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Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed substrate

A kind of photosensitive composition, photosensitive layer technology

Active Publication Date: 2016-08-10
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, when these flame retardants are used, there is a problem that the plating resistance decreases.

Method used

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  • Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed substrate
  • Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed substrate
  • Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed substrate

Examples

Experimental program
Comparison scheme
Effect test

example

[0259] Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited by these examples at all. In addition, "parts" in the examples means "parts by weight".

[0260] In addition, the acid value and weight average molecular weight in a preparation example were measured by the following method.

[0261]

[0262] The acid value is measured according to JIS K0070. However, when the sample does not dissolve, dioxane, tetrahydrofuran, or the like is used as a solvent.

[0263]

[0264] The weight average molecular weight is measured using a high-speed GPC apparatus (HLC-802A manufactured by Toyo Soda Co., Ltd.). That is, a 0.5 wt% THF (tetrahydrofuran) solution was used as the sample solution, one TSKgel HZM-M (trade name) was used in the column, 200 μL of the sample was injected, and the THF solution was used to elute the solution at 25. Measured with a refractive index detector at °C. Next, the w...

example 1

[0317] -Manufacture of photosensitive film-

[0318] A photosensitive composition solution containing the following composition was applied on a polyethylene terephthalate film (manufactured by Toray Industries, Ltd., 16FB50) with a thickness of 16 μm as a support, and dried on the support. A photosensitive layer with a thickness of 38 μm was formed. On the photosensitive layer, a 20 μm-thick polypropylene film (manufactured by Oji Special Paper Co., Ltd., ALPHAN E-200) was laminated as a protective layer to produce a photosensitive film.

[0319] -Composition of photosensitive composition solution-

[0320] · Flame retardant dispersion liquid a-3 of Preparation Example 9 ...... 27.06 parts by weight

[0321] · Pigment dispersion liquid of Preparation Example 11 ...... 4.26 parts by weight

[0322] ·The acid-modified ethylenically unsaturated group-containing polyurethane resin U1 solution of Preparation Example 1 (adjusted to a solid concentration of 40%) ……………………………… 6.6...

example 2～ example 3、 comparative example 1～ comparative example 5

[0382] In Example 1, except having replaced the flame retardant dispersion liquid with the flame retardant dispersion liquid described in Table 3, it carried out similarly to Example 1, and obtained the photosensitive composition, the photosensitive film, etc.

[0383] The same evaluation as in Example 1 was performed. The results are shown in Table 3.

[0384] [table 3]

[0385]

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PUM

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Abstract

A photosensitive composition comprising: a polyurethane resin containing an acid-modified ethylenically unsaturated group, which has a structural unit represented by general formula (G); a specific organic phosphoric acid metal salt having an average particle diameter of 1.0 µm or less; and a polymerizable compound. In general formula (G), R1 - R3 independently represent a hydrogen atom or a univalent organic group; A represents a bivalent organic group; X represents an oxygen atom, a sulfur atom or -N(R4)-; and R4 represents a hydrogen atom or a univalent organic group.

Description

technical field [0001] The present invention relates to a photosensitive composition suitable as a solder resist material for a flexible substrate, and a photosensitive film, a photosensitive laminate, a permanent pattern forming method, and a printed circuit board using the photosensitive composition. Background technique [0002] Conventionally, when forming a permanent pattern such as a solder resist, a photosensitive film in which a photosensitive layer was formed by applying a photosensitive composition on a support and drying was used. As a method of forming a permanent pattern such as a solder resist, for example, a method of forming a permanent pattern by laminating a photosensitive film on a substrate such as a copper clad laminate on which the permanent pattern is formed is known to form a laminate. , the photosensitive layer in the layered body is exposed, and after the exposure, the photosensitive layer is developed to form a pattern, and then a curing treatment ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027C08F290/06G03F7/004H05K3/28
CPCH05K3/287C08F290/067G03F7/027G03F7/038
Inventor 保田贵康矶部英美有冈大辅林利明
Owner FUJIFILM CORP
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