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Photosensitive siloxane polyimide resin composition

A technology of siloxane polyimide resin and siloxane diamine is applied in the field of inhibiting the exudation of cyclic dimethylsiloxane oligomers from the protective layer of printed wiring boards, and can solve the problem that the dimethicone cannot be sufficiently removed. Methylsiloxane oligomer and other problems, to achieve the effect of suppressing bleeding and good plating resistance

Active Publication Date: 2013-11-20
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the method of Patent Document 1, although a considerable amount of dimethylsiloxane oligomers below the hexamer can be removed because the volatilized solvent is discharged out of the system under normal pressure, there is a problem that the heptamer cannot be sufficiently removed. The problem with dimethylsiloxane oligomers above

Method used

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  • Photosensitive siloxane polyimide resin composition
  • Photosensitive siloxane polyimide resin composition
  • Photosensitive siloxane polyimide resin composition

Examples

Experimental program
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Effect test

Embodiment 1

[0055] (1) Preparation of siloxane polyimide resin

[0056] Drop into the diaminosiloxane (diaminodiphenyl / dimethylsiloxane) of 862.65g (0.639mol) in the reaction vessel of the polyimide resin synthetic device that has Dean-Stark trap (Amino equivalent: 675 g / mol), trade name: X-22-9409, manufactured by Shin-Etsu Chemical Co., Ltd.), 363.6 g (1.01 mol) of 3,3'4,4'-diphenylsulfone tetracarboxylic dianhydride (Rikasid DSDA, manufactured by Nippon Chemical Co., Ltd., purity 99.6%), 547 g of triglyme, and 200 g of toluene, and the mixture was fully stirred for 2 hours. Then, the temperature was raised to 185° C., and the temperature was maintained for 2 hours. While recovering water with a Dean-Stark trap, the reaction solution was refluxed and stirred.

[0057] The obtained reaction mixture was coated on a silicon wafer from which the oxide film was removed, dried at 100° C. for 10 minutes, and the terminal functional group was identified by the FT-IR transmission method. at 17...

Embodiment 2～9 and comparative example 6

[0078] In order to study the influence of the addition amount of a crosslinking agent, Examples 2-9 and Comparative Example 6 (example which did not use a crosslinking agent) were performed.

[0079] (1) Preparation of siloxane polyimide resin

[0080] A siloxane polyimide resin was prepared in the same manner as in Example 1.

[0081] (2) Preparation of photosensitive siloxane polyimide resin composition

[0082] In the varnish of silicone polyimide resin, add photosensitive agent (4NT-300, Toyo Gosei Kogyo Co., Ltd.) 10phr, defoamer (FA-600, Shin-Etsu Chemical Co., Ltd.) 0.5phr, metal deactivator (Rust preventive agent) (CDA-10, ADEKA Co., Ltd.) 0.3phr, liquid epoxy resin (jER807, Japan Epoch Resin Co., Ltd.), bisphenol F type benzo Oxyzine (BF-BXZ, manufactured by Konishi Chemical Industry Co., Ltd.) and / or a resole phenolic resin (BRL-274, manufactured by Showa High Molecular Co., Ltd.) were uniformly mixed at room temperature to obtain a photosensitive silicone polyimi...

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Abstract

The present invention aims to sufficiently suppress bleedout of a cyclic dimethylsiloxane oligomer, which is an impurity, from a thin protective layer which is obtained by forming, patterning and curing a film of a photosensitive siloxane polyimide resin composition on a printed wiring board.  For fulfilling the aim, the photosensitive siloxane polyimide resin composition contains: 100 parts by mass of a siloxane polyimide resin which is obtained by imidizing a tetracarboxylic acid dianhydride, a siloxane diamine having a diphenylsilylene unit and a diamine containing no siloxane; 1-20 parts by mass of at least one kind of crosslinking agent selected from the group consisting of liquid epoxy resins, benzoxazines and resols; and 5-30 parts by mass of a photoacid generator.

Description

technical field [0001] The present invention relates to a photosensitive siloxane polyimide resin composition, a printed wiring board having a protective layer formed from the composition, and a protective layer for suppressing the emission of cyclic dimethylsiloxane oligomers from a printed wiring board method of exudation. Background technique [0002] Aromatic polyimide resins made by imidizing aromatic tetracarboxylic acids and aromatic diamines are widely used as interlayer insulating films or material for the cover layer, but for this aromatic polyimide resin, excellent flexibility and adhesiveness are required. Therefore, the use of a siloxane polyimide resin obtained by substituting a part of the aromatic diamine with siloxane diamine and introducing a siloxane skeleton into the polyimide skeleton is increasing. [0003] However, since siloxane diamine, which is a raw material of siloxane polyimide resin, contains oily cyclic dimethylsiloxane oligomers having no am...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/075C08G73/10G03F7/004G03F7/023H05K3/28
CPCC08L83/10G03F7/0382G03F7/0387C08G73/106G03F7/0757H05K3/287C08L79/08C08G73/1064C08G73/1082C08G77/455
Inventor 须永友康野村麻美子金谷纮希石井淳一
Owner DEXERIALS CORP
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