composite material is prepared from the following components: 50 to 73 parts of polypropylene, 5 to 12 parts of a flexibilizer, 1 to 3 parts of a compatilizer,15 to 40 parts of glass fiber and 0.4 to 1.0 part of an antioxidant. A production method of the low-warpage high-impact-resistance long fiber-enhanced polypropylene composite material comprises the following steps: mixing all the components except the glass fiber, bracing and pelletizing the mixture to obtain a polypropylene resin semi-finished product, soaking the glass fiber into the melted polypropylene resin semi-finished product, and bracing and pelletizing the mixture to obtain the low-warpage high-impact-resistance long fiber-enhanced polypropylene composite material. The polypropylenecomposite material disclosed by the invention is relatively low in warpage performance, is also relatively high in low-temperature impact resistance and relatively good in mechanical property, and can be applied to a freezing environment.

A carboxyl group-containing polyurethane is capable of giving cured products excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. The carboxyl group-containing polyurethane includes a structure derived from a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule. The carboxyl group-containing polyurethane is produced by reacting: (A) a polyisocyanate compound; (B) a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule; and (C) a carboxyl group-containing dihydroxy compound (other than the compound (B)).

Disclosed is a thermosetting composition for a protective film for a wiring board, which has excellent low warpage properties, flexibility, and long-term insulation reliability. The thermosetting composition for a protective film for a wiring board comprises, as essential components, an epoxy group-containing compound having a tricyclodecane structure, polyurethane having a structural unit represented by formula (1) and having a functional group which can react with an epoxy group, and a solvent. In formula (1), R1 represents an alkylene group having 3 to 18 carbon atoms, and n represents an integer of 1 or more. As the epoxy group-containing compound having a tricyclodecane structure, a compound represented by formula (2) is preferably used.

The invention discloses a polycarbonate composition and a preparation method thereof. The polycarbonate composition comprises the following components in parts by weight: 75-86 parts of polycarbonate, 3-5 parts of filling material, 10-15 parts of glass fibers, 0.1-1 part of flame retardant, 0.5-3 parts of toughening agent, 0.1-0.5 part of main antioxidant, 0.1-0.5 part of auxiliary antioxidant, and 0.1-2 parts of other agents. The polycarbonate is modified under the coordination of the reinforcing material, the toughening agent and the processing aid, so that the polycarbonate composition has the advantages of good stability, high strength, warping resistance, good surface glossiness and excellent high-speed puncture impact resistance and toughness. Meanwhile, the polycarbonate composition has a good flame-retardant performance.