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Electronic packaging material

A technology of electronic packaging materials and carbon nanotubes, which is applied in the field of material science to achieve the effect of low material cost and excellent performance

Inactive Publication Date: 2006-11-08
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous development of aerospace, large-scale integrated circuits, military communications, etc., traditional single-substance electronic packaging materials can no longer meet the requirements of these fields

Method used

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Experimental program
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Effect test

Embodiment 1

[0018] Single-walled carbon nanotubes and nano-Al powders were prepared by semi-continuous hydrogen arc method and active hydrogen plasma evaporation method, and then the purified carbon tubes and nano-Al powders were dispersed and mixed in proportion by wet ultrasonic dispersion. Cold press forming, followed by vacuum hot pressing at 380°C, to prepare a block composite material sample with a carbon tube content of 2.5wt.% and a density greater than 95%. The thermal expansion coefficient of the composite material was tested at 20°C to 250°C to be 11×10 -6 / K~18×10 -6 / K.

Embodiment 2

[0020] Single-walled carbon nanotubes and nano-Al powders were prepared by semi-continuous hydrogen arc method and active hydrogen plasma evaporation method, and then the purified carbon tubes and nano-Al powders were dispersed and mixed in proportion by wet ultrasonic dispersion. Cold press forming, followed by vacuum heat treatment at 380°C, to prepare a block composite material sample with a carbon tube content of 5wt.% and a density greater than 95%. The thermal expansion coefficient of the composite material was tested at 20°C to 250°C to be 8×10 -6 / K~12×10 -6 / K.

Embodiment 3

[0022] Single-walled carbon nanotubes and nano-Al powders were prepared by semi-continuous hydrogen arc method and active hydrogen plasma evaporation method, and then the purified carbon tubes and nano-Al powders were dispersed and mixed in proportion by wet ultrasonic dispersion. After cold pressing and hot pressing at 380°C, a bulk composite material sample with a carbon tube content of 17.5 wt.% and a density greater than 95% was prepared. The thermal expansion coefficient of the composite material was tested at 20°C to 250°C to be 5×10 -6 / K~7×10 -6 / K.

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Abstract

The electronic packaging material is prepared with nanometer metal as base material and adding carbon nanotube in 0-35 vol%. The base material may be nanometer aluminum. The present invention has the advantages of the synchronous heat expansion with silicon semiconductor to avoid heat stress and heat crack between the silicon semiconductor and packing aluminum material, excellent packaging performance, low cost and wide application.

Description

Technical field: [0001] The invention relates to material science, and in particular provides an electronic packaging material. Background technique: [0002] The main functions of electronic packaging materials are mechanical support, sealing protection, heat dissipation of electronic components, etc. It is a material with low expansion and high thermal conductivity, and its performance requirements are: (1) It has high thermal conductivity and rapid heat dissipation to prevent the device from heating up and failing; (2) A certain thermal expansion coefficient, which is usually required to match the device Coefficient of thermal expansion (CTE) matches (mainly with Si and GaAs); (3) Certain mechanical properties. With the continuous development of aerospace, large-scale integrated circuits, military communications, etc., traditional single-substance electronic packaging materials can no longer meet the requirements of these fields. Composite materials, especially metal ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10H01L23/28
Inventor 丛洪涛唐永炳成会明
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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