1results about How to "Antioxidant" patented technology

This invention relates to a method for preparing a copper surface protectant, comprising: adding pure water to a reaction vessel until the pure water accounts for 30% of the volume fraction of the reaction vessel, then sequentially adding a compound as shown in formula (I), acetic acid, a compound as shown in formula (II) or (III), a compound as shown in formula (IV), and a nano-directional dispersant, and adding pure water to the liquid level of the reaction vessel; stirring for 1 hour, allowing to stand for 1 hour, and filtering to obtain the copper surface protectant. The copper surface protectant of this invention can form a copper surface protective layer with resistance to alkali stripping and acid etching. This copper surface protective layer has the properties of resisting high temperatures (150°C, no discoloration of copper within 2 hours), no discoloration of copper after three reflow soldering cycles, oxidation resistance, and fluxing effect; furthermore, the surface tension of the copper surface protectant solution is 30 dyn / cm, which can perfectly cover micro-blind holes.