The invention discloses an HBC structure and a preparation method, and belongs to a preparation method in the technical field of batteries, and the technical scheme is as follows: carrying out alkali texturing treatment on the front and back surfaces of an N-type
silicon wafer; a plate-type ALD mode is adopted for deposition treatment; forming a
silicon nitride passivation layer structure on the aluminum
oxide passivation layer;
polishing treatment and deposition treatment; carrying out
silicon nitride film removal treatment, and cleaning the
laser damage layer after the film removal treatment; carrying out intrinsic silicon deposition treatment by adopting a CVD (
chemical vapor deposition) mode; cleaning the intrinsic silicon and the doped intrinsic silicon layer above the N-region
silicon nitride layer through an alkali washing tank; depositing intrinsic silicon and
phosphorus-doped intrinsic silicon; removing intrinsic silicon and
phosphorus-doped intrinsic silicon, removing the
mask layer structure by adopting an ink remover, and depositing a transparent
oxide layer TCO; tCO separation and
electrode preparation are carried out on the GAP area of the N-type silicon
wafer; according to the HBC structure and the preparation method provided by the invention, the conversion efficiency is improved,
chemical tank cleaning is omitted, the equipment cost is reduced, and the productivity is greatly improved.