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213results about How to "Avoid heat stress" patented technology

Dual-layer pipe wall composite-type gas pipeline and leakage monitoring method

InactiveCN102758973AQuickly calculate the location of the leakMeet the needs of long-distance transportationDetection of fluid at leakage pointPipe couplingsNitrogenCombustible gas
The invention relates to a dual-layer pipe wall composite-type gas pipeline and a leakage monitoring method for the pipeline, in order to mainly solve the problems that the gas pipeline operation safety in the high-hazard region is insufficient and the leakage point is difficult to confirm. The dual-layer pipe wall composite-type gas pipeline is characterized in that a clearance cavity is arranged between an inner pipe and an outer pipe; nitrogen displacement is carried out in the clearance cavity; the top of the outer wall of the outer pipe is provided with a plurality of vertical branch pipes communicated with the clearance cavity; the top ends of the vertical branch pipes are provided with concrete plates for sealing; the side wall of the outer pipe is communicated with a branch pipe which is bent downward; the tail end of the branch pipe is provided with a pressure blasting plate; the bottom surfaces of the concrete plates are provided with combustible gas probes which extend into the vertical branch pipes and are respectively connected to a combustible gas alarm and an industrial control computer in a remote monitoring room through a simulation signal wire and an RS485 data bus cable; and the industrial contro computer is used for calculating the position of pipeline leakage. The method can be used for determining the leakage point safely and rapidly.
Owner:NORTHEAST GASOLINEEUM UNIV

Tensile straightening device for on-line heating and straightening process of magnesium alloy extrusion

The invention discloses a stretching-straightening device for an online heating-straightening process of a magnesium alloy extrusion material, comprising a stretching-straightening device and a heating device. The stretching-straightening mechanism comprises a bracket, a stretching drive mechanism and a clamping drive mechanism. Double rails are arranged on the bracket. The rail is provided with a chuck I and a chuck II which are matched with the surfaces of the rails in a sliding manner. At least one chuck is capable of sliding forward and backward along the rail direction with the action ofthe stretching drive device. The chuck I and the chuck II are used for generating clamping forces via the clamping drive mechanism respectively. The heating device comprises a lifting mechanism and aheating mechanism. The heating mechanism comprises a positive clamping electrode, a negative clamping electrode and a transformer. The lifting mechanism is arranged under the double rails. The heating device of the stretching-straightening device is capable of guaranteeing that the extrusion material is expanded freely during heating without generating heat stress. The bending phenomenon caused by the heat stress and the instability phenomenon caused by the combined action of the heat stress and the self gravity are avoided via effective support during heating.
Owner:重庆昱华新材料科技有限公司

Mould melting-deposition forming and laser impact forging composite additive manufacturing method and device

The invention discloses a mould melting-deposition forming and laser impact forging composite additive manufacturing method. The mould melting-deposition forming and laser impact forging composite additive manufacturing method comprises the following steps that (1) a mould blank body is cast; (2) the melting-deposition forming thickness is calculated; (3) metal powder is subjected to melting deposition through a heat source to form cladding layers, a controller controls a laser generator to conduct impact forging on a melting-deposition metal area at the plastic deformation temperature synchronously, the cladding layers are stacked layer by layer till the thickness of the cladding layers reach the thickness value in the step (2), and thus a workpiece is formed; and (4) the surface of the workpiece is treated. The invention further provides a mould melting-deposition forming and laser impact forging composite additive manufacturing device. The method adopts melting-deposition forming and laser impact forging composite manufacturing, melting-deposition forming and impact forging are conducted simultaneously, parameters are mutually coordinated and restrained in the process, thus, thermal stress, deformation and cracking can be avoided, the microstructure of a metal part is optimized, internal defects of pores, non-fusion, shrinkage porosity and the like are avoided, and the forming quality and efficiency of additive manufacturing of a metal mould are improved.
Owner:GUANGDONG UNIV OF TECH

