Photosensitive resin composition and curing article thereof

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition and printed circuit board, can solve the problems of large amount of exposure, time required for exposure, warpage, etc., and achieve excellent electrical insulation, low warpage, The effect of high sensitivity

Active Publication Date: 2009-04-08
TAIYO INK MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The warpage of these compositions after curing is sufficiently small. However, when they are actually used in flexible wiring boards, they have the following disadvantages: Warpage occurs due to post-heating caused by the reinforcement board lamination process and heating during component mounting.
[0008] Furthermore, in recent years, laser direct exposure for the purpose of improving positional alignment accuracy has attracted attention, but when using the conventional photosensitive resin composition as described above, there is a problem that a large amount of exposure is required and exposure takes time.

Method used

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  • Photosensitive resin composition and curing article thereof
  • Photosensitive resin composition and curing article thereof
  • Photosensitive resin composition and curing article thereof

Examples

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Embodiment

[0128] Hereinafter, the present invention will be specifically described by showing Examples and Comparative Examples, but the present invention is not limited to the following Examples. In addition, all the following "parts" and "%" are based on mass unless otherwise specified.

Synthetic example 1

[0130] (A-1) is equivalent to the aforementioned carboxyl-containing resin (3), using alicyclic diisocyanate, the synthesis of photosensitive carboxyl-containing polyurethane resin with bisphenol A structure: in a detachable flask, add 368.0g as RE310S (difunctional bisphenol A type epoxy resin, epoxy equivalent: 184g / equivalent) produced by Nippon Kayaku Co., Ltd. of bisphenol A type epoxy compound, 142.7g of acrylic acid (molecular weight: 72.06), 2.94g as heat 2,6-di-tert-butyl-p-cresol as a polymerization inhibitor and 1.53g of triphenylphosphine as a reaction catalyst are reacted at a temperature of 98°C until the acid value of the reaction solution is below 0.5mgKOH / g to obtain Epoxy carboxylate compound (a) (theoretical molecular weight: 510.7). Next, 588.2 g of carbitol acetate and 105.5 g of dimethylolpropionic acid (b) (molecular weight: 134.16) were added as a reaction solvent to this reaction liquid, and the temperature was raised to 45°C. To this solution, 264.7 ...

Synthetic example 2

[0132] (A-2) Corresponding to the aforementioned carboxyl-containing resin (3), the synthesis of photosensitive carboxyl-containing polyurethane resin with bisphenol F structure using alicyclic diisocyanate: drop 169 parts (0.5 moles) of bisphenol F type Epoxy resin (R110, manufactured by Mitsui Chemicals Co., Ltd., epoxy equivalent 169g / equivalent), 36 parts (0.5 mol) of acrylic acid, 74 parts (0.5 mol) of dimethylol butyric acid, 0.10 parts of methylol hydroquinone, 185 1 part of carbitol acetate, heated to 100°C, and after confirming that the above mixture was uniformly dissolved, 3.0 parts of triethylamine was added, heated to 110°C, and reacted for about 25 hours. Thereafter, the reactant was cooled to room temperature, and 152 parts (1.0 mol) of tetrahydrophthalic anhydride were added, heated to 100°C and reacted for about 5 hours to obtain anhydride-modified epoxy acrylate (d). Then, under the atmosphere of nitrogen gas flow, throw 832.5 parts (3.75 moles) of isophorone...

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Abstract

The invention provides a light-sensitive polymer composition and condensate thereof, and a printed circuit board with solder resist and the like curing coating formed by the condensate, wherein the light-sensitive polymer composition can inhibit the generation of warping resulting from heating in the process of producing flexible substrates and processes thereafter, and component mounting process, further the invention has high light sensitivity even if adding small quantity of photo-polymerization initiator and the laser can directly exposure. The light-sensitive polymer composition contains: (A) carboxyl-containing resin, (B) proxetil photo-polymerization initiator, and (C)a compound which has more than two ethylenically unsaturated groups in the molecule; and the composition can develop through a dilute alkali water solution, wherein, the composition contains 0.1-1.5 weight parts of the proxetil photo-polymerization initiator (B) relative to 100 weight parts of the carboxyl-containing resin (A).

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for forming flexible cured coating films such as solder resists and resin insulation layers for thin printed circuit boards, especially flexible circuit boards, which require low warpage, its cured product, and a photosensitive resin composition having It cures the laminated printed circuit board. Background technique [0002] Conventionally, for flexible circuit boards, an insulating film in which an adhesive is applied to a polyimide film called a coverlay is used. Thermal curing was carried out under pressure with a press, thereby producing a cover layer on the surface of the flexible substrate on which the circuit was formed. The cover film is composed of a polyimide film as a base and a low-shrinkage thermosetting resin as an adhesive layer, so that warping after lamination and pressure curing can be made very small, and the reinforcement of the reinforcement board there...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/004H05K1/00
CPCG03F7/004G03F7/0045G03F7/0047G03F7/027G03F7/028
Inventor 柴崎阳子有马圣夫米田一善
Owner TAIYO INK MFG CO LTD
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