Flame-retardant curable resin composition, dry membrane, flame-retardant covering membrane, and printed circuit board

A technology of curable resin and printed circuit board, which is applied in the fields of flame retardant curable resin composition, dry film, flame retardant coating and printing, and can solve the problems of flame retardant leakage and poor alignment accuracy Good and difficult microfabrication, etc., to achieve the effect of less environmental load, excellent low warpage, and excellent flexibility

Active Publication Date: 2013-10-23
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since punching is performed by pressing, there are disadvantages in that it is difficult to perform microfabrication, and when laminating with a circuit board on which a circuit is formed, the positional alignment accuracy is not good.
[0006] In addition, as a resist composition not containing a halogen compound, for example, a composition containing a specific phosphorus element-containing acrylate and a carboxyl group-containing resin has been proposed, but there is room for improvement in flexibility (see Patent Document 3).
[0007] In addition, as a resist composition not containing a halogen compound, for example, a composition containing a phenoxyphosphazene oligomer and an epoxy acrylate has been proposed. , the flame retardant bleeds out and becomes a problem (refer to Patent Document 4)

Method used

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  • Flame-retardant curable resin composition, dry membrane, flame-retardant covering membrane, and printed circuit board
  • Flame-retardant curable resin composition, dry membrane, flame-retardant covering membrane, and printed circuit board
  • Flame-retardant curable resin composition, dry membrane, flame-retardant covering membrane, and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach ＞

[0045] The flame retardant curable resin composition of the present invention contains: (A) a phosphorus-containing dicarboxylic acid represented by the following general formula (1) and at least one of its anhydrides and an acrylate compound. Elemental acrylate resins;

[0046]

[0047] (where, R 1 and R 2 Each independently represents a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, m and n each independently represent an integer of 0 to 4, and the dotted line represents that two carboxyl groups can also form an acid anhydride. )

[0048] (B-1) having a compound selected from the group consisting of a bisphenol A structure, a bisphenol F structure, a biphenol structure, a biphenol novolak structure, a bixylenol structure, a biphenol novolac structure, and a carbamate structure. Carboxyl-containing resins with more than one partial structure;

[0049] (C) a thermosetting component; and

[0050] (D) Photopolymerization initiator.

[0051] By compound...

no. 2 approach ＞

[0153] The flame retardant curable resin composition of the present invention contains: (A) at least any one of the phosphorus element-containing dicarboxylic acid and its anhydride represented by the following general formula (1) reacted with an acrylate compound; Phosphorus acrylate resin;

[0154]

[0155] (where, R 1 and R 2 Each independently represents a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, m and n each independently represent an integer of 0 to 4, and the dotted line represents that two carboxyl groups can also form an acid anhydride. )

[0156] (B) carboxyl-containing resin;

[0157] (C-1) an epoxy resin having a biphenyl novolac structure; and

[0158] (D) Photopolymerization initiator.

[0159] By blending the above-mentioned (A) phosphorus element-containing acrylate resin and the above-mentioned (C-1) epoxy resin having a biphenyl novolac structure, it is possible to obtain a halogen-free composition with low environmental load, ...

Embodiment

[0302] (Synthesis of phosphorus-containing acrylate resin)

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Abstract

The invention provides a flame-retardant curable resin composition, a dry membrane, a flame-retardant covering membrane and a printed circuit board, specifically provides a flame-retardant curable resin composition, a dry membrane and a flame-retardant covering membrane which are free from halogen compositions, have little environmental loads, excellent flame resistance and excellent flexibility, and has no exudation of flame retardant during high-temperature pressing, and a printed circuit board having the flame-retardant covering film. The flame-retardant curable resin composition and the like contain (A) a phosphorus-containing acrylate resin which is obtained by reacting at least one of a phosphorus-containing dicarboxylic acid and an acid anhydride thereof with an acrylic ester, (B-1) a carboxyl-containing resin having partial structures selected from bisphenol A structure and the like, (C) a thermosetting composition and (D) a photo-polymerization initiator. In formula (1), R1 and R2 independently and respectively represent monovalent hydrocarbyl having a hydrogen atom number or a carbon atom number being 1 to 6; m and n respectively and independently represent integers being 0 to 4; the dotted line represents that two carboxyls can form an acid anhydride.

Description

technical field [0001] The present invention relates to a flame-retardant curable resin composition, a dry film, a flame-retardant coating, and a printed circuit board. A flame-retardant curable resin composition for a flame-retardant film without oozing out of a flame retardant when pressed, a dry film formed from the composition, and at least one of heat-curing and photo-curing the composition or the dry film The flame-retardant coating obtained by any one, and the printed wiring board provided with this flame-retardant coating. Background technique [0002] Conventionally, for flexible printed circuit boards (FPC), an insulating film coated with an adhesive is punched and laminated to a polyimide film called a cover layer, and then pressed under pressure Thermal curing is performed to form a cover layer on the surface of the flexible substrate on which the circuit is formed. Since the cover layer is made of a low-shrinkage thermosetting resin based on a polyimide film, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K1/02
CPCC08L33/04C08L43/02C08L63/04C08L101/08C08L2666/84G03F7/028H05K1/03
Inventor 米田一善横山裕有马圣夫
Owner TAIYO HLDG CO LTD
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