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Carboxyl group-containing polyurethane and thermosetting resin composition using the same

A technology of polyurethane resin and resin composition, which is applied in the direction of photo-engraving process, instruments, opto-mechanical equipment, etc. on the pattern surface, can solve the problems of high flexibility, low long-term insulation performance, deterioration of plating resistance and resistance to soldering heat, etc.

Inactive Publication Date: 2008-02-27
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when such a composition is adjusted to impart low warpage and high flexibility to a film formed from the resist ink composition, there is a problem that plating resistance and solder heat resistance deteriorate
In addition, the problem with the use of dibasic anhydrides is that the long-term insulation performance is low under high temperature and high humidity conditions.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] In a reaction vessel equipped with a stirrer, a thermometer and a condenser, 50.3 g (=0.050 mol) of polycarbonate diol UM-CARB100 (trade name; poly(1, 4-cyclohexanedimethanol carbonate); produced by Ube Industries, Ltd.), 14.8 g (=0.10 mol) of dimethylolbutanoic acid (Nippon Kasei Chemical Co., Ltd.), 105 g of propylene glycol methyl ether acetate (manufactured by Daicel Chemical Industries, Ltd.) as a solvent, and then the container was heated to dissolve the entire material at 90°C. The temperature of the obtained reaction solution was cooled to 70° C., and 34.0 g (=0.175 mol) of Takenate 600 (trade name; 1,4-cyclohexane dimethylene diisocyanate; Mitsui Takeda Chemicals, Inc.) as the polyisocyanate (a). After the dropwise addition was completed, reaction was carried out at 80° C. for 4 hours, and then, after confirming that almost all of the isocyanate had disappeared, 53 mg of Irganox 1010 (trade name; polymerization initiator; produced by Ciba Specialty Chemicals) wa...

Embodiment 2

[0090] In a reaction vessel equipped with a stirrer, a thermometer and a condenser, 167.7 g (=0.167 mol) of polycarbonate diol UM-CARB100 (trade name; poly(1, 4-cyclohexanedimethanol carbonate); produced by Ube Industries, Ltd.), 49.8 g (=0.336 mol) of dimethylolbutanoic acid (Nippon Kasei Chemical Co., Ltd.), 359 g of diethylene glycol ethyl ether acetate (manufactured by Daicel Chemical Industries, Ltd.) as a solvent, and then the container was heated to dissolve the entire material at 90°C. The temperature of the obtained reaction solution was cooled to 75° C., and 129.6 g (=0.583 mol) of Desmodur I (trade name; isophorone diisocyanate; manufactured by Sumika Bayer Urethane Co., Ltd.) was added dropwise within 5 minutes using a dropping funnel as polyisocyanate (a). After the dropwise addition was completed, reaction was carried out at 80° C. for 2 hours, and then, 12.7 g (0.171 mol) of isobutanol (manufactured by Tokyo Kasei Kogyo Co., Ltd.) as the monohydroxy compound (d...

Embodiment 3

[0093] In a reaction vessel equipped with a stirrer, a thermometer, and a condenser, 181.4 g (=0.200 mol) of polycarbonate diol UM-CARB90 (3 / 1) (trade name ; A copolymer comprising a diol component 1,4-cyclohexanedimethanol / 1,6-hexanediol in a ratio of 3 / 1; produced by Ube Industries, Ltd.), as the carboxyl group-containing dihydroxy compound (c) 59.3 g (=0.400 mol) of dimethylol butyric acid (manufactured by Nippon Kasei Chemical Co., Ltd.), 392 g of diethylene glycol ethyl ether acetate (manufactured by Daicel Chemical Industries, Ltd.) as a solvent, followed by The vessel was heated to dissolve all materials at 90°C. The temperature of the obtained reaction solution was cooled to 70° C., and 136.0 g (=0.700 mol) of Takenate 600 (trade name; 1,4-cyclohexane dimethylene diisocyanate; Mitsui Takeda Chemicals, Inc.) as the polyisocyanate (a). After the dropwise addition was completed, the reaction was performed at 80°C for 1 hour and at 85°C for another 1 hour. 15.2 g (0.205...

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Abstract

The present invention relates to a carboxyl group-containing polyurethane obtained by making (a) a polyisocyanate compound, (b) a polycarbonate diol having a molecular weight of 300 to 50,000, (c) a dihydroxy compound having a carboxyl group and, if necessary, (d) a monohydroxy group. Compounds are reacted to obtain a thermosetting composition using the carboxyl group-containing polyurethane, and a paste for forming a film using the thermosetting composition. The thermosetting compositions of the present invention have excellent substrate adhesion, low warpage, plating resistance and solder heat resistance.

Description

[0001] Cross References to Related Applications [0002] This application is filed pursuant to 35U.S.C.Section 111(a), pursuant to 35U.S.C.Section 119(e)(1), requiring the US Provisional Application No. 661,902 and the benefit of US Provisional Application No. 662,389, filed March 17, 2005. technical field [0003] The present invention relates to a carboxyl group-containing polyurethane resin made of polycarbonate having a specific structure as a raw material, and a thermosetting resin composition prepared by mixing the carboxyl group-containing polyurethane resin with an epoxy resin, and also relates to a A film-forming paste in which a solvent and specific inorganic and / or organic fine particles are mixed in the thermosetting resin composition. The thermosetting resin composition according to the present invention can provide a thermosetting resin composition having excellent substrate adhesion, low warpage, flexibility, plating resistance, and solder heat resistance, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/44C08G18/66C08G18/28G03F7/035
CPCC08G18/0823C08G18/3212C08G18/44C08G18/672C08G18/73C08G18/757C08G18/758C08G18/7621C08G18/7642C08G59/4269C08L63/00C08L75/16C08G18/6659C08L2666/22C08G18/28C08G18/66G03F7/035
Inventor 内田博木村和弥坂田优子
Owner SHOWA DENKO KK
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