This invention provides a high-reliability
halogen-free
solder paste flux, its preparation method, and its application, relating to the field of
soldering materials. The flux comprises a
solvent, a film-forming agent, an activator, a thixotropic agent, and functional additives. The film-forming agent is composed of polymeric
rosin, hydrogenated
rosin glycerol ester, and
trimellitic acid. Based on 100% of the total flux weight, the polymeric
rosin content is 18%–26%, the hydrogenated rosin
glycerol ester content is 10%–18%, and the
trimellitic acid content is 0.5%–2%. The preparation method includes: uniformly mixing the raw materials under vacuum conditions, heating, high-speed shear emulsification treatment, and cooling. The high-reliability
halogen-free
solder paste consists of flux and alloyed
tin powder, with the flux accounting for 9%–12% of the
solder paste's
mass. This invention ensures excellent
soldering performance while completely eliminating
halogen risks, significantly reducing post-
soldering residues, and improving surface
insulation resistance, meeting the stringent requirements of high-reliability electronic
assembly.