Photosensitive resin composition, photocurable pattern and image display device

A technology for photosensitive resins and compositions, applied in the field of photosensitive resin compositions and photocured patterns formed therefrom, capable of solving the problems of reduced yield of mass-produced craft products, damage to resist patterns, poor adhesion, etc. Achieve the effects of excellent film retention rate, excellent sensitivity, and excellent substrate adhesion

Active Publication Date: 2022-05-06
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] If the coating film or pattern formed by the photosensitive resin composition has poor adhesion to the substrate, for example, when the resist film formed by coating the photosensitive resin composition is subjected to pattern exposure and developed, formation of The damage or peeling of the resist pattern, and the problem of pattern damage or peeling also occurs during etching, so that the product yield in the mass production process will decrease

Method used

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  • Photosensitive resin composition, photocurable pattern and image display device
  • Photosensitive resin composition, photocurable pattern and image display device
  • Photosensitive resin composition, photocurable pattern and image display device

Examples

Experimental program
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Effect test

manufacture example 1

[0090]

[0091] In a flask equipped with a stirrer, a thermometer reflux condenser, a dropping funnel, and a nitrogen gas introduction tube, 182 g of propylene glycol monomethyl ether acetate was introduced, and after the atmosphere in the flask was changed from air to nitrogen, the temperature was raised to 100° C., and then After 2 hours, 35.4 g (0.30 moles) of vinyl toluene, 36.0 g (0.50 moles) of acrylic acid, 59.6 g (0.2 moles) of 2-hydroxyl-o-phenylphenol propyl acrylate and propylene glycol monomethyl ether acetic acid A solution in which 3.6 g of azobisisobutyronitrile was added to a mixture of 136 g of ester was dropped into the flask from the dropping funnel, and stirring was continued at 100° C. for 5 hours. Next, the atmosphere in the flask was changed from nitrogen to air, and 22.5 g [0.15 mol (50 mol % with respect to the acrylic acid used in this reaction)] of glycidyl methacrylate, tridimethylaminomethane 0.9 g of phenol and 0.145 g of hydroquinone were reac...

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Abstract

The present invention provides a photosensitive resin composition, a photocurable pattern, and an image display device. More specifically, the photosensitive resin composition includes an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, and a solvent, and the photopolymerization initiator includes A compound with a specific structure, thereby showing excellent reactivity during low temperature curing, and the pattern produced from the above-mentioned photosensitive resin composition has excellent chemical resistance, heat resistance and other good durability, and has excellent substrate density. The resultant force and film retention rate are also excellent in sensitivity.

Description

technical field [0001] The invention relates to a photosensitive resin composition and a photocurable pattern formed therefrom. More specifically, it relates to a photosensitive resin composition containing a photopolymerization initiator, a photocured pattern formed from the photosensitive resin composition, and an image display device. Background technique [0002] In the display field, the photosensitive resin composition is used to form various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and column spacers. Specifically, the photosensitive resin composition can be selectively exposed and developed through a photolithography process to form a desired photocuring pattern. In order to improve the yield in the process and improve the physical properties of the application object in this process, it is necessary to have A highly sensitive photosensitive resin composition. [0003] The pattern formation of the photosensitiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/027G03F7/09
CPCG03F7/09G03F7/027G03F7/0045
Inventor 崔硕均曺伯铉
Owner DONGWOO FINE CHEM CO LTD
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