Animal cooling vest

InactiveUS20100050958A1Prevent heat stressReduce severityGrooming devicesDomestic animalMoisture
The present invention is a water-absorbent animal cooling vest made with an inner core of woven, hydrophilic/hydrophobic polymer embedded fabrics (PEF) enclosed inside two exterior (a wicking fabric inside to the body and a breathable fabric outside to the air) fabric shells attached to the animal by criss-crossing two double-ended, elastic and adjustable hook straps over the rear of the animal's neck, which straps are then attached to sewn-on loops on the upper and lower parts of the vest. The vest is soaked in approximately 3-16 ounces of water (depending on the size of the vest and the size of the animal for which is to be used) for 3-15 minutes (again depending on size of vest) before use, thus allowing the inner core to absorb the water. This process begins the vest's evaporative process. The internal core fibers of the vest absorb many times its weight in water. Excess water is wrung out of the vest prior to installation. The cooling evaporative process lasts for several hours based on ambient temperature, activity and level of exertion of the animal. The purpose of the vest is to promote absorption of moisture and body heat from the animal into the vest and enhance the natural evaporative cooling process to reduce body temperature and heat stress, which can lead to heat stroke, a significant cause of death for equines and other four-legged domestic animals. The animal cooling vest may be reactivated by simply re-immersing in water for a short period and reinstalling. The animal cooling vest may be machine washed and dried and is re-useable. Due to the flexible characteristics of the fabric materials comprising the vest and the method of strapping the vest to the animal, the vest shapes closely to the animal's body for maximum direct contact to the critical chest area of the body while allowing complete freedom of movement.
Owner:JACKSON SUSAN M +1

LTCC-based CGA integrated packaging structure and realization method thereof

The invention discloses an LTCC-based CGA integrated packaging structure and a realization method thereof. An LTCC technology and a CGA technology are combined, and a CGA array is manufactured on the bottom surface of an LTCC substrate by adopting a tool through a welding mode; the LTCC is used as an interconnecting substrate, a packaging body and a passive element integrated carrier of the module at the same time; and the whole region or a partial region on the substrate is welded with a metal surrounding frame, and airtight packaging in the metal surrounding frame region can be realized through parallel seam welding or laser melting seaming ways. The packaging structure is mainly used for the field of system integration as a packaging platform; by adoption of the CGA, high-reliability interconnection between the module and the exterior is realized, so that large module packaging dimensions can be realized; by adoption of the LTCC, integration of active devices and passive elements can be realized at the same time, so that system integrated density is greatly improved; by virtue of the high-precision welding of the metal surrounding frame, high packaging efficiency is realized; due to the position and shape changes of the metal surrounding frame, different applications of electromagnetic shielding, airtightness and the like can be realized; and in addition, the packaging structure has high fundamentality and expandability.
Owner:XIAN INSTITUE OF SPACE RADIO TECH

Method for testing nano-indentation of coating property

The invention discloses a method for testing a nano-indentation of a coating property. The method comprises the following specific steps of fixing a sample on a sample holder of a nano-indentation test system; regulating the temperature of the sample and a pressure head by using a temperature module, so that the sample and the pressure head are kept at a target temperature; applying and unloadinga load on the coating surface according to the set, and synchronously recording the depth of the indentation to obtain a load-depth curve; and calculating mechanical parameters of the coating based onthe load-depth curve. The temperature module enables the pressure head and the sample to reach the target temperature and maintain the target temperature and then an indentation test is carried out,so that the temperature of the sample, the pressure head and a contact point during the measurement process is ensured to be not changed, the load-depth curve of various temperature conditions can beobtained, and mechanical parameters of the coating at various temperatures can be calculated conveniently. Meanwhile, the problems of temperature gradient and thermal stress formed between the sampleand the pressure head are avoided, and the precision of the load-depth curve is effectively guaranteed.
Owner:CASIC DEFENSE TECH RES & TEST CENT

