Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin film

Abstract

A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

Description

TECHNICAL FIELD[0001]The present invention relates to a thermosetting resin composition suitable for a semiconductor package and a printed wiring board, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.BACKGROUND ART[0002]Associated with further progress of miniaturization, weight saving and multifunctionality of electronic devices in recent years, integration of LSI and other chip devices proceeds, and the configurations thereof are rapidly changed to ones with an increased number of pins and a reduced size. Accordingly, a multilayer printed wiring board therefor is being developed to have a fine wiring structure for enhancing the mounting density of electronic parts.[0003]As a production method of a multilayer printed wiring board satisfying the demands, a build-up method has been known and is becoming a mainstream of the technique suitable for weight saving, miniaturization and fine structure.[0004]There is an...

AI Technical Summary

Benefits of technology

The present invention provides a thermosetting resin composition that has good curing properties, storage stability, and favorable chemical resistance, heat resistance, and adhesiveness. Additionally, the composition has low warping properties. The invention also provides prepreg, insulating film with support, laminate plate, and printed wiring board that contain the resin composition.

Problems solved by technology

An ordinary multilayer printed wiring board uses a bromine compound for achieving flame retardancy but has possibility of generating a harmful substance upon combustion, and therefore it is expected that the bromine compound may not be used in the near future.

For decreasing the thickness of the multilayer printed wiring board, however, an insulating resin layer containing no glass cloth has a tendency of having an increased thermal expansion coefficient, and the difference in thermal expansion coefficient from copper in a via hole being filled or having a stack largely affects the reliability of connection, which may be fears about reliability.

However, the method may cause various problems including decrease of the fluidity and decrease of the insulation reliability.

However, the increase of the crosslinking density requires shortening the molecular chain between the functional groups, and it is difficult to shorten the molecular chain beyond a certain length from the standpoint of the reactivity, the strength of the resin, and the like.

The epoxy resin is excellent in balance among the insulating property, the heat resistance, the cost and the like, but has a limitation in enhancing the heat resistance for addressing the demand of increased heat resistance associated with the high density mounting and the highly multilayered structure of the printed wiring board in recent years.

However, it has been known that the increase of the filled amount of the inorganic filler results in decrease of the insulation reliability, insufficient adhesion between the resin and the wiring layer, and failure on press molding due to moisture absorption.

A polybismaleimide resin, which has been widely used in a high density mounting and highly multilayered laminate plate, is excellent in heat resistance, but has high hygroscopicity and a problem on adhesion.

Furthermore, as compared to an epoxy resin, the polybismaleimide resin has a defect of low productivity since a high temperature and a prolonged period of time are required upon lamination.

However, the modified imide resin is obtained by modifying with a low molecular weight compound containing a hydroxyl group and an epoxy group for imparting solubility to a common solvent, such as methyl ethyl ketone, and thus the resulting modified imide resin is largely inferior in heat resistance as compared to the polybismaleimide resin.

In the phenol curing system and the aromatic amine curing system, an imidazole compound may be favorably used as a curing accelerator, but these are insufficient in reaction potential and are difficult to be stored for a prolonged period of time.

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