Thermosetting composition for protective film for wiring board

A technology of protective film and wiring board, applied in the application of non-metallic protective layer, coating, printed circuit manufacturing, etc., can solve the problem of insufficient long-term reliability of electrical characteristics, difficulty in forming a uniform film, and softness of overcoating agent Can not meet the requirements of performance and other problems

Active Publication Date: 2012-05-23
NIPPON POLYTECH CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the current situation is that curable coating agents cannot meet the required performance in terms of flexibility and warpage caused by curing shrinkage.
[0004] For example, JP-A-11-61038 (Patent Document 1) discloses a resin composition using a polybutadiene-blocked isocyanate and a polyol. Although the cured product is excellent in flexibility and shrinkage, But the heat resistance is not enough
[0005] In Japanese Unexamined Patent Publication No. 2004-137370 (Patent Document 2), a composition comprising a polyamide-imide resin made of polycarbonate diol and an amine-type epoxy resin is disclosed. It is obtained by reacting two-terminal diisocyanate polyurethane obtained by reacting with a diisocyanate compound and trimellitic acid, but has the electrical characteristics of a cured product obtained by polyamide-imide resin and amine-type epoxy resin. The...

Method used

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  • Thermosetting composition for protective film for wiring board
  • Thermosetting composition for protective film for wiring board
  • Thermosetting composition for protective film for wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～3

[0493] As described in Table 1, thermosetting composition G1 to thermosetting composition G8, thermosetting composition H1 to thermosetting composition H4 were used to adhere to polyimide and tin-plated copper by the method described later. Performance evaluation, warpage evaluation and long-term electrical insulation reliability evaluation. The results are shown in Table 1.

[0494] Evaluation of adhesion between polyimide and tin-plated copper

[0495] A substrate and a polyimide film (capton (registered) after tinning has been implemented on a flexible copper-clad laminate (product name of Sumitomo Metal Mining Co., Ltd.; Esperflex copper thickness; 8 μm, polyimide thickness; 38 μm) Trademark) 300H, manufactured by Toray Dupon Co., Ltd.], apply the thermosetting composition G1 by screen printing method so that the thickness of the thermosetting composition is 15 μm (thickness after drying), and put it into a hot air circulation at 80°C Dryer for 30 minutes, and then put i...

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PUM

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Abstract

Disclosed is a thermosetting composition for a protective film for a wiring board, which has excellent low warpage properties, flexibility, and long-term insulation reliability. The thermosetting composition for a protective film for a wiring board comprises, as essential components, an epoxy group-containing compound having a tricyclodecane structure, polyurethane having a structural unit represented by formula (1) and having a functional group which can react with an epoxy group, and a solvent. In formula (1), R1 represents an alkylene group having 3 to 18 carbon atoms, and n represents an integer of 1 or more. As the epoxy group-containing compound having a tricyclodecane structure, a compound represented by formula (2) is preferably used.

Description

technical field [0001] The present invention relates to a new thermosetting composition for a protective film of a wiring board, a protective film of a wiring board obtained by curing the thermosetting composition for a protective film, a flexible wiring board covered with the protective film, and a flexible wiring board covered with the protective film. A method of manufacturing a flexible wiring board. More specifically, the present invention relates to a thermosetting composition for a protective film of a wiring board having low warpage, flexibility, and excellent long-term electrical insulation reliability, and a protective film for a wiring board obtained by curing the thermosetting composition for a protective film. , a flexible wiring board partially or entirely covered with the protective film, and a method for manufacturing the flexible wiring board covered with the protective film. Background technique [0002] Conventionally, the surface protective film of flexi...

Claims

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Application Information

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IPC IPC(8): C08G59/24C08G18/65C08G59/32C08G59/42H05K3/28
CPCC08G59/3218H05K3/285C08L79/08C09D175/06C08G18/44C08L63/00C08L2666/22C08G59/24C08K5/1515H05K3/28
Inventor 大贺一彦东律子大西美奈
Owner NIPPON POLYTECH CORP
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