Novel packaging method of MEMS (Micro-electromechanical Systems) structure and processing circuit integrated system

The invention relates to a novel packaging method of an MEMS (Micro-electromechanical Systems) structure and a processing circuit integrated system. The method comprises the following steps: (1) preserving a plurality of circuit chip holding areas on each substrate unit of an MEMS wafer, and putting circuit chips on the MEMS wafer to form integration of the MEMS structure with a processing circuit; (2) utilizing a vertical intercoupling technique, using silicon as a cover plate in which a vertical through hole is formed, filling a conductive material into the through hole to form an input port and an output port of the structure; (3) forming a plurality of grooves in the binding surface of the cover plate for providing a vacuum airtight environment necessary for working of an MEMS device and a space required by the circuit, wherein an air sucking agent film inside the cover plate groove is used for maintaining the vacuum degree; (4) performing wafer binding on the cover plate and the MEMS wafer so as to achieve the wafer grade vacuum integrated packaging. The method is not only simple in process, wide in application range and remarkable in effect, but also can avoid thermal stress caused by the coefficient of thermal expansion, and can remarkably improve the temperature coefficient of a device.
Owner:BEIJING MXTRONICS CORP +1

MEMS wafer level vacuum package structure and manufacturing method thereof

The invention provides an MEMS wafer level vacuum package structure and a manufacturing method thereof. The package structure comprises a silicon cover plate and an MEMS wafer with a movable structure, wherein a vertical through hole is formed on the cover plate, the through hole is internally filled with a conductive material, a bonding surface of the cover plate is provided with a groove, a layer of getter film is arranged at the bottom of the groove, and the silicon cover plate and the MEMS wafer with the movable structure form the vacuum package structure by wafer bonding. The manufacturing method provided by the invention comprises the following steps: at first, manufacturing the through hole on the cover plate, and filling the conductive material in the hole; and then, forming the groove on the bonding surface, depositing a layer of getter film on the bottom of the groove, depositing a layer of multilayer metal film in a bonding area, and wafer bonding the cover plate with the MEMS wafer with the movable structure in a vacuum environment. According to the MEMS wafer level vacuum package structure provided by the invention, the groove with the getter and the through hole are formed on the silicon cover plate to export an electrode from the closed groove without carrying out wire bonding, so that the procedures are simple, meanwhile, the vacuum maintenance ability in the package structure is improved, contamination of granules to the movable structure during cutting is avoided, and performance of the device is guaranteed.
Owner:BEIJING MXTRONICS CORP +1

Welding method of super-thick steel casting

The invention discloses a welding method of a super-thick steel casting. Process steps include S1, preparing a joint: an asymmetric X-type groove is adopted; S2, preheating: the front side and the reverse side are uniformly heated, the preheating temperature is set within the range of 150-160 DEG C, and the heating rate does not exceed 100 DEG C / h; S3, back welding: gas shielded welding backingis carried out on flux-cored welding wires for three layers, and fire warming is carried out to remove stress after each weld seam is welded; S4, reverse side air gouging: air gouging back chipping and carburized layer removal are carried out; S5, reverse side back welding: back welding is carried out by three layers after the temperature of the steel casting reaches a preheating temperature according to the method described in the step 2, and fire warming is performed on each weld seam to remove stress; S6, filling and cover surface welding: the front side and the reverse side are welded respectively by one welder simultaneously and symmetrically, and hammering is carried out layer by layer after each layer of weld beads of each weld seam is welded; and S7, 550 DEG C *2h heat treatment after stress removal is carried out immediately after the completion of welding. By means of the method, welding stress and welding deformation can be significantly reduced, and the probability of generating steel casting welding cracks is greatly reduced.
Owner:CHINA MERCHANTS HEAVY IND JIANGSU

Ecological live pig raising house with microbial fermentation bed and large pen

ActiveCN103749317AReach the purpose of raising pigs in an environment-friendly mannerNo pollution in the processAnimal housingData informationSteel frame
The invention provides an ecological live pig raising house with a microbial fermentation bed and a large pen. The ecological live pig raising house is characterized in that the area of a pig house ranges from 1000 square meters to 2000 square meters, a wall is arranged on the periphery of the pig house in a surrounding manner, and the height of the wall ranges from 0.8m to 1.2m; a steel framed green house of the pig house is erected above the ground surrounded by the wall, shutter fabrics are respectively arranged on two sides of the long edges of the steel framed greenhouse, a wet curtain and a negative-pressure fan are respectively arranged on two sides of the short edges of the steel framed greenhouse, and spraying cooling devices are mounted on the outside of a roof; a sidewalk is arranged in the pig house along the wall on the periphery of the pig house, and the pen is arranged on the inner side of the sidewalk in a surrounded manner; fermentation bed packing, feeding troughs and a water trough are arranged in the pen, axial-flow fans and miniature spraying cooling systems are arranged at certain positions below the roof, and the distances from the certain positions to the roof range from 1.2m to 1.5m; the temperature and the humidity of the inside of the pig house can be automatically regulated according to data information of the brightness, the temperature, the moisture, the humidity, the air quantity and the amount of rainfall of an environment outside the pig house. The ecological live pig raising house has the advantages that the ecological live pig raising house is low in construction cost and suitable for ventilation cooling in summer, has a large raising space and an activity range and can be conveniently mechanically operated, and heat stress of pigs and fighting of individual pigs can be reduced.
Owner:福建省农业科学院农业生物资源研究所

Slotting-type freezing and solidifying grinding material polishing pad and preparation method thereof

InactiveCN102335888AImprove protectionFacilitate the development of new usesFlexible-parts wheelsGrinding devicesPolishingEngineering
The invention discloses a slotting-type freezing and solidifying grinding material polishing pad, which is characterized in that the center of one surface of a polishing pad, which is opposite to a processed workpiece, is provided with a blind hole (1); the periphery of the blind hole (1) is provided with a groove (2); the diameter d of the blind hole (1) is equal to e-r, wherein e in the formula is the eccentricity of the polishing pad, r is the radius of the polished workpiece, the value of the eccentricity is always 20-105mm, the depth of the blind hole (1) is 10-20mm, the depth of the groove (2) is 50-70% of the depth of the blind hole (1), and the width of the groove (2) is 5-10mm. In the slotting-type freezing and solidifying grinding material polishing pad, different types of grooves of different shapes are manufactured on the traditional freezing and solidifying grinding material polishing pad. Various groove shapes are formed mainly by the action of a slotting die. The polishing pad can be used for polishing and machining various thin workpieces, and is especially suitable for machining heat sensitive materials, soft materials, crystal materials and the like, has the advantages of low machining cost, high machining efficiency, strong technical control capability and the like, is simple to manufacture, is environmentally-friendly.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Laser and jet flow compound polishing method and device

The invention discloses a laser and jet flow compound polishing method and device. According to the method and the device, by regulating a focusing lens of a laser polishing module, a laser beam is converged to the surface of a to-be-machined workpiece to form a laser beam focal spot; a jet flow beam generated by conveying a polishing solution through a pressure supply pump, making the polishing solution flow through a nozzle and ejecting out the polishing solution through the nozzle impacts on the surface of the to-be-machined workpiece to form a jet flow beam impacting area; and by means ofa mechanical structure, it is ensured that the laser beam focal spot and the jet flow beam impacting area overlap, and therefore the relative positions of the jet flow beam impacting area, the laser beam focal spot and the to-be-machined workpiece are changed, and the compound polishing process of the surface of the to-be-machined workpiece is completed. By means of the method and the device, thebottleneck problems that in the conventional polishing technology, thermal stress and the machining efficiency are low are solved, the ultra-precision polishing efficiency is improved, and meanwhile the polishing quality is improved.
Owner:INST OF MACHINERY MFG TECH CHINA ACAD OF ENG PHYSICS